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NXP Semiconductors MC33PF8100FJES
- Part No.:
- MC33PF8100FJES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8100FJES.pdf
- Description:
- POWER MANAGEMENT IC, I.MX8, PRE-
- Quantity:
- Payment:
- Shipping:
Inventory:210
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Product details
Overview
MC33PF8100FJES from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed specifically for i.MX8QXP processors with LPDDR4 memory. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B-compliant monitoring circuitry. Its OTP-configurable startup sequence and 3.4 MHz I²C interface enable precise power sequencing in infotainment and ADAS systems.
For engineers reviewing the MC33PF8100FJES datasheet, MC33PF8100FJES pinout, MC33PF8100FJES application, or MC33PF8100FJES equivalent, this page delivers verified technical context, validated pin functions, confirmed automotive safety compliance (QM grade), exact regulator voltage ranges and current ratings, and real-world use cases tied to i.MX8QXP + LPDDR4 platforms - all derived from NXP's official PF8100/PF8200 product data sheet Rev. 13.
Technical Context
The MC33PF8100FJES implements a deterministic state machine for fault-aware power-up, shutdown, and fail-safe transitions, with programmable soft-start/soft-stop sequences stored in OTP memory. Its dual-phase and triple-phase buck configurations (e.g., SW1/SW2 as dual-phase, SW1/SW2/SW3 as triple-phase up to 7.5 A) support dynamic voltage scaling for CPU/GPU cores and memory rails.
It features 24-channel analog multiplexing for system-level diagnostics, independent voltage monitors per regulator with programmable thresholds, thermal shutdown at 150 °C, and hardware-based watchdog supervision with external reset assertion (RESETBMCU) and early warning (EWARN). The device operates across −40 °C to +105 °C ambient and supports forced-air cooling via low RθJA (22 °C/W on 4-layer board).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VIN Range | 2.7 V to 5.5 V input - powers all internal regulators; UVLO threshold at 2.7 V ensures reliable startup under automotive battery transients. |
| Buck Output Range (SW1–SW6) | 0.4 V to 1.8 V in 6.25 mV steps - matches core voltage requirements of i.MX8QXP CPU, GPU, and LPDDR4 I/O rails. |
| Buck Output Range (SW7) | 1.0 V to 4.1 V - supplies auxiliary rails such as PCIe, USB PHY, or camera sensors requiring higher voltage. |
| LDO Output Range (LDO1–LDO4) | 1.5 V to 5.0 V, ±3% accuracy - provides stable bias for analog peripherals, SerDes, or interface logic with optional load-switch mode. |
| VSNVS Output | 1.8 V / 3.0 V / 3.3 V, 10 mA - powers secure non-volatile storage and real-time clock during system standby using main supply or coin cell. |
| I²C Interface Speed | Up to 3.4 MHz - enables rapid runtime reconfiguration of voltage levels, sequencing, and protection thresholds without interrupting system operation. |
| Package | HVQFN56, 8 mm × 8 mm × 0.85 mm, wettable flanks - thermally enhanced for automotive under-hood applications; EPAD grounded for optimal thermal dissipation. |
Pinout & Package
HVQFN56 package with 0.5 mm pitch, 8 mm × 8 mm body, and exposed thermal pad (EPAD) connected to ground. Wettable flank design supports automated optical inspection (AOI) for automotive-grade solder joint reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable closed-loop regulation of each buck output; support external resistor dividers for precise voltage setting. |
| SW1IN–SW7IN | Buck input supplies | Accept VIN or intermediate rail inputs; require local ceramic decoupling to suppress switching noise. |
| SW1LX–SW7LX | Buck switching nodes | Connect to external inductors; tolerate −3.0 V transient spikes during dead time - layout must minimize parasitic inductance. |
| LDO1OUT–LDO4OUT | Linear regulator outputs | Deliver low-noise, fast-transient power to analog circuits; LDO2EN allows hardware-controlled enable/disable. |
| VSNVS, LICELL | RTC supply & coin cell input | VSNVS provides backup power; LICELL accepts 0–4.2 V coin cell with programmable charge current/voltage for battery longevity. |
| SCL/SDA, VDDIO | I²C interface | Support 1.6–3.3 V I/O voltage; 3.4 MHz speed enables real-time DVS and fault logging without bus contention. |
| RESETBMCU, INTB, EWARN | System control signals | Open-drain outputs for MCU reset, interrupt, and early fault warning - compatible with 1.8 V/3.3 V logic families. |
