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NXP Semiconductors MC33PF8200A0ESR2
- Part No.:
- MC33PF8200A0ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200A0ESR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX8 NON-PR
- Quantity:
- Payment:
- Shipping:
Inventory:3,784
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Product details
Overview
MC33PF8200A0ESR2 from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed as the primary power solution for i.MX 8 and S32x application processors. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B–compliant monitoring circuitry. It powers CPU cores, LPDDR4/DDR4 memory, GPU, and peripherals in infotainment and ADAS systems.
For engineers reviewing the MC33PF8200A0ESR2 datasheet, MC33PF8200A0ESR2 pinout, MC33PF8200A0ESR2 application, or MC33PF8200A0ESR2 equivalent, this page delivers verified technical context, exact pin functions, real-world use cases, validated alternatives, and supply-chain-ready availability details - all grounded in the official PF8100/PF8200 Rev. 13 product data sheet.
Technical Context
The MC33PF8200A0ESR2 implements a safety-aware digital state machine with fail-safe transitions, ABIST self-test, and programmable fault response including FSOB assertion. Its architecture supports dynamic voltage scaling across six buck channels (SW1–SW6), triple-phase (7.5 A) and quad-phase (10 A) configurations, VTT termination on SW6, and spread-spectrum switching to reduce EMI.
It features OTP-programmable startup sequencing, 24-channel analog multiplexer for system diagnostics, dual I²C clock domains (100 kHz and 20 MHz), and hardware/software-controllable LDO2 with load-switch capability. All regulators are monitored via independent voltage monitors with programmable thresholds and fault protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 7 buck converters + 4 LDOs + RTC/VSNVS + coin cell charger - fully integrated power tree for SoC, memory, and peripherals. |
| Buck Output Range | SW1–SW6: 0.4 V to 1.8 V (6.25 mV step); SW7: 1.0 V to 4.1 V - covers core, I/O, and auxiliary rails of i.MX 8/S32x. |
| Current Rating | 2500 mA per buck channel; 400 mA per LDO - sufficient for CPU clusters, GPU, DDR PHY, and interface I/O. |
| I²C Interface | Up to 3.4 MHz - enables fast post-boot reconfiguration for DVFS, thermal throttling, and mode transitions. |
| Safety Compliance | ASIL B monitoring circuit (voltage, thermal, watchdog, ABIST, CRC) - meets functional safety requirements for automotive infotainment. |
| Input Voltage Range | VIN: 2.7 V to 5.5 V - compatible with 3.3 V and 5 V automotive supply rails; LICELL: up to 4.2 V for backup battery operation. |
| Operating Temp | −40 °C to +105 °C ambient - qualified for under-dash automotive environments per AEC-Q100. |
Pinout & Package
HVQFN56 package: 8 mm × 8 mm × 0.9 mm body, 0.5 mm pitch, dimple wettable flanks (SOT684-29(D)), thermally enhanced EPAD connected to ground.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck output voltage feedback | Enables precise closed-loop regulation; supports external resistor divider for programmable VOUT. |
| SW1IN–SW7IN | Buck input supply | Accepts 2.7–5.5 V input; each channel independently powered for rail isolation and sequencing control. |
| SW1LX–SW7LX | Buck switching node | High-frequency switching output (up to 3 MHz); requires low-inductance layout and proper gate drive design. |
| LDO1OUT–LDO4OUT | LDO regulated output | 1.5–5.0 V, 400 mA outputs with optional load switch mode for power gating peripherals. |
| VSNVS | RTC supply output | 1.8 V / 3.0 V / 3.3 V selectable output at 10 mA - maintains real-time clock and SRAM during main power loss. |
| SCL / SDA | I²C interface | 3.4 MHz high-speed bus for runtime configuration, monitoring, and fault reporting to host processor. |
| FSOB | Failsafe output | Open-drain ASIL B–compliant safety signal asserted during critical faults (thermal, UV/OV, watchdog timeout). |
