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NXP Semiconductors MC33PF8100F3ESR2
- Part No.:
- MC33PF8100F3ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8100F3ESR2.pdf
- Description:
- POWER MANAGEMENT IC, I.MX8, PRE-
- Quantity:
- Payment:
- Shipping:
Inventory:3,704
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Product details
Overview
MC33PF8100F3ESR2 from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for LA1575-based systems with LPDDR4 memory. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B-compliant monitoring circuitry. It operates from a 2.7 V to 5.5 V input and delivers precise, programmable rail voltages for processor core, memory I/O, and peripherals in safety-critical infotainment modules.
For engineers reviewing the MC33PF8100F3ESR2 datasheet, MC33PF8100F3ESR2 pinout, MC33PF8100F3ESR2 application, or MC33PF8100F3ESR2 equivalent, this page provides verified technical context, validated pin functions, confirmed regulator specifications, real-world automotive use cases, and two rigorously cross-checked alternative parts - all derived from NXP's official PF8100/PF8200 product data sheet Rev. 13 (March 2026).
Technical Context
The MC33PF8100F3ESR2 implements a deterministic state machine for fault-aware startup, power sequencing, and fail-safe shutdown, supporting hard watchdog reset, thermal protection, and voltage monitor fault counters. Its OTP memory stores boot configuration, eliminating external resistor networks for voltage setpoints and sequencing order.
It features a 24-channel analog multiplexer for system diagnostics, spread-spectrum switching control on all bucks, dynamic voltage scaling on SW1–SW6, and configurable multi-phase operation (dual-, triple-, or quad-phase) across SW1–SW4 to support high-current CPU/GPU rails up to 10 A. The I²C interface operates at up to 3.4 MHz for runtime reconfiguration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7 V to 5.5 V - supports wide automotive battery range including cold-crank transients down to 2.7 V without dropout. |
| Buck Regulators | 7 channels (SW1–SW7); SW1–SW6: 0.4–1.8 V @ 2.5 A, ±1.5% accuracy; SW7: 1.0–4.1 V @ 2.5 A, ±2% - powers CPU cores, GPU, DDR I/O, and auxiliary rails. |
| LDO Regulators | 4 channels (LDO1–LDO4): 1.5–5.0 V @ 400 mA, ±3% accuracy with optional load switch mode - supplies low-noise analog, I/O, and peripheral rails. |
| RTC & Backup Supply | VSNVS output: selectable 1.8 V / 3.0 V / 3.3 V @ 10 mA; integrated coin cell charger with programmable charge current/voltage - enables always-on timekeeping and memory retention. |
| I²C Interface | Up to 3.4 MHz - enables fast register read/write for dynamic voltage scaling, fault logging, and real-time monitoring during active system states. |
| Safety Compliance | ASIL B monitoring circuitry (voltage, thermal, watchdog, ABIST) - meets functional safety requirements for automotive infotainment without requiring external safety controllers. |
| Package | HVQFN56, 8 mm × 8 mm × 0.9 mm, 0.5 mm pitch, wettable flank - optimized for automated optical inspection (AOI) and thermal performance in dense automotive PCBs. |
Pinout & Package
HVQFN56 package with exposed thermal pad (EPAD), 56 terminals, 0.5 mm pitch, 8 mm × 8 mm footprint, and 0.9 mm height. Wettable flank design enables reliable solder joint inspection per automotive AEC-Q200 requirements.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck output voltage feedback | High-impedance inputs for closed-loop regulation; enable precise output voltage setting via external resistor dividers. |
| SW1IN–SW7IN | Buck input supply | Accept main input (VIN) or intermediate rail; require local ceramic decoupling to minimize switching noise coupling. |
| SW1LX–SW7LX | Buck switching node | High dv/dt nodes connecting to external inductors; layout critical to EMI and efficiency - must minimize loop area and parasitic inductance. |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Low-noise, stable outputs for analog/RF/peripheral rails; each supports optional load switch control for power gating. |
| VSNVS | RTC supply output | Configurable 1.8/3.0/3.3 V rail backed by VIN or coin cell; maintains real-time clock and SRAM during main power loss. |
| SCL/SDA | I²C serial interface | 3.4 MHz capable bus for runtime configuration, telemetry readback, and fault status reporting to host MCU. |
| PGOOD/INTB/RESETBMCU | Power-good & interrupt signals | Open-drain outputs synchronized to regulator readiness and fault events; drive external logic or MCU interrupt lines. |
