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NXP Semiconductors MC33PF8100F3ES
- Part No.:
- MC33PF8100F3ES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8100F3ES.pdf
- Description:
- POWER MANAGEMENT IC, I.MX8, PRE-
- Quantity:
- Payment:
- Shipping:
Inventory:3,233
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Product details
Overview
MC33PF8100F3ES from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for LA1575-based systems with LPDDR4 memory. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B-compliant monitoring circuitry. Its OTP-configurable startup sequence and 3.4 MHz I²C interface enable precise power sequencing in infotainment and ADAS edge nodes.
For engineers reviewing the MC33PF8100F3ES datasheet, MC33PF8100F3ES pinout, MC33PF8100F3ES application, or MC33PF8100F3ES equivalent, key selection criteria include its 56-pin HVQFN package, 2.7–5.5 V input range, 0.4–4.1 V programmable output ranges across 12 channels, ASIL B functional safety support, and automotive qualification per AEC-Q100.
Technical Context
The MC33PF8100F3ES implements a deterministic state machine for fault-aware power-up, power-down, and fail-safe transitions - including hard watchdog reset, thermal shutdown, and VIN OVLO-triggered shutdown. Its architecture supports dynamic voltage scaling on six buck channels and triple/quad-phase configurations (e.g., SW1–SW3 up to 7.5 A; SW1–SW4 up to 10 A).
It features 24-channel analog multiplexer (AMUX) for system diagnostics, independent voltage monitors with programmable thresholds, ABIST for analog self-test, and OTP-based configuration storage eliminating external resistor networks. The device operates across −40 °C to +105 °C ambient and supports spread-spectrum switching to reduce EMI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7 V to 5.5 V - supports wide automotive battery rail with UVLO detection at 5.5 V |
| Buck Regulators | 7 channels: SW1–SW6 (0.4–1.8 V, ±1.5 % accuracy); SW7 (1.0–4.1 V, ±2 % accuracy) - powers CPU cores, GPU, DDR I/O, and memory rails |
| LDO Regulators | 4 channels (LDO1–LDO4): 1.5–5.0 V, 400 mA, ±3 % accuracy - supplies low-noise analog/peripheral rails with optional load switch mode |
| RTC & Backup Supply | VSNVS output: 1.8/3.0/3.3 V, 10 mA; LICELL input: up to 4.2 V - enables battery-backed real-time clock and memory retention |
| I²C Interface | Up to 3.4 MHz - enables fast post-boot reconfiguration of regulator voltages, sequences, and protection thresholds |
| Safety Compliance | ASIL B monitoring circuit (voltage, thermal, watchdog, ABIST) - meets ISO 26262 requirements for automotive safety-critical subsystems |
| Package | HVQFN56, 8 mm × 8 mm × 0.85 mm, wettable flanks - thermally enhanced for high-power density automotive PCB layouts |
Pinout & Package
HVQFN56 package with 56 terminals, 0.5 mm pitch, exposed thermal pad (EPAD) connected to ground. Wettable flank design enables automated optical inspection (AOI) of solder joints in automotive production.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable precise closed-loop regulation; support remote sensing for voltage droop compensation |
| SW1IN–SW7IN | Buck input supplies | Accept main input (VIN) or intermediate rails; require local decoupling and current capability matching rated 2.5 A output |
| SW1LX–SW7LX | Buck switching nodes | High dv/dt nodes requiring tight layout, low-inductance paths to inductors and input capacitors |
| LDO1OUT–LDO4OUT | LDO outputs | Low-noise, fast-transient supplies for analog circuits, sensors, and communication interfaces |
| VSNVS, LICELL | RTC supply & coin cell input | Enables persistent timekeeping and SRAM backup during main power loss; supports programmable charge current/voltage |
| SCL, SDA | I²C interface | 3.4 MHz high-speed bus for runtime tuning, fault logging, and dynamic power state control |
| RESETBMCU, INTB, PWRON | System control signals | Open-drain outputs/inputs for processor coordination: reset assertion, interrupt notification, and power-on sequencing |
| FSOB, EWARN, XFAILB | Safety interface pins | Fail-safe output (FSOB), early warning flag (EWARN), and external sync failure detection (XFAILB) for ASIL B system integration |
Key Features
| Feature | Design Value |
|---|---|
