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NXP Semiconductors MC33PF8101A0ESR2
- Part No.:
- MC33PF8101A0ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8101A0ESR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX8 NON-PR
- Quantity:
- Payment:
- Shipping:
Inventory:4,553
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Product details
Overview
MC33PF8101A0ESR2 from NXP Semiconductors is an automotive-grade power management IC (PMIC) designed for i.MX 8-based high-performance applications. It integrates five high-efficiency buck converters (SW1–SW7, with SW7 independent), three linear regulators (LDO1–LDO3), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B–capable monitoring circuitry. It powers processor cores, DDR I/O, GPU, SCU, and peripherals in infotainment and ADAS systems.
For engineers reviewing the MC33PF8101A0ESR2 datasheet, MC33PF8101A0ESR2 pinout, MC33PF8101A0ESR2 application, or MC33PF8101A0ESR2 equivalent, this page delivers verified regulator output ranges, OTP-configurable startup sequencing, 3.4 MHz I²C interface timing, HVQFN56 thermal performance data, and functional safety features aligned to automotive QM requirements.
Technical Context
The MC33PF8101A0ESR2 implements a deterministic state machine for seamless i.MX 8 processor interface, supporting programmable soft-start/power-down sequences, dynamic voltage scaling on SW1/SW2/SW5/SW6, and VTT termination mode on SW6. Its OTP memory stores voltage setpoints, sequencing order, and safety configuration-eliminating external resistive programming components.
It features 24-channel analog multiplexer for system diagnostics, independent voltage/thermal monitoring with programmable fault thresholds, and fail-safe outputs (FSOB, RESETBMCU, EWARN) triggered by critical events including thermal shutdown (TJ > 150 °C), VIN overvoltage, or watchdog timeout. The device operates across −40 °C to +105 °C ambient with QM safety grade and AEC-Q100 qualification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VIN Range | 2.7 V to 5.5 V input - supports wide automotive battery rail with UVLO at 2.7 V and OVLO protection up to 5.5 V. |
| Buck Regulators | 5 channels: SW1–SW2/SW5–SW6 (0.4–1.8 V, ±1.5 % accuracy, 2.5 A); SW7 (1.0–4.1 V, ±2 %, 2.5 A) - enables core, memory, and I/O rail generation with DVS support. |
| LDO Regulators | 3 channels: LDO1/LDO2/LDO3 (1.5–5.0 V, ±3 %, 400 mA each) - provides low-noise analog, interface, and peripheral supplies with optional load switch mode. |
| VSNVS & LICELL | RTC supply (1.8/3.0/3.3 V, 10 mA) with coin cell charging (programmable current/voltage) - ensures non-volatile memory retention during main power loss. |
| I²C Interface | High-speed mode up to 3.4 MHz - enables rapid post-boot reconfiguration of regulator settings and monitoring registers without interrupting system operation. |
| Safety Features | ASIL B–compatible monitoring (ABIST, voltage/thermal fault detection), FSOB fail-safe output, and watchdog with programmable counter - meets QM-level functional safety requirements per ISO 26262. |
| Package | HVQFN56 (8 mm × 8 mm × 0.85 mm, 0.5 mm pitch, wettable flanks) - optimized for automotive thermal dissipation (RθJA = 27 °C/W on 4-layer board). |
Pinout & Package
HVQFN56 thermally enhanced package with 56 terminals, 0.5 mm pitch, exposed EPAD for thermal and electrical grounding. Wettable flank design supports automated optical inspection (AOI) in automotive manufacturing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1–7, 57 | DNC1–DNC7, EPAD | Do-not-connect pins except EPAD - must be soldered to PCB ground plane for thermal management and noise reduction. |
| 2–3, 30–31, 38 | SW2FB, SW1FB, SW6FB, SW5FB, SW7FB | Buck feedback inputs - connect to regulated output via resistor divider to set precise output voltage per OTP or I²C configuration. |
| 4–7, 32, 35, 37 | SW1IN–SW2IN, SW5IN–SW6IN, SW7IN | Buck input supplies - require local ceramic input capacitors (≥10 µF) and proper layout to minimize switching loop inductance. |
| 5–6, 33–34, 36 | SW1LX–SW2LX, SW5LX–SW6LX, SW7LX | Switching node outputs - high dv/dt nodes requiring tight layout, Kelvin connection to LX sense, and minimized parasitic inductance. |
| 15, 18, 25, 40–41, 47 | LDO1OUT, LDO2OUT, LDO3OUT, V1P5D, V1P5A, VSNVS | Regulated outputs - V1P5D/V1P5A supply digital/analog cores; VSNVS powers SNVS domain; LDOxOUTs drive peripherals with load-switch capability. |
| 55–56 | SCL, SDA | I²C bus interface - operate at 3.4 MHz with pull-up resistors to VDDIO (1.6–3.3 V); support CRC-protected register writes for safety-critical updates. |
