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NXP Semiconductors MC33PF8100FJESR2
- Part No.:
- MC33PF8100FJESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8100FJESR2.pdf
- Description:
- POWER MANAGEMENT IC, I.MX8, PRE-
- Quantity:
- Payment:
- Shipping:
Inventory:2,693
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Product details
Overview
MC33PF8100FJESR2 from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for i.MX 8QXP processors with LPDDR4 memory. It integrates seven high-efficiency buck converters (0.4–1.8 V, 2.5 A each), four 400 mA linear regulators, RTC supply (1.8/3.0/3.3 V), coin cell charger, watchdog timer, and ASIL B-compliant monitoring circuitry. It operates from a 2.7–5.5 V input and supports dynamic voltage scaling for CPU/GPU/memory rails.
For engineers reviewing the MC33PF8100FJESR2 datasheet, MC33PF8100FJESR2 pinout, MC33PF8100FJESR2 application, or MC33PF8100FJESR2 equivalent, this device delivers programmable startup sequencing via OTP, high-speed 3.4 MHz I²C configuration, thermal and voltage fault monitoring, and safety-critical diagnostics for infotainment and ADAS domain controllers.
Technical Context
The MC33PF8100FJESR2 implements a deterministic state machine for autonomous power-up/down sequencing, fault detection, and fail-safe transitions - including hard watchdog reset, critical thermal shutdown (TJ > 150 °C), and VIN overvoltage lockout. Its architecture supports multi-phase configurations: SW1–SW3 can be combined as triple-phase (7.5 A), SW1–SW4 as quad-phase (10 A), and SW6 in VTT termination mode for DDR memory interfaces.
It features 24-channel analog multiplexer (AMUX) for system-level diagnostics, ABIST for analog built-in self-test, and independent voltage monitors per regulator with programmable thresholds and response actions. The device uses OTP memory to store boot configuration, eliminating external resistive programming components and reducing BOM count.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7 V to 5.5 V - supports wide automotive battery range including cold-crank (6 V transient tolerance with derating) |
| Buck Regulators | 7 channels: SW1–SW6 (0.4–1.8 V, ±1.5% accuracy), SW7 (1.0–4.1 V, ±2% accuracy) - enables full-core, GPU, memory, and I/O rail regulation |
| LDO Regulators | 4 × 400 mA LDOs (1.5–5.0 V, ±3% accuracy) with optional load switch mode - powers low-noise analog, sensor, and peripheral supplies |
| I²C Interface | Up to 3.4 MHz - enables rapid post-boot reconfiguration of output voltages, sequencing, and protection thresholds |
| Safety Certification | ASIL B monitoring circuit - includes independent voltage/thermal monitoring, watchdog supervision, and CRC-protected register writes |
| Package | HVQFN56, 8 mm × 8 mm × 0.85 mm - thermally enhanced wettable flank package for automotive PCB assembly and thermal dissipation |
| Operating Temperature | −40 °C to +105 °C ambient - qualified for under-hood and head-unit environments per AEC-Q100 Grade 2 |
Pinout & Package
HVQFN56 package (SOT684-21), 8 mm × 8 mm × 0.85 mm body, 0.5 mm pitch, exposed thermal pad (EPAD) connected to GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable precise closed-loop regulation of each buck output; support external resistor divider programming |
| SW1IN–SW7IN | Buck input supplies | Accept main input (VIN) or intermediate rail sources; require local ceramic decoupling and current-rated traces |
| SW1LX–SW7LX | Switching node outputs | Connect to external inductors; require low-inductance layout to minimize EMI and negative voltage spikes (< −3.0 V transient tolerated) |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Provide low-noise, fast-transient supplies for analog cores, sensors, and interface logic; support load switch enable/disable |
| VSNVS, LICELL | RTC supply & coin cell input | Deliver backup power to SNVS domain; integrate programmable coin cell charger (voltage/current configurable via I²C) |
| SCL/SDA | I²C interface signals | Support high-speed (3.4 MHz) communication for runtime tuning, fault logging, and safety register access |
| PGOOD, INTB, RESETBMCU | System status outputs | Open-drain signals for power-good indication, interrupt reporting, and MCU reset assertion during fault conditions |
| EPAD | Exposed thermal pad | Mandatory GND connection for thermal conduction and EMI reduction; requires ≥90% solder coverage per JEDEC J-STD-020 |
