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NXP Semiconductors MC33PF8200CXES
- Part No.:
- MC33PF8200CXES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200CXES.pdf
- Description:
- IC POWER MANAGEMENT LS1043A
- Quantity:
- Payment:
- Shipping:
Inventory:4,422
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Product details
Overview
MC33PF8200CXES from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for LS1043A processors with LPDDR4 memory. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B safety monitoring. It operates from 2.7 V to 5.5 V input and supports dynamic voltage scaling for CPU/memory rails in infotainment and ADAS systems.
For engineers reviewing the MC33PF8200CXES datasheet, MC33PF8200CXES pinout, MC33PF8200CXES application, or MC33PF8200CXES equivalent, this page delivers verified technical context, validated pin functions, confirmed ASIL B safety architecture, I²C-configurable regulator sequencing, and real-world use cases for i.MX/S32x-based automotive platforms.
Technical Context
The MC33PF8200CXES implements a dual-phase capable buck architecture: SW1–SW2, SW3–SW4, and SW5–SW6 support phase interleaving up to 10 A total; SW7 provides independent 2.5 A output (1.0–4.1 V). Its integrated state machine executes OTP-programmed power-up/down sequences, monitors 24 analog channels via AMUX, and enforces fail-safe shutdown on thermal, voltage, or watchdog faults.
ASIL B compliance is achieved through independent voltage monitors (SWx/LDOx), programmable fault counters, ABIST self-test, CRC-protected I²C writes, and dedicated FSOB safety output. The device uses OTP memory to store startup configuration-eliminating external resistors-and supports 3.4 MHz I²C for runtime tuning of output voltages, timing, and protection thresholds.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7 V to 5.5 V VIN - powers all internal regulators and enables operation across automotive battery transients. |
| Buck Regulators | 7 channels: SW1–SW6 (0.4–1.8 V, ±1.5% accuracy, 2.5 A); SW7 (1.0–4.1 V, ±2%, 2.5 A) - supplies core, I/O, memory, and auxiliary rails. |
| LDO Regulators | 4 channels: LDO1–LDO4 (1.5–5.0 V, ±3%, 400 mA each) - delivers low-noise bias for analog/RTC/peripherals with optional load switch mode. |
| VSNVS Output | 1.8 V / 3.0 V / 3.3 V, 10 mA - RTC backup supply with coin cell charging (programmable current/voltage) for non-volatile timekeeping. |
| Safety Certification | Automotive ASIL B - includes independent voltage/thermal monitoring, ABIST, FSOB fail-safe output, and CRC-protected register access. |
| I²C Interface | Up to 3.4 MHz - enables fast runtime reconfiguration of output voltages, sequencing, and fault thresholds without firmware reload. |
| Package | HVQFN56, 8 mm × 8 mm × 0.9 mm, wettable flank - thermally enhanced for automotive under-hood thermal dissipation (RθJA = 22 °C/W on 4-layer board). |
Pinout & Package
HVQFN56 package with 56 terminals, 0.5 mm pitch, exposed thermal pad (EPAD) connected to ground. Wettable flank design supports automated optical inspection (AOI) for automotive manufacturing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | DNC1 | Do not connect - unused pin; must be left floating or grounded per layout guidelines. |
| 2–3, 12–13, 30–31, 38 | SWxBF | Buck feedback inputs (SW1FB–SW7FB) - enable precise closed-loop regulation of each buck output voltage. |
| 4–7, 8–11, 32, 35, 37 | SWxIN | Buck input supplies (SW1IN–SW7IN) - accept filtered input from main VIN or intermediate rails; require local decoupling. |
| 5–6, 9–10, 33–34, 36 | SWxLX | Switching node outputs (SW1LX–SW7LX) - connect directly to external inductors; tolerate −3.0 V transient spikes during dead time. |
