My Inquiry
My Account
NXP Semiconductors MC33PF8100ERES
- Part No.:
- MC33PF8100ERES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8100ERES.pdf
- Description:
- IC POWER MANAGEMENT I.MX8QM
- Quantity:
- Payment:
- Shipping:
Inventory:1,740
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC33PF8100ERES from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed specifically for i.MX8QM processors with DDR4 memory, delivering seven high-efficiency buck converters (0.4–1.8 V, 2.5 A each), four 400 mA LDOs, RTC supply (1.8/3.0/3.3 V), coin cell charging, and ASIL B–compliant monitoring for infotainment and ADAS domain controllers.
For engineers reviewing the MC33PF8100ERES datasheet, MC33PF8100ERES pinout, MC33PF8100ERES application, or MC33PF8100ERES equivalent, this page delivers verified regulator accuracy (±1.5 % for SW1–SW6), OTP-configurable power sequencing, 3.4 MHz I²C interface, thermal shutdown at 150 °C, and HVQFN56 package details - all critical for automotive power architecture validation and safety-critical system integration.
Technical Context
The MC33PF8100ERES implements a deterministic state machine for fault-aware startup, power-down, and fail-safe transitions, with independent voltage monitors, ABIST diagnostics, and programmable watchdog timeout counters. Its dual-phase and triple-phase buck configurations (e.g., SW1–SW3 as 7.5 A triple-phase) support dynamic core scaling in i.MX8QM applications.
It integrates a 24-channel analog multiplexer for real-time system diagnostics, VTT termination on SW6 for DDR4 memory interfaces, and hardware/software-controllable LDO2 enable with load-switch capability - enabling precise rail control across CPU, GPU, LPDDR4, and peripheral subsystems without external sequencing logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 12 total: 7 buck (SW1–SW7) + 4 LDOs (LDO1–LDO4) + VSNVS RTC supply |
| Buck Output Range | SW1–SW6: 0.4–1.8 V (6.25 mV step); SW7: 1.0–4.1 V - supports CPU core, GPU, memory I/O, and auxiliary rails |
| Current Rating | 2.5 A per buck; 400 mA per LDO - sufficient for i.MX8QM DDR4 VDDQ/VTT and core domains |
| Accuracy | ±1.5 % for SW1–SW6; ±2 % for SW7; ±3 % for LDOs - ensures stable operation under load transients |
| I²C Interface | Up to 3.4 MHz - enables fast post-boot configuration and dynamic voltage scaling during runtime |
| Safety Compliance | ASIL B monitoring circuitry including independent voltage/thermal fault detection, ABIST, and fail-safe output (FSOB) |
| OTP Memory | One-time programmable storage for boot configuration - eliminates external resistors and reduces BOM count |
Pinout & Package
HVQFN56 package: 8 mm × 8 mm × 0.9 mm body, 0.5 mm pitch, wettable flank (dimple), thermally enhanced EPAD connected to ground.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable precise closed-loop regulation of each buck output voltage |
| SW1IN–SW7IN | Buck input supplies | Accept 2.7–5.5 V main input (VIN) or locally derived rails for distributed power architectures |
| SW1LX–SW7LX | Switching node outputs | Drive external high-side MOSFETs or integrated power stages; tolerate −3.0 V transient spikes |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Provide low-noise, fixed or programmable 1.5–5.0 V supplies for analog, I/O, and always-on domains |
| VSNVS | RTC backup supply | Delivers 1.8/3.0/3.3 V @ 10 mA from VIN or coin cell (LICELL) - maintains real-time clock during main power loss |
| SCL/SDA | I²C interface | Support high-speed (3.4 MHz) register access for runtime tuning, fault logging, and DVS coordination |
| FSOB | Fail-safe output | Open-drain signal asserting system-level safety state upon critical fault detection (ASIL B compliant) |
| RESETBMCU | MCU reset output | Open-drain active-low reset signal synchronized to PMIC power-up sequence and fault conditions |
Key Features
| Feature | Design Value |
|---|---|
| Dual/triple/quad-phase buck configuration | SW1–SW3 configurable as 7.5 A triple-phase regulator for high-current CPU cores - reduces ripple and improves efficiency |
| VTT termination mode on SW6 | Enables direct DDR4 memory VTT supply with matched impedance and tight voltage tolerance (±1 %) |
| 24-channel analog multiplexer (AMUX) | Allows software-selectable monitoring of internal voltages, temperatures, and external signals - simplifies board-level diagnostics |
| Programmable soft-start and power-down sequencing | Eliminates need for external timing components; ensures safe ramp-up/ramp-down of multi-rail processor systems |
| Coin cell charger with programmable current/voltage | Supports battery-backed RTC operation with configurable charge profile - extends system uptime during main power interruption |
| Independent voltage/thermal monitoring with ABIST | Detects overvoltage, undervoltage, overtemperature, and internal faults before system failure - meets ASIL B diagnostic coverage requirements |
Applications
| Automotive Infotainment Head Unit | i.MX8QM-Based ADAS Domain Controller |
|---|---|
Use Scenario: Centralized multimedia hub integrating navigation, voice recognition, and video rendering in vehicles. IC Role / Device Role / Timing Role: Primary PMIC supplying CPU cores, GPU, DDR4 memory, display interfaces, and audio codecs. Use Value: Enables single-chip power solution for i.MX8QM with DDR4, reducing layout complexity and meeting ASIL B monitoring requirements for functional safety. |
Use Scenario: Sensor fusion controller aggregating camera, radar, and ultrasonic data for automated driving functions. IC Role / Device Role / Timing Role: Power manager coordinating startup sequencing, thermal throttling, and fail-safe shutdown across compute and memory subsystems. Use Value: Provides deterministic power states and FSOB-driven fail-safe assertion during sensor or processing faults - critical for ISO 26262 compliance. |
| Industrial HMI with Secure Boot | Connected Vehicle Telematics Gateway |