| PGOOD, FSOB | Power-good & fail-safe outputs | PGOOD confirms all rails in regulation; FSOB asserts low during critical faults (e.g., thermal runaway, register corruption) per ASIL B monitoring. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable power-up sequence | Eliminates external configuration resistors and timing capacitors - reduces BOM count and improves startup repeatability across i.MX8QXP designs. |
| Dual/triple/quad-phase buck capability | SW1–SW4 can be combined into multi-phase configurations (up to 10 A), enabling high-current CPU core rails with reduced output ripple and improved transient response. |
| VTT termination mode on SW6 | Configures SW6 as DDR VTT terminator for LPDDR4 memory, supporting split-rail topology with active termination and dynamic current sourcing/sinking. |
| 24-channel analog multiplexer (AMUX) | Enables system-level diagnostics by routing internal voltage/current/temperature sensor outputs to a single ADC - simplifies health monitoring architecture. |
| ASIL B-compliant monitoring circuit | Includes independent voltage monitors, thermal shutdown, ABIST, and CRC-protected register writes - satisfies functional safety requirements for automotive infotainment without external safety MCU. |
Applications
| Automotive Infotainment Head Unit | i.MX8QXP-Based Digital Cluster |
|---|---|
Use Scenario: High-resolution display, multi-zone audio, Bluetooth/WiFi connectivity, and over-the-air updates in vehicle cockpit. IC Role / Device Role / Timing Role: Primary PMIC supplying CPU cores, GPU, LPDDR4 memory, display interface, and CAN/FlexRay transceivers. Use Value: OTP-programmed sequencing ensures deterministic boot within 100 ms; VSNVS + coin cell support maintains RTC and secure key storage during ignition-off. |
Use Scenario: Real-time rendering of vehicle speed, navigation, ADAS alerts, and driver monitoring on TFT-LCD or OLED displays. IC Role / Device Role / Timing Role: Powers i.MX8QXP application processor, LPDDR4 memory, MIPI-DSI transmitter, and touch controller with tight voltage tolerances. Use Value: Dual-phase SW1/SW2 delivers 5 A @ 0.8 V to CPU cluster with <±1% regulation; AMUX enables continuous rail health monitoring for ASIL B compliance. |
| Advanced Driver Assistance System (ADAS) ECU | Industrial Edge Gateway with Secure Boot |
Use Scenario: Sensor fusion processing (camera, radar, ultrasonic) with functional safety requirements for lane departure, AEB, and blind-spot detection. IC Role / Device Role / Timing Role: Supplies i.MX8QXP vision processor, image signal processors, and high-speed SerDes interfaces while meeting QM safety grade. Use Value: Watchdog timer and RESETBMCU ensure safe restart after software hang; PGOOD and FSOB provide hardware-level fault escalation to system controller. |
Use Scenario: Secure industrial gateway running Linux with encrypted firmware, remote diagnostics, and long-term field deployment. IC Role / Device Role / Timing Role: Manages power for i.MX8QXP, eMMC, Ethernet PHY, and isolated CAN FD interface with tamper-resistant OTP configuration. Use Value: I²C CRC and write-protection prevent unauthorized register modification; thermal monitoring extends lifetime in unventilated enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DEES | ASIL B safety certification (vs. QM for MC33PF8100FJES); adds ABIST-on-demand, secure I²C write, and fail-safe state machine extensions. | Required for ASIL B–compliant ADAS domains; not needed for QM-grade infotainment or digital clusters. | Select MC33PF8200DEES only when functional safety certification beyond QM is mandated by system architecture. |
| MC34PF8100FJTS | Industrial-grade variant (−40 °C to +105 °C), same OTP configuration and pinout; dimple wettable flank package optimized for new designs. | Targeted at non-automotive applications (e.g., medical imaging, test equipment) where AEC-Q100 qualification is unnecessary. | Choose MC34PF8100FJTS for cost-sensitive industrial designs needing identical functionality without automotive qualification overhead. |
Compared with MC33PF8100FJES, MC33PF8200DEES adds certified safety mechanisms at higher cost and complexity, while MC34PF8100FJTS removes automotive qualification but retains full electrical compatibility - enabling seamless migration between automotive and industrial platforms.