| 19, 21–24, 29, 42 | WDI, RESETBMCU, PWRON, STANDBY, INTB, FSOB, PGOOD | Control and status signals - open-drain outputs (RESETBMCU, INTB, FSOB, PGOOD) require external pull-ups; WDI enables MCU-initiated watchdog reset. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable startup sequence | Eliminates external resistor networks and reduces BOM count by storing voltage setpoints, enable order, and timing parameters in one-time programmable memory. |
| Dual-phase configuration support | SW1/SW2 and SW5/SW6 can be paired as dual-phase buck regulators - improves transient response and reduces output ripple for CPU/GPU rails. |
| VTT termination on SW6 | Enables direct DDR memory termination without external components - supports LPDDR4/LPDDR5 VTT compliance with programmable current sink/source. |
| 24-channel analog multiplexer | Allows real-time monitoring of internal voltages, temperatures, and external system nodes - simplifies diagnostic firmware and reduces external ADC requirements. |
| Fail-safe output (FSOB) | Asserts low on critical faults (thermal shutdown, VIN OVLO, watchdog timeout) - directly interfaces with vehicle safety controller to initiate safe state transition. |
Applications
| Automotive Infotainment Head Unit | ADAS Domain Controller Power Management |
|---|---|
|
Use Scenario: Powers i.MX 8 QuadMax processor, LPDDR4 memory, eMMC storage, and HDMI/MIPI display interfaces in a 12 V automotive head unit. IC Role / Device Role / Timing Role: Primary PMIC providing sequenced 0.8 V CPU core, 1.1 V GPU, 1.2 V SCU, 3.3 V I/O, and VTT termination for DDR. Use Value: Reduces external component count by 12+ resistors/capacitors via OTP configuration and integrates VTT, eliminating discrete termination ICs. |
Use Scenario: Supplies radar preprocessor, camera ISP, and safety microcontroller in a Zonal E/E architecture with centralized power domain control. IC Role / Device Role / Timing Role: Delivers ASIL B–compliant power with FSOB-driven fail-safe signaling and independent voltage monitoring for sensor fusion subsystems. Use Value: Enables single-chip power solution meeting QM functional safety requirements while supporting dynamic voltage scaling for thermal-aware processing. |
| Industrial HMI with Secure Boot | Connected Gateway Module |
|
Use Scenario: Powers i.MX 8M Mini in a panel-mounted HMI with secure boot, encrypted storage, and CAN FD communication. IC Role / Device Role / Timing Role: Generates 1.0 V ARM core, 1.1 V DDR, 3.3 V CAN transceiver, and 1.8 V FPGA I/O with programmable power-up sequencing. Use Value: OTP-stored secure boot sequence prevents unauthorized firmware loading; I²C CRC ensures runtime register integrity during field updates. |
Use Scenario: Manages power for dual-core i.MX 8M Nano, Wi-Fi 6/BLE coexistence module, and cellular modem in a telematics gateway. IC Role / Device Role / Timing Role: Provides independent 1.0 V CPU, 1.1 V memory, 3.3 V RF front-end, and 5.0 V USB PD negotiation supply with load-switch isolation. Use Value: LDO3 load-switch mode enables selective powering of modems during sleep; coin cell backup preserves time/date and network credentials during main power loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8201A0ESR2 | ASIL B–qualified with ABIST, FSOB assertion logic, secure I²C write, and fail-safe state machine - includes additional safety registers and self-test capabilities not present in PF8101. | Required for ASIL B–compliant designs where fail-safe shutdown and runtime diagnostics are mandated (e.g., instrument clusters, HUD). | Select PF8201 when functional safety certification (ISO 26262) is required; PF8101 remains suitable for QM-level infotainment and non-safety-critical gateways. |
| MPQ4436-AEC1 | Single 3 A buck converter (no integrated LDOs, no OTP, no safety monitors) - lacks multi-rail integration, sequencing, or automotive safety features. | Only suitable as a drop-in replacement for individual buck rails (e.g., SW7), not as full PMIC substitute. | Use MPQ4436-AEC1 only for discrete buck replacement; it cannot replicate PF8101's 9-channel regulation, I²C configurability, or safety architecture. |
Compared with MC33PF8201A0ESR2, the MC33PF8101A0ESR2 omits ABIST, secure I²C, and fail-safe state transitions - making it appropriate for QM applications where cost and complexity are prioritized over ASIL B certification. Compared with MPQ4436-AEC1, MC33PF8101A0ESR2 delivers full-system power integration, reducing board area and enabling coordinated rail control.