| RESETBMCU | MCU reset output | Open-drain active-low reset signal triggered by internal fault conditions or watchdog failure. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-based startup configuration | Eliminates external resistors and sequencers; stores voltage targets, timing, and enable order for deterministic boot. |
| Dual-phase & multi-phase buck support | SW1/SW2, SW3/SW4, SW5/SW6 configurable as dual-phase; SW1–SW3 as triple-phase (7.5 A); SW1–SW4 as quad-phase (10 A). |
| VTT termination on SW6 | Direct DDR memory termination support without external components - simplifies LPDDR4/DDR4 interface design. |
| 24-channel analog multiplexer | Enables system-level diagnostics by routing internal voltages, temperatures, and reference signals to external ADC. |
| ABIST and CRC-protected registers | Hardware self-test verifies voltage monitors, logic integrity, and register contents before and during operation. |
| Programmable soft-start/soft-shutdown | Prevents inrush current and bus collapse during power-up/down sequences - critical for multi-rail SoC systems. |
Applications
| Automotive Infotainment Head Unit | i.MX 8QM-Based ADAS Domain Controller |
|---|---|
|
Use Scenario: Central display unit with Android Automotive OS, multi-camera input, and audio DSP requiring stable, sequenced power for CPU, GPU, DDR, and peripheral interfaces. IC Role / Device Role / Timing Role: Primary PMIC managing 7 buck rails (CPU cores, GPU, DDR I/O, PCIe, USB, CAN, Ethernet) and 4 LDOs (audio codec, touch controller, sensors). Use Value: OTP-configured startup eliminates external sequencing ICs; ASIL B monitoring ensures safe shutdown during thermal or voltage faults. |
Use Scenario: Safety-critical vision processing unit using i.MX 8QM with dual LPDDR4 memory channels, MIPI CSI-2 camera inputs, and CAN FD communication. IC Role / Device Role / Timing Role: Dual-PMIC configuration (e.g., MC33PF8200DBES + MC33PF8200ESES) delivering PMIC1 (core/memory) and PMIC2 (I/O/peripherals) with synchronized power-up. Use Value: VTT termination on SW6 directly supplies DDR4/LPDDR4 VTT; FSOB output triggers domain controller safe state upon detected fault. |
| S32V234 Vision Processor System | LS1043A-Based Gateway Module |
|
Use Scenario: Embedded vision platform for surround-view and parking assist, operating in extended temperature range with strict EMI limits. IC Role / Device Role / Timing Role: Single-chip power source for S32V234 core, memory, ISP, and image sensor interfaces - leveraging spread-spectrum switching and phase interleaving. Use Value: Triple-phase configuration on SW1–SW3 delivers 7.5 A for high-current vision processor cores while reducing input ripple and EMI. |
Use Scenario: Automotive gateway handling CAN, LIN, Ethernet, and cellular modem connectivity with secure boot and firmware updates. IC Role / Device Role / Timing Role: Power manager for LS1043A's triple-core ARM Cortex-A53 cluster, DDR4 memory, and high-speed interfaces - using SW1–SW6 for core/memory and SW7 for modem supply. Use Value: Coin cell charger and VSNVS maintain RTC and secure key storage during vehicle sleep; watchdog and ABIST support secure boot integrity checks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DHES | Configured for i.MX 8QM DDR4 memory PMIC2; same package and pinout; OTP preloaded for DDR4 VDDQ/VTT. | Targeted specifically for DDR4 memory subsystems rather than general-purpose SoC core power. | Select when designing for i.MX 8QM DDR4 memory rails and requiring factory-validated DDR4 timing and termination settings. |
| MC33PF8200DEES | Configured for i.MX 8QXP LPDDR4 memory; includes optimized OTP for LPDDR4 VDDQ, VDDIO, and VREF; identical electrical specs. | Optimized for QXP-based infotainment platforms with LPDDR4, not generic i.MX 8 or S32x use. | Choose for new i.MX 8QXP designs needing plug-and-play LPDDR4 power delivery without custom OTP programming. |
Compared with MC33PF8200A0ESR2 - which ships unprogrammed and requires full OTP customization - DHES and DEES offer pre-validated, application-specific configurations that reduce bring-up time and qualification effort for DDR4 and LPDDR4 memory subsystems respectively.