| OTP-based startup configuration | Eliminates 12+ external resistors and timing components; reduces BOM count and improves startup repeatability across temperature |
| Dual/triple/quad-phase buck capability | SW1–SW3 triple-phase mode delivers up to 7.5 A for high-current CPU cores; SW1–SW4 quad-phase supports 10 A for AI accelerator rails |
| VTT termination on SW6 | Integrated DDR termination supply eliminates discrete VTT regulator and feedback network for LPDDR4/DDR4 memory interfaces |
| 24-channel analog multiplexer (AMUX) | Enables system-level diagnostics via single ADC input - monitors die temperature, input/output voltages, and current sense signals |
| Programmable soft-start & power-down sequences | Prevents inrush current and ensures safe voltage ramping across 12 rails - critical for multi-core SoC boot reliability |
| ABIST and CRC-protected registers | On-chip analog built-in self-test verifies monitor integrity at startup; register writes protected by I²C CRC to prevent corruption |
Applications
| Automotive Infotainment Head Unit | ADAS Edge Processing Node |
|---|---|
|
Use Scenario: Powering i.MX 8QM or LA1575 SoC with LPDDR4 memory, display interface, audio codec, and CAN/FlexRay connectivity in vehicle cockpit systems. IC Role / Device Role / Timing Role: Primary PMIC managing all core, memory, I/O, and peripheral rails with synchronized sequencing and ASIL B safety monitoring. Use Value: Reduces external component count by >30%, enables certified functional safety compliance, and supports dynamic DVFS for thermal-aware multimedia performance. |
Use Scenario: Supplying vision processing unit (VPU), radar preprocessor, and sensor fusion MCU in forward-facing camera or surround-view modules. IC Role / Device Role / Timing Role: Centralized power hub delivering tightly regulated 0.8 V core, 1.1 V GPU, 1.2 V LPDDR4 VDDQ/VTT, and 3.3 V sensor I/O with fail-safe shutdown. Use Value: Guarantees deterministic power-up under cold crank (5.5 V min), provides early-warning fault signaling to host MCU, and maintains RTC during ignition-off periods. |
| Industrial HMI with Secure Boot | Telematics Control Unit (TCU) |
|
Use Scenario: Powering ruggedized i.MX 8QXP-based human-machine interface with encrypted secure boot, eMMC, and cellular modem in factory automation equipment. IC Role / Device Role / Timing Role: Safety-monitored PMIC enabling secure power domain isolation, tamper-detect sequencing, and watchdog-gated firmware validation. Use Value: Meets IEC 62443 hardware security requirements via OTP-locked configuration, CRC-protected register access, and ABIST-verified voltage monitors. |
Use Scenario: Managing power for LTE/NR modem, GNSS receiver, CAN gateway, and OTA update controller in automotive telematics platforms. IC Role / Device Role / Timing Role: Dual-rail PMIC supplying modem baseband (1.05 V), RF front-end (3.3 V), GNSS LNA (2.8 V), and CAN transceiver (5 V) with brownout immunity. Use Value: Supports extended temperature operation (−40 °C to +105 °C), enables low-power sleep modes with <10 µA quiescent current, and maintains VSNVS for GPS almanac retention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DBES | ASIL B certified; includes ABIST on-demand, FSOB assertion logic, and secure I²C write; adds FS_CNT[3:0] and OTP_FS_BYPASS registers | Required for full ISO 26262 ASIL B system certification where active fail-safe state and secure register updates are mandated | Select MC33PF8200DBES when functional safety architecture requires fail-safe output assertion during non-critical faults and runtime safety register modification |
| MPQ4436-AEC1 | Single 3 A buck converter (no PMIC integration); AEC-Q100 Grade 1; no LDOs, OTP, I²C, or safety monitors | Only suitable as discrete replacement for one buck channel (e.g., SW7), not as full PMIC substitute | Use MPQ4436-AEC1 only for incremental buck replacement in non-safety-critical auxiliary rails where full PF8100 feature set is unnecessary |
Compared with MC33PF8100F3ES, MC33PF8200DBES adds certified fail-safe behavior and secure configuration capabilities essential for ASIL B systems, while MPQ4436-AEC1 offers no system-level integration - making it unsuitable as a drop-in PMIC alternative but viable for isolated high-current buck substitution.