Availability
MC33PF8100FJES is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, and ADAS ECUs requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle support.
Supply support for MC33PF8100FJES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based application processors and power management.
The PF8100 product line was engineered to serve as the primary power subsystem for NXP's i.MX 8 series processors, delivering tightly integrated, OTP-configurable, and safety-aware power delivery for high-performance multimedia and real-time automotive systems.
FAQ
What is the operating temperature range for MC33PF8100FJES?
The MC33PF8100FJES is qualified for automotive use with an ambient operating temperature range of −40 °C to +105 °C. Its junction temperature is rated up to 150 °C, and thermal resistance values (e.g., RθJA = 22 °C/W on 4-layer board) ensure reliable operation under sustained load in under-dash environments. This rating aligns with AEC-Q100 Grade 2 requirements.
Does MC33PF8100FJES support LPDDR4 memory power delivery?
Yes, MC33PF8100FJES explicitly supports LPDDR4 memory in i.MX8QXP-based systems, as confirmed by NXP's ordering table (MC33PF8100FJES targets "i.MX8QXP / LPDDR4 memory"). It provides dedicated VDDQ and VTT rails via configurable bucks (SW6 in VTT mode) and LDOs, with voltage accuracy and sequencing matching JEDEC LPDDR4 specifications.
How does the OTP memory in MC33PF8100FJES reduce external components?
The OTP memory in MC33PF8100FJES stores startup voltage levels, power-on sequencing order, soft-start timing, and fault protection thresholds - eliminating the need for external resistor ladders, timing capacitors, and discrete supervisors. This reduces PCB area, BOM count, and calibration effort while ensuring repeatable, factory-trimmed behavior across production units.
Can MC33PF8100FJES be used in ASIL B–compliant systems?
No, MC33PF8100FJES carries QM (Quality Management) safety grade per its ordering information, not ASIL B. For ASIL B compliance, NXP specifies the PF8200 family (e.g., MC33PF8200DEES), which includes additional safety mechanisms like ABIST-on-demand, secure I²C, and fail-safe state transitions - all absent in the PF8100 series.
What package type and pin count does MC33PF8100FJES use?
MC33PF8100FJES uses the HVQFN56 package: a 56-pin, 8 mm × 8 mm, thermally enhanced quad flat no-lead package with 0.5 mm pitch and wettable flanks. The exposed pad (EPAD) must be soldered to a solid ground plane to meet thermal and electrical performance specifications outlined in NXP's datasheet.
MC33PF8100FJES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Processor
- Current - Supply:
- 10µA
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8100FJES FAQ
1.How can I place an order for MC33PF8100FJES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8100FJES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8100FJES reliable?
The price and inventory of MC33PF8100FJES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8100FJES is usually 5 days.
3.What payment methods are accepted for MC33PF8100FJES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8100FJES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8100FJES?
MC33PF8100FJES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8100FJES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8100FJES?
For technical support, including MC33PF8100FJES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8100FJES requirements.
6.How does Aetrix verify that MC33PF8100FJES is sourced from the original manufacturer or authorized distributors?
All MC33PF8100FJES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8100FJES meets industry standards.
7.What is the process for return or replacement of MC33PF8100FJES?
All MC33PF8100FJES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8100FJES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8100FJES part is unused and in its original packaging.
Return procedure for MC33PF8100FJES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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