| 15, 18, 25, 28 | LDOxOUT | LDO regulated outputs (LDO1OUT–LDO4OUT) - deliver low-noise, fixed or programmable voltages to analog/RTC/peripheral circuits. |
| 40–41 | V1P5D / V1P5A | Digital/analog 1.5 V core supplies - dedicated low-noise outputs for processor subsystems requiring separate power domains. |
| 47 | VSNVS | RTC supply output - selectable 1.8/3.0/3.3 V rail backed by coin cell; maintains real-time clock during main power loss. |
| 46 | LICELL | Coin cell input - accepts 0–4.2 V battery; enables autonomous RTC operation and memory retention without main power. |
| 55–56 | SCL / SDA | I²C interface - supports 3.4 MHz high-speed mode for rapid register read/write during system boot and runtime adaptation. |
| 42, 21, 24, 29, 39, 44 | PGOOD / RESETBMCU / INTB / FSOB / XINTB / XFAILB | System control and safety signaling - provide power-good status, MCU reset, interrupt alerts, fail-safe assertion, and external sync capability. |
Key Features
| Feature | Design Value |
|---|---|
| Dual/triple/quad-phase buck configuration | SW1–SW2, SW3–SW4, SW5–SW6 support interleaved operation; SW1–SW3 triple-phase delivers up to 7.5 A; SW1–SW4 quad-phase delivers up to 10 A - reduces ripple and improves transient response for high-current CPU cores. |
| VTT termination mode on SW6 | Enables DDR memory VTT supply with programmable current limit - eliminates need for external termination IC in LPDDR4/DDR4 designs. |
| 24-channel analog multiplexer (AMUX) | Routes internal voltage/temperature monitors to single output pin (AMUX) - simplifies system-level diagnostics and reduces external ADC channel count. |
| OTP-programmed startup sequence | Stores voltage targets, timing, and enable order in one-time programmable memory - removes external configuration resistors and accelerates design bring-up. |
| Fail-safe output (FSOB) | Dedicated open-drain safety pin asserting LOW on critical faults (thermal runaway, UV/OV, watchdog timeout) - triggers hardware-level system shutdown independent of software. |
| ABIST and CRC-protected registers | On-chip analog built-in self-test validates voltage monitors pre-startup; I²C writes to safety-critical registers require CRC check - ensures functional safety integrity per ISO 26262. |
Applications
| Automotive Infotainment Head Unit | ADAS Domain Controller |
|---|---|
|
Use Scenario: Powering i.MX8QM or S32G2 processors with LPDDR4 memory, GPU, display interfaces, and audio codecs in vehicle head units. IC Role / Device Role / Timing Role: Primary PMIC managing 7 buck rails (CPU, GPU, DDR, I/O), 4 LDOs (audio, sensor, RTC), and VSNVS backup in a single chip. Use Value: Reduces BOM count by eliminating discrete DC-DCs and LDOs; OTP configuration cuts bring-up time; ASIL B monitoring satisfies functional safety requirements. |
Use Scenario: Supplying S32V234 vision processor with DDR3L memory, camera ISPs, and Ethernet PHYs in front-camera or surround-view systems. IC Role / Device Role / Timing Role: Centralized power controller delivering sequenced, monitored, and fault-protected rails for multi-core vision SoC and peripherals. Use Value: Integrated VTT on SW6 eliminates external termination IC; 24-channel AMUX enables real-time thermal/voltage telemetry; FSOB provides hardware-level fail-safe shutdown. |
| Commercial Vehicle Telematics Gateway | Industrial Edge Compute Module |
|
Use Scenario: Powering LS1043A-based gateways handling CAN FD, cellular modems, GNSS, and secure boot in heavy-duty trucks and buses. IC Role / Device Role / Timing Role: Automotive-qualified PMIC providing robust 12-rail power with extended temperature range (−40°C to +105°C) and ASIL B monitoring. Use Value: Coin cell charger (LICELL) maintains secure key storage during ignition-off; watchdog and PGOOD ensure reliable modem/ECU communication uptime. |
Use Scenario: Supporting