Availability
MC33PF8200A0ESR2 is available at Aetrix Electronics and suitable for automotive infotainment head units, i.MX 8QM-based ADAS controllers, and S32V234 vision systems requiring stable component supply, long-term lifecycle support, and AEC-Q100–qualified reliability.
Supply support for MC33PF8200A0ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in application processors and power management.
The PF8200 series is part of NXP's automotive PMIC portfolio, engineered specifically to meet the stringent power sequencing, safety, and thermal requirements of i.MX 8 and S32x processor platforms in safety-critical automotive systems.
FAQ
What is the primary function of the MC33PF8200A0ESR2 in an automotive system?
The MC33PF8200A0ESR2 serves as the central power management IC for high-performance automotive processors like i.MX 8 and S32x. It delivers and sequences 12 regulated power rails - including seven buck converters, four LDOs, RTC supply (VSNVS), and coin cell charging - while enforcing ASIL B safety monitoring. Its OTP memory stores boot configuration, eliminating external components and ensuring repeatable, deterministic power-up behavior for infotainment and ADAS systems.
Does the MC33PF8200A0ESR2 support dynamic voltage scaling (DVS)?
Yes, the MC33PF8200A0ESR2 supports DVS on SW1 through SW6 - all six primary buck converters. Each can be reconfigured in real time via its 3.4 MHz I²C interface to adjust output voltage in 6.25 mV steps across the 0.4 V to 1.8 V range. This enables adaptive power management for CPU/GPU frequency scaling, thermal throttling, and low-power states without requiring hardware changes or external DACs.
How does the MC33PF8200A0ESR2 achieve ASIL B compliance?
The MC33PF8200A0ESR2 achieves ASIL B compliance through integrated hardware safety mechanisms: independent voltage monitors with programmable thresholds for all 12 regulators, advanced thermal monitoring with shutdown at 150 °C junction temperature, ABIST (analog built-in self-test), CRC-protected register writes, fail-safe output (FSOB), and a dedicated watchdog timer with configurable timeout and fail-safe state transition logic - all documented in the PF8100/PF8200 functional safety manual.
What package type and thermal characteristics does the MC33PF8200A0ESR2 use?
The MC33PF8200A0ESR2 uses the HVQFN56 package (8 mm × 8 mm × 0.9 mm, SOT684-29(D)) with dimple wettable flanks for automated optical inspection. Its thermal resistance is RθJA = 22 °C/W on a 4-layer board and RθJC = 0.6 °C/W to the bottom case, enabling reliable operation up to 105 °C ambient with proper PCB copper pour and thermal vias under the EPAD. Maximum junction temperature is 150 °C.
Can the MC33PF8200A0ESR2 be used with non-NXP processors?
Yes, the MC33PF8200A0ESR2 is compatible with non-NXP processors, including LS1043A and LA1575, as confirmed in the official ordering information table. Its flexible OTP configuration, wide input range (2.7–5.5 V), programmable sequencing, and 3.4 MHz I²C interface allow adaptation to third-party SoCs - though application-specific OTP images must be developed and validated separately, as factory-provided configurations target NXP i.MX and S32x families.
MC33PF8200A0ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200A0ESR2 FAQ
1.How can I place an order for MC33PF8200A0ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200A0ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200A0ESR2 reliable?
The price and inventory of MC33PF8200A0ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200A0ESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF8200A0ESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200A0ESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200A0ESR2?
MC33PF8200A0ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200A0ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200A0ESR2?
For technical support, including MC33PF8200A0ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200A0ESR2 requirements.
6.How does Aetrix verify that MC33PF8200A0ESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF8200A0ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200A0ESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF8200A0ESR2?
All MC33PF8200A0ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200A0ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200A0ESR2 part is unused and in its original packaging.
Return procedure for MC33PF8200A0ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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