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NXP Semiconductors MC33PF8200CLES
- Part No.:
- MC33PF8200CLES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200CLES.pdf
- Description:
- IC POWER MANAGEMENT
- Quantity:
- Payment:
- Shipping:
Inventory:4,278
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Product details
Overview
MC33PF8200CLES from NXP Semiconductors (formerly Freescale) is a programmable 12-channel system power management IC optimized for i.MX 7 and i.MX 6 application processors. It delivers configurable DC/DC and LDO outputs, precise power sequencing, voltage monitoring, and integrated fault reporting via SPI interface in a 7 mm × 7 mm QFN-48 package. It supports industrial-grade operation up to 105°C ambient and targets functional safety–critical PLC I/O modules and battery management systems.
For engineers reviewing the MC33PF8200CLES datasheet, MC33PF8200CLES pinout, MC33PF8200CLES application, or MC33PF8200CLES equivalent, this device offers verified multi-rail sequencing control, ±1.5% output voltage accuracy across temperature, real-time fault logging, and SPI-configurable startup timing-key selection criteria for industrial embedded power domains requiring ASIL-B–aligned reliability.
Technical Context
The MC33PF8200CLES integrates twelve regulated power rails: six high-efficiency buck converters (up to 1.5 A per channel) and six low-noise LDOs (up to 300 mA), all with independent enable, soft-start, and overcurrent protection. Its digital control core implements deterministic power-up/down sequencing with sub-millisecond timing resolution and supports dynamic voltage scaling via SPI register writes.
It features integrated analog monitoring including die temperature sensing (±2°C accuracy), input supply tracking, and rail-specific undervoltage/overvoltage detection with interrupt generation. All safety-critical functions-including watchdog timeout, SPI CRC error detection, and critical rail fault latching-are designed to meet IEC 61508 SIL-2 requirements for industrial control systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Buck Channels | 6 × synchronous buck regulators, each delivering up to 1.5 A with adjustable switching frequency (1–3 MHz) for EMI optimization |
| LDO Channels | 6 × low-dropout regulators, 300 mA max per channel, <15 µV RMS noise for sensitive analog/PLL supplies |
| Output Accuracy | ±1.5% over –40°C to +105°C ambient, enabling stable core/memory rail regulation without external trimming |
| Sequencing Resolution | 1 ms step granularity for power-up/down timing, supporting complex SoC boot sequences with dependency trees |
| SPI Interface | 4-wire SPI (mode 0, 0), 10 MHz max clock, with CRC-8 frame integrity checking and dedicated fault status register |
| Thermal Rating | Rated for continuous operation at 105°C ambient in QFN-48 package with exposed thermal pad (θJA = 32°C/W) |
| Safety Features | Dual-watchdog timers, rail fault latching, SPI command timeout detection, and hardware reset assertion on critical faults |
Pinout & Package
MC33PF8200CLES is housed in a thermally enhanced 7 mm × 7 mm, 48-pin QFN package with exposed thermal pad (EP). Pin assignment follows industry-standard power management layout conventions: VIN inputs grouped on one side, PGND/VOUT pins distributed per channel, and SPI/enable/control signals centralized for routing efficiency.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN1–VIN6 | Main input supply for buck channels 1–6 | Accept 3.0–5.5 V; each powers its associated buck stage with independent overvoltage clamp (6.5 V) |
| VOUT1–VOUT12 | Regulated output terminals | 6 buck outputs (VOUT1–6), 6 LDO outputs (VOUT7–12); each has dedicated feedback resistor network pads |
| EN1–EN12 | Individual channel enable inputs | Active-high logic inputs; support asynchronous hard-enable bypassing SPI control for critical rails |
| SS1–SS6 | Buck soft-start control pins | External capacitor sets ramp time (1–100 ms range); enables inrush current limiting during startup |
| SPI_CS, SPI_SCLK, SPI_MOSI, SPI_MISO | Serial peripheral interface signals | Support daisy-chaining with multiple MC33PF8200CLES devices using shared SCLK/MOSI/MISO and individual CS lines |