Availability
MC33PF8101A0ESR2 is available at Aetrix Electronics and suitable for automotive infotainment, ADAS domain controllers, and industrial HMIs requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle support.
Supply support for MC33PF8101A0ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in i.MX application processors and automotive power management.
The PF8101 product line is engineered as a scalable, OTP-programmable PMIC family for NXP i.MX 8 series processors - targeting high-reliability automotive infotainment and gateway systems where reduced BOM count and robust power sequencing are critical.
FAQ
What is the primary application target for MC33PF8101A0ESR2?
The MC33PF8101A0ESR2 is specifically designed for high-performance automotive infotainment systems based on NXP i.MX 8 processors. It delivers tightly sequenced, configurable power to CPU cores, GPU, DDR memory, and peripherals while meeting AEC-Q100 Grade 2 requirements and QM functional safety level. Its OTP configuration eliminates external programming components, streamlining design for head units and digital cockpits.
Does MC33PF8101A0ESR2 support dynamic voltage scaling (DVS)?
Yes, MC33PF8101A0ESR2 supports DVS on buck regulators SW1, SW2, SW5, and SW6 - allowing real-time adjustment of output voltage via I²C to match processor performance states. This feature enables thermal optimization and power savings during low-load conditions, with voltage steps as fine as 6.25 mV across the 0.4–1.8 V range.
How does the OTP memory in MC33PF8101A0ESR2 reduce system design complexity?
The OTP memory in MC33PF8101A0ESR2 stores startup voltage setpoints, power-up/down sequencing order, timing delays, and safety configuration - eliminating the need for external resistor dividers, timing capacitors, and discrete supervisors. This reduces BOM count by up to 15 passive components and removes layout sensitivity associated with analog programming networks.
What safety features does MC33PF8101A0ESR2 include for automotive use?
MC33PF8101A0ESR2 includes voltage/thermal monitoring with programmable fault thresholds, watchdog timer with configurable timeout, early warning (EWARN) and fail-safe output (FSOB), and PGOOD status signaling. While not ASIL B–certified like the PF8201 variant, it meets QM-level functional safety requirements per ISO 26262 and supports automotive reliability standards including AEC-Q100.
Can MC33PF8101A0ESR2 be used with non-NXP processors?
Yes, MC33PF8101A0ESR2 is compatible with non-NXP processors requiring multi-rail power with programmable sequencing. Its 3.4 MHz I²C interface, flexible voltage ranges (0.4–4.1 V buck, 1.5–5.0 V LDO), and generic control signals (PWRON, STANDBY, RESETBMCU) allow integration with ARM-based SoCs from other vendors - provided timing and sequencing requirements align with the PMIC's state machine behavior.
MC33PF8101A0ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- High Performance i.MX 8 Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8101A0ESR2 FAQ
1.How can I place an order for MC33PF8101A0ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8101A0ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8101A0ESR2 reliable?
The price and inventory of MC33PF8101A0ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8101A0ESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF8101A0ESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8101A0ESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8101A0ESR2?
MC33PF8101A0ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8101A0ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8101A0ESR2?
For technical support, including MC33PF8101A0ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8101A0ESR2 requirements.
6.How does Aetrix verify that MC33PF8101A0ESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF8101A0ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8101A0ESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF8101A0ESR2?
All MC33PF8101A0ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8101A0ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8101A0ESR2 part is unused and in its original packaging.
Return procedure for MC33PF8101A0ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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