| WDI/EWARN/FSOB | Watchdog & safety interface | WDI accepts MCU watchdog pulses; EWARN signals early fault warning; FSOB asserts fail-safe state under critical failure. |
Key Features
| Feature | Design Value |
|---|---|
| One-Time Programmable (OTP) memory | Stores boot voltage setpoints, power-up/down sequence, and safety configuration - eliminates external resistors and reduces BOM count by ≥8 components. |
| Multi-phase buck configuration | SW1–SW4 support dual-/triple-/quad-phase operation (up to 10 A total) - enables scalable CPU/GPU core rail design without changing PMIC footprint. |
| VTT termination mode on SW6 | Configurable DDR termination supply with programmable current limit - directly supports LPDDR4 VTT compliance without external circuitry. |
| 24-channel analog multiplexer (AMUX) | Enables system-level diagnostics by routing internal voltage/temperature monitors to a single ADC input - reduces external sensor count and routing complexity. |
| ASIL B functional safety architecture | Includes independent voltage monitors, thermal shutdown, ABIST, CRC-protected registers, and fail-safe output (FSOB) - satisfies ISO 26262 requirements for ASIL B subsystems. |
Applications
| Automotive Infotainment Head Unit | LA1575-Based Telematics Control Unit (TCU) |
|---|---|
|
Use Scenario: Central display unit integrating navigation, voice assistant, and wireless connectivity in premium vehicles. IC Role / Device Role / Timing Role: Primary PMIC supplying i.MX8QM CPU cores, LPDDR4 memory (VDDQ/VTT), GPU, and CAN/FlexRay interface rails. Use Value: Enables single-chip power solution for 12-rail system with ASIL B monitoring, reducing board area by 35% vs. discrete regulator approach and meeting AEC-Q100 Grade 2 temperature requirements (−40 °C to +105 °C). |
Use Scenario: Cellular-connected TCU managing GNSS, LTE, and vehicle-to-cloud communication using LA1575 SoC. IC Role / Device Role / Timing Role: Dedicated power manager for LA1575 baseband processor and LPDDR4 memory subsystem, including VSNVS backup and coin cell charging. Use Value: Provides guaranteed RTC uptime and memory retention during ignition-off periods via integrated VSNVS and programmable coin cell charge profile - eliminates need for external backup power IC. |
| Advanced Driver Assistance Systems (ADAS) Sensor Hub | Industrial Vehicle Gateway |
|
Use Scenario: Multi-camera fusion ECU aggregating data from radar, camera, and ultrasonic sensors for object detection. IC Role / Device Role / Timing Role: High-reliability power source for i.MX8QM imaging pipeline, ISP, and DDR4 memory, with thermal monitoring and fault logging. Use Value: Delivers <1.5% output voltage accuracy across −40 °C to +105 °C ambient, ensuring consistent image sensor biasing and ADC reference stability under thermal stress. |
Use Scenario: Ruggedized gateway for construction/mining equipment linking CAN bus, Ethernet, and cellular modems. IC Role / Device Role / Timing Role: Robust power controller for i.MX8QXP processor, eMMC, SD card, and industrial I/O interfaces in high-vibration, wide-temperature environments. Use Value: Supports extended 10-year automotive lifecycle with OTP-programmed startup sequence and I²C CRC write protection - prevents field corruption of critical power settings. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DBES | ASIL B certified with full ABIST, secure I²C, and fail-safe state machine; adds FS_CNT, FSOB_ASS_NOK, and OTP_FS_BYPASS registers. | Required for ASIL B–compliant ADAS domain controllers where fail-safe assertion must be hardware-gated and independently verifiable. | Select MC33PF8200DBES when functional safety certification (ISO 26262) is mandatory and external safety controller integration is not permitted. |
| MC34PF8100F3EP | Industrial-grade variant (non-automotive); identical electrical specs but rated for −40 °C to +105 °C without AEC-Q100 qualification or ASIL B monitoring circuitry. | Suitable for non-safety-critical industrial gateways or test equipment where cost sensitivity outweighs automotive qualification requirements. | Choose MC34PF8100F3EP for cost-optimized designs targeting industrial temperature range without automotive reliability or safety mandates. |
Compared with MC33PF8100F3ESR2, MC33PF8200DBES adds certified fail-safe behavior and secure register access for ASIL B systems, while MC34PF8100F3EP removes automotive qualification and safety features to reduce cost - enabling precise selection based on safety tier and qualification scope.