Key Features
| Feature | Design Value |
|---|---|
| OTP-based startup configuration | Eliminates 12+ external resistors and timing capacitors; reduces board area and improves startup repeatability across temperature |
| Multi-phase buck capability | SW1–SW3 triple-phase (7.5 A) and SW1–SW4 quad-phase (10 A) modes enable high-current CPU/GPU core rails without external phase controllers |
| VTT termination on SW6 | Direct DDR memory termination support (0.4–1.8 V) with programmable current limit - removes need for discrete VTT regulators in LPDDR4 systems |
| 24-channel analog multiplexer | Enables real-time monitoring of internal voltages, temperatures, and external system nodes - simplifies diagnostic firmware and reduces external ADC count |
| ABIST and CRC-protected registers | Verifies analog monitor integrity at startup and ensures register write reliability - required for ASIL B functional safety compliance |
| Programmable soft-start/power-down sequences | Prevents inrush current and bus contention during power transitions; configurable per-rail delay and ramp rate via OTP or I²C |
Applications
| Automotive Infotainment Head Unit | ADAS Domain Controller |
|---|---|
|
Use Scenario: Powering i.MX 8QXP SoC, LPDDR4 memory, display interface, audio codec, and CAN/FlexRay transceivers in a vehicle head unit. IC Role / Device Role / Timing Role: Primary PMIC managing all voltage domains - CPU core (SW1–SW3), GPU (SW4), memory (SW5/SW6 VTT), I/O (SW7/LDOs), and RTC (VSNVS). Use Value: Reduces component count by integrating 12 regulators and safety monitors into one QFN56 package; OTP eliminates 15+ passive components and accelerates design validation. |
Use Scenario: Supplying i.MX 8QXP with dual-camera ISP, radar preprocessor, and Ethernet AVB interfaces in a centralized ADAS controller. IC Role / Device Role / Timing Role: Safety-aware power manager delivering synchronized, monitored rails with fail-safe shutdown and watchdog coordination. Use Value: ASIL B-compliant monitoring (voltage, thermal, watchdog) enables ISO 26262 ASIL B decomposition; PGOOD/INTB/RESETBMCU signals simplify MCU fault-handling logic. |
| Industrial HMI Terminal | Secure Gateway Module |
|
Use Scenario: Powering i.MX 8QXP-based rugged HMI with touch controller, eMMC, and industrial Ethernet in factory automation equipment. IC Role / Device Role / Timing Role: High-reliability PMIC providing stable 1.5 V analog (LDO1), 1.8 V I/O (SW4), 3.3 V peripherals (SW7), and backup RTC (VSNVS). Use Value: −40 °C to +105 °C operation and AEC-Q100 qualification ensure long-term stability in uncontrolled environments; spread-spectrum switching reduces EMI in noise-sensitive applications. |
Use Scenario: Enabling secure vehicle-to-cloud gateway using i.MX 8QXP with HSM, CAN FD, and Wi-Fi/BT coexistence. IC Role / Device Role / Timing Role: Trusted power foundation with OTP-locked configuration and CRC-protected I²C writes - prevents unauthorized firmware or voltage tampering. Use Value: Secure I²C register access and ABIST self-test provide hardware-rooted trust for security-critical boot and runtime operations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DEES | ASIL B certified; adds ABIST-on-demand, fail-safe state (FSOB), secure I²C write, and CRC-protected safety registers not present in MC33PF8100FJESR2 | Required for ASIL B system-level compliance where active fail-safe assertion and runtime safety diagnostics are mandatory | Select MC33PF8200DEES when functional safety certification (ISO 26262) is required beyond monitoring-only compliance |
| MC34PF8100FJEP | Industrial-grade variant; same OTP configuration and regulator set but rated for −40 °C to +105 °C without AEC-Q100 qualification or ASIL B monitoring circuitry | Suitable for non-automotive embedded applications (e.g., medical displays, test equipment) where automotive qualification is unnecessary | Choose MC34PF8100FJEP to reduce cost and simplify qualification when automotive reliability requirements do not apply |
Compared with MC33PF8100FJESR2, MC33PF8200DEES adds hardware-enforced safety mechanisms for fail-safe shutdown and runtime verification, while MC34PF8100FJEP removes automotive qualification overhead - enabling optimized selection based on safety scope and market segment.