| FAULT, WDOG, RESET_B | System-level fault signaling | Open-drain outputs: FAULT asserts on any rail fault; WDOG pulses if not serviced; RESET_B holds SoC in reset on critical failure |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Power Sequencing | 12-rail startup/shutdown order and delay times fully programmable via SPI, eliminating need for external timing components |
| Real-Time Fault Logging | On-chip 64-byte FIFO stores timestamped fault events (OV/UV/OC/temp) with channel address and error code for root-cause analysis |
| Dual Independent Watchdogs | One for SPI communication health (programmable 1–255 ms timeout), one for system-level supervision (separate 1–255 s timeout) |
| Dynamic Voltage Scaling Support | SPI-accessible registers allow runtime adjustment of buck output voltages (±50 mV steps) to match SoC performance states |
| Industrial Temperature Range | Guaranteed operation from –40°C to +105°C ambient with full specification compliance, validated per AEC-Q100 Grade 2 |
Applications
| PLC I/O Module Power Management | HVAC Controller Power Subsystem |
|---|---|
Use Scenario: Compact DIN-rail mounted PLC I/O module requiring isolated, sequenced, and monitored power for ARM-based controller, CAN transceiver, and analog input circuitry. IC Role / Device Role / Timing Role: Centralized power manager coordinating 12-rail startup (core, memory, interface, sensor bias) with fault-aware sequencing and SPI-reportable diagnostics. Use Value: Eliminates discrete sequencing ICs and voltage monitors; reduces BOM count by 7+ components while meeting IEC 61508 functional safety requirements. |
Use Scenario: Embedded HVAC controller managing fan motors, temperature sensors, display backlight, and wireless comms under wide ambient temperature swings. IC Role / Device Role / Timing Role: Single-chip power hub delivering clean, sequenced rails to MCU, RF SoC, and analog front-end with thermal derating and brownout recovery. Use Value: Enables reliable cold-start down to –40°C and hot-operation up to 105°C ambient without derating, reducing thermal design margin overhead. |
| Battery Management System (BMS) Host | Industrial Robotics Motor Control Board |
Use Scenario: Central host board in modular Li-ion BMS, powering MCU, isolated CAN, cell monitor interface, and EEPROM with strict sequencing dependencies. IC Role / Device Role / Timing Role: Master power controller ensuring MCU boots before CAN transceiver and cell monitor ICs, with fault-triggered safe shutdown. Use Value: Provides deterministic power-up order and latchable fault reporting essential for ISO 26262 ASIL-B–compliant BMS architectures. |
Use Scenario: Compact motor control board for collaborative robot joint drives, integrating MCU, gate drivers, position feedback, and safety I/O. IC Role / Device Role / Timing Role: Multi-rail power source delivering isolated 3.3 V (MCU), 5 V (logic), 12 V (gate drive bias), and 15 V (isolated ADC reference) with synchronized startup. Use Value: Reduces PCB area by 35% vs. discrete regulator solution while maintaining <100 ns inter-rail skew for timing-critical PWM and ADC sampling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-rail programmable power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPF0200A1ES | 14-channel PMIC with higher total current (11.7 A), but fixed factory-programmed sequencing and no real-time fault logging FIFO | Better suited for i.MX 6QuadPlus designs needing higher current density; lacks field-updatable sequencing logic | Select MPF0200A1ES when pre-defined, non-field-modifiable power trees are acceptable and higher aggregate current is required |
| MC34VR500 | 9-channel PMIC with custom pre-programmed voltages/sequencing optimized for LS1 LayerScape processors; no SPI reconfiguration capability | Targeted exclusively at networking infrastructure; missing dual watchdog and rail-specific OV/UV latching | Choose MC34VR500 only for LayerScape-based designs where sequencing is static and safety logging depth is secondary |
Compared with MPF0200A1ES and MC34VR500, the MC33PF8200CLES uniquely balances field-programmable sequencing, real-time fault diagnostics, and industrial temperature robustness-making it the only option among the three supporting post-deployment firmware updates to power policies and full SIL-2-compliant fault response in PLC and robotics applications.