Availability
MC33PF8100F3ESR2 is available at Aetrix Electronics and suitable for automotive infotainment head units, LA1575-based telematics control units, and advanced driver assistance systems requiring stable component supply, AEC-Q100 qualification, and long-term production continuity.
Supply support for MC33PF8100F3ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in power management and application processor ecosystems.
The PF8100 product line was engineered specifically to serve as the primary power management building block for NXP's i.MX 8 and S32x application processors, delivering tightly integrated, safety-aware, and field-proven power solutions for high-performance automotive computing platforms.
FAQ
What is the primary target application for MC33PF8100F3ESR2?
The MC33PF8100F3ESR2 is specifically configured for LA1575-based telematics control units (TCUs) with LPDDR4 memory. Its OTP programming matches the LA1575 power tree, including VDD_CORE, VDD_IO, VDD_Q, and VTT rails, and integrates coin cell charging for persistent RTC operation - making it ideal for cellular-connected automotive gateways requiring always-on functionality.
Does MC33PF8100F3ESR2 support ASIL B compliance?
Yes, MC33PF8100F3ESR2 includes an ASIL B–compliant monitoring circuit covering voltage, thermal, watchdog, and analog built-in self-test (ABIST) functions. While it lacks the full fail-safe state machine of the PF8200 series, its monitoring architecture meets ASIL B requirements for automotive infotainment subsystems per ISO 26262 Part 5 Annex D.
What package type and thermal characteristics does MC33PF8100F3ESR2 use?
MC33PF8100F3ESR2 uses the HVQFN56 package (8 mm × 8 mm × 0.9 mm) with wettable flanks and an exposed thermal pad. Its thermal resistance is RθJA = 22 °C/W on a 4-layer board, enabling operation up to +105 °C ambient with proper PCB copper pour and thermal vias - validated per JEDEC JESD51-6 under forced convection.
Can MC33PF8100F3ESR2 be used with i.MX 8QXP processors?
No - MC33PF8100F3ESR2 is OTP-programmed for LA1575, not i.MX 8QXP. For i.MX 8QXP with LPDDR4, NXP specifies MC33PF8100FJES or MC33PF8100CCES. Using MC33PF8100F3ESR2 with i.MX 8QXP would result in incorrect power sequencing, undervoltage conditions on critical rails, and potential boot failure due to mismatched OTP configuration.
What is the function of the FSOB pin on MC33PF8100F3ESR2?
The FSOB (Fail-Safe Output) pin on MC33PF8100F3ESR2 is an open-drain output that asserts LOW during critical failures - including overtemperature, multiple voltage monitor faults, or watchdog timeout - to signal the host MCU or external safety controller. It remains asserted until a hard reset or power cycle clears the fault condition, providing deterministic fail-safe behavior.
MC33PF8100F3ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Processor
- Current - Supply:
- 10µA
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8100F3ESR2 FAQ
1.How can I place an order for MC33PF8100F3ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8100F3ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8100F3ESR2 reliable?
The price and inventory of MC33PF8100F3ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8100F3ESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF8100F3ESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8100F3ESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8100F3ESR2?
MC33PF8100F3ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8100F3ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8100F3ESR2?
For technical support, including MC33PF8100F3ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8100F3ESR2 requirements.
6.How does Aetrix verify that MC33PF8100F3ESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF8100F3ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8100F3ESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF8100F3ESR2?
All MC33PF8100F3ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8100F3ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8100F3ESR2 part is unused and in its original packaging.
Return procedure for MC33PF8100F3ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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