Use Scenario: Rugged human-machine interface in factory automation requiring secure firmware updates and long-term reliability. IC Role / Device Role / Timing Role: Trusted power enabler with OTP-locked boot configuration and tamper-resistant I²C write protection. Use Value: Prevents unauthorized configuration changes via hardware-enforced OTP and CRC-protected register writes - enhances system integrity. |
Use Scenario: Cellular-connected gateway managing OTA updates, remote diagnostics, and vehicle-to-cloud communication. IC Role / Device Role / Timing Role: Dual-role PMIC powering both application processor and modem subsystems while maintaining RTC and secure boot rails. Use Value: Integrates VSNVS RTC with coin cell backup and isolated LDOs for modem sleep/wake cycles - extends battery life during cellular idle states. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200ETES | ASIL B–certified safety features (ABIST on demand, secure I²C, FSOB assertion logic) not present in MC33PF8100ERES | Required for full ISO 26262 ASIL B system certification; MC33PF8100ERES supports QM-level monitoring only | Select MC33PF8200ETES when functional safety certification is mandatory; MC33PF8100ERES suffices for QM-tier infotainment where cost and feature set are prioritized |
| MPQ4572GQ-AEC1 | Single 2.5 A buck converter (no multi-rail PMIC functionality); lacks OTP, I²C, LDOs, and safety monitoring | Only suitable as discrete replacement for one buck channel - cannot replace full MC33PF8100ERES functionality | Use MPQ4572GQ-AEC1 only for incremental buck rail replacement; not a system-level alternative to MC33PF8100ERES |
Compared with MC33PF8200ETES, MC33PF8100ERES offers identical power architecture and pin compatibility but omits certified ASIL B safety mechanisms, making it ideal for QM-tier automotive infotainment. Unlike MPQ4572GQ-AEC1, it provides full 12-channel integration, eliminating external sequencing and monitoring components.
Availability
MC33PF8100ERES is available at Aetrix Electronics and suitable for automotive infotainment head units, i.MX8QM-based ADAS domain controllers, and industrial HMIs requiring stable component supply, AEC-Q100 qualification, and long-term production continuity.
Supply support for MC33PF8100ERES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in application processor ecosystems.
The PF8100 product line was engineered as the reference PMIC for NXP's i.MX 8 series, targeting high-performance automotive computing platforms requiring integrated power, safety monitoring, and seamless processor interface.
FAQ
What is the primary target processor for MC33PF8100ERES?
The MC33PF8100ERES is specifically configured for the i.MX8QM processor with DDR4 memory (designated as "DDR4 memory PMIC1" in NXP's ordering table). It powers CPU cores, GPU, DDR4 VDD/VTT, and peripheral subsystems using its seven buck converters and four LDOs, with OTP settings optimized for that platform's power tree and sequencing requirements.
Does MC33PF8100ERES support ASIL B functional safety?
MC33PF8100ERES is qualified for QM (Quality Management) automotive applications and includes ASIL B–capable monitoring circuits (voltage, thermal, watchdog), but it lacks the certified safety mechanisms found in the PF8200 family - such as ABIST on demand, secure I²C, and fail-safe state transition logic. Therefore, MC33PF8100ERES itself is not ASIL B–certified.
What package type and thermal characteristics does MC33PF8100ERES use?
MC33PF8100ERES uses the HVQFN56 package (8 mm × 8 mm × 0.9 mm, 0.5 mm pitch, dimple wettable flank). Its thermal resistance is RθJA = 22 °C/W on an eight-layer board, RθJC = 0.6 °C/W to the case, and RθJB = 11 °C/W to the PCB - enabling reliable operation up to 105 °C ambient with proper layout and copper pour under the EPAD.
Can MC33PF8100ERES be used with i.MX8QXP processors?
No - MC33PF8100ERES is explicitly designated for i.MX8QM with DDR4 memory (as confirmed in Table 2 of the datasheet). For i.MX8QXP, NXP specifies variants like MC33PF8100CCES (LPDDR4) or MC33PF8100CFES (DDR3L); using MC33PF8100ERES with i.MX8QXP would require reconfiguration of OTP and may not meet voltage/sequencing requirements.
What is the role of the FSOB pin on MC33PF8100ERES?
The FSOB (Fail-Safe Output) pin on MC33PF8100ERES is an open-drain output that asserts LOW during critical faults (e.g., overtemperature, UVLO, or register corruption) to signal the host MCU or system supervisor. While MC33PF8100ERES implements FSOB functionality, it does not support the full ASIL B fail-safe state machine present in PF8200 devices.
MC33PF8100ERES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8100ERES FAQ
1.How can I place an order for MC33PF8100ERES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8100ERES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8100ERES reliable?
The price and inventory of MC33PF8100ERES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8100ERES is usually 5 days.
3.What payment methods are accepted for MC33PF8100ERES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8100ERES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8100ERES?
MC33PF8100ERES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8100ERES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8100ERES?
For technical support, including MC33PF8100ERES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8100ERES requirements.
6.How does Aetrix verify that MC33PF8100ERES is sourced from the original manufacturer or authorized distributors?
All MC33PF8100ERES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8100ERES meets industry standards.
7.What is the process for return or replacement of MC33PF8100ERES?
All MC33PF8100ERES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8100ERES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8100ERES part is unused and in its original packaging.
Return procedure for MC33PF8100ERES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC33PF8100ERES Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