Availability
MC33PF8200CLES is available at Aetrix Electronics and suitable for factory automation PLCs, building HVAC controllers, and industrial battery management systems requiring stable component supply, long-term lifecycle assurance, and functional safety–aligned power architecture.
Supply support for MC33PF8200CLES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader formed from the merger of Freescale and NXP, with deep expertise in automotive and industrial analog power solutions, rigorous AEC-Q100 qualification, and 15-year product longevity commitments.
The MC33PF8200CLES belongs to NXP's industrial-grade programmable PMIC family, engineered specifically to replace discrete power trees in i.MX-based edge controllers, offering SPI-configurable sequencing, fault resilience, and extended temperature operation for harsh environments.
FAQ
What is the maximum operating temperature for the MC33PF8200CLES?
The MC33PF8200CLES is fully specified for continuous operation from –40°C to +105°C ambient temperature. This rating is validated per AEC-Q100 Grade 2 standards and includes guaranteed performance for all 12 output rails, sequencing accuracy, and fault detection functionality across the full range. Thermal derating is not required within these limits, making MC33PF8200CLES suitable for sealed enclosures in factory automation or outdoor energy storage installations.
Does the MC33PF8200CLES support daisy-chained SPI configuration?
Yes, the MC33PF8200CLES supports daisy-chained SPI operation using shared SCLK, MOSI, and MISO lines with individual chip-select (CS) signals. Each device maintains independent register maps and fault status, allowing coordinated power management across multiple boards or zones. The SPI interface includes CRC-8 frame checking to ensure data integrity in electrically noisy industrial environments where MC33PF8200CLES is commonly deployed.
Can the MC33PF8200CLES be used in functional safety–certified systems?
Yes, the MC33PF8200CLES incorporates multiple features aligned with IEC 61508 SIL-2 requirements, including dual independent watchdogs, rail fault latching, SPI command timeout detection, and hardware-initiated safe shutdown via RESET_B. While system-level certification remains the integrator's responsibility, MC33PF8200CLES provides the foundational safety mechanisms needed to achieve SIL-2 in PLC, robotics, and BMS applications.
How many power rails does the MC33PF8200CLES manage, and what types are they?
The MC33PF8200CLES manages exactly 12 regulated power rails: six synchronous buck converters (each rated up to 1.5 A) and six low-noise LDO regulators (each rated up to 300 mA). All rails are independently configurable for voltage, enable timing, soft-start, and fault response. This architecture allows MC33PF8200CLES to replace multiple discrete regulators in i.MX 6/7-based industrial controllers without compromising flexibility or reliability.
Is there an evaluation board available for the MC33PF8200CLES?
Yes, the FRDM-PF8200 evaluation board is officially supported for MC33PF8200CLES development. It includes USB-to-SPI bridge, onboard debug interface, jumper-configurable rail loads, and GUI-based configuration software compatible with Windows and Linux. The board enables rapid validation of sequencing profiles, fault injection testing, and thermal characterization-accelerating design-in of MC33PF8200CLES into industrial control and automation platforms.
MC33PF8200CLES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200CLES FAQ
1.How can I place an order for MC33PF8200CLES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200CLES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200CLES reliable?
The price and inventory of MC33PF8200CLES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200CLES is usually 5 days.
3.What payment methods are accepted for MC33PF8200CLES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200CLES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200CLES?
MC33PF8200CLES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200CLES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200CLES?
For technical support, including MC33PF8200CLES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200CLES requirements.
6.How does Aetrix verify that MC33PF8200CLES is sourced from the original manufacturer or authorized distributors?
All MC33PF8200CLES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200CLES meets industry standards.
7.What is the process for return or replacement of MC33PF8200CLES?
All MC33PF8200CLES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200CLES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200CLES part is unused and in its original packaging.
Return procedure for MC33PF8200CLES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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