Availability
MC33PF8100FJESR2 is available at Aetrix Electronics and suitable for automotive infotainment, ADAS domain controllers, and industrial HMI terminals requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant sourcing.
Supply support for MC33PF8100FJESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and power management.
The PF8100 product line was engineered specifically to serve as the primary power subsystem for NXP's i.MX 8 series processors - delivering integrated, OTP-configurable, and safety-aware regulation for high-performance multimedia and real-time computing platforms.
FAQ
What is the primary processor compatibility for the MC33PF8100FJESR2?
The MC33PF8100FJESR2 is specifically configured for the i.MX 8QXP processor with LPDDR4 memory, as indicated by its OTP configuration file (MC33PF8100FJ.zip). It supports full power sequencing for CPU cores, GPU, memory I/O, and peripheral rails - matching the voltage and timing requirements defined in the i.MX 8QXP Reference Manual.
Does the MC33PF8100FJESR2 support dynamic voltage scaling (DVS)?
Yes, the MC33PF8100FJESR2 supports DVS on SW1 through SW6 buck regulators. Each can be individually programmed via I²C to adjust output voltage in 6.25 mV steps, enabling real-time adaptation to processor performance states (e.g., P-states) without requiring hardware changes or OTP reprogramming.
What safety certifications does the MC33PF8100FJESR2 meet?
The MC33PF8100FJESR2 meets AEC-Q100 Grade 2 qualification and incorporates an ASIL B-compliant monitoring circuit - including independent voltage/thermal monitors, watchdog supervision, and ABIST - but lacks the full ASIL B hardware safety mechanisms (e.g., FSOB, secure I²C) found in the PF8200 family. It is intended for QM (Quality Management) applications with monitoring-level safety.
Can the MC33PF8100FJESR2 be used with DDR4 memory?
No - the MC33PF8100FJESR2 is OTP-configured for LPDDR4 memory on i.MX 8QXP, as confirmed by its ordering information and supporting ZIP file (MC33PF8100FJ.zip). For DDR4 support, NXP specifies variants like MC33PF8100CHES (i.MX 8QM + DDR4) or MC33PF8100ERES (i.MX 8QM + DDR4 PMIC1), which have different OTP maps and regulator tuning.
What is the role of the VSNVS and LICELL pins on the MC33PF8100FJESR2?
The VSNVS pin delivers a selectable 1.8 V / 3.0 V / 3.3 V always-on supply for the i.MX 8QXP's Secure Non-Volatile Storage (SNVS) domain, while LICELL accepts a coin cell (up to 4.2 V) to maintain RTC and backup memory during main power loss. The MC33PF8100FJESR2 integrates a programmable coin cell charger with configurable charge voltage and current via I²C.
MC33PF8100FJESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Processor
- Current - Supply:
- 10µA
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8100FJESR2 FAQ
1.How can I place an order for MC33PF8100FJESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8100FJESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8100FJESR2 reliable?
The price and inventory of MC33PF8100FJESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8100FJESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF8100FJESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8100FJESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8100FJESR2?
MC33PF8100FJESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8100FJESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8100FJESR2?
For technical support, including MC33PF8100FJESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8100FJESR2 requirements.
6.How does Aetrix verify that MC33PF8100FJESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF8100FJESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8100FJESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF8100FJESR2?
All MC33PF8100FJESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8100FJESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8100FJESR2 part is unused and in its original packaging.
Return procedure for MC33PF8100FJESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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