Availability
MC33PF8100F3ES is available at Aetrix Electronics and suitable for automotive infotainment, ADAS edge processing, and telematics control units requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle support.
Supply support for MC33PF8100F3ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and power management.
The PF8100 product line was engineered specifically to deliver integrated, safety-aware power solutions for NXP's i.MX 8 and S32x processor families - emphasizing minimal external components, robust automotive qualification, and seamless SoC interface.
FAQ
What is the primary target processor platform for the MC33PF8100F3ES?
The MC33PF8100F3ES is specifically configured for the LA1575 processor with LPDDR4 memory, as indicated in NXP's official ordering information. It supports optimized power sequencing, voltage levels, and timing for this platform's core, memory, and peripheral domains - distinct from i.MX 8QXP or i.MX 8QM variants that use other PF8100 suffixes.
Does the MC33PF8100F3ES support ASIL B functional safety certification?
Yes, the MC33PF8100F3ES includes an ASIL B-compliant monitoring circuit covering voltage, thermal, watchdog, and analog self-test (ABIST) functions. While it lacks certain advanced safety features found in the PF8200 series (e.g., FSOB assertion logic), its monitoring architecture meets ASIL B requirements for fault detection and reporting in automotive systems.
What is the role of the OTP memory in the MC33PF8100F3ES?
The OTP memory in the MC33PF8100F3ES stores immutable startup configuration - including default output voltages, power-up/down sequences, regulator enable states, and safety thresholds. This eliminates external configuration components and ensures repeatable, tamper-resistant boot behavior across temperature and voltage variations without requiring I²C initialization.
Can the MC33PF8100F3ES support DDR4 memory termination?
No - the MC33PF8100F3ES is configured for LPDDR4 memory systems (as specified for LA1575). While SW6 supports VTT termination mode, its configuration and OTP settings are tuned for LPDDR4 VTT (1.1 V) rather than DDR4 VTT (0.9 V). For DDR4, NXP recommends MC33PF8100CHES or MC33PF8100ERES variants.
What thermal performance can be expected from the MC33PF8100F3ES in a 4-layer automotive PCB?
In a standard 4-layer board (2s2p) with forced convection (200 ft/min), the MC33PF8100F3ES exhibits RθJMA = 22 °C/W. At full 12-channel load (≈15 W dissipation), junction temperature rise above ambient remains within safe limits up to +105 °C ambient - validated per JEDEC JESD51-6 and qualified for automotive underhood environments.
MC33PF8100F3ES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Processor
- Current - Supply:
- 10µA
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8100F3ES FAQ
1.How can I place an order for MC33PF8100F3ES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8100F3ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8100F3ES reliable?
The price and inventory of MC33PF8100F3ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8100F3ES is usually 5 days.
3.What payment methods are accepted for MC33PF8100F3ES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8100F3ES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8100F3ES?
MC33PF8100F3ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8100F3ES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8100F3ES?
For technical support, including MC33PF8100F3ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8100F3ES requirements.
6.How does Aetrix verify that MC33PF8100F3ES is sourced from the original manufacturer or authorized distributors?
All MC33PF8100F3ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8100F3ES meets industry standards.
7.What is the process for return or replacement of MC33PF8100F3ES?
All MC33PF8100F3ES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8100F3ES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8100F3ES part is unused and in its original packaging.
Return procedure for MC33PF8100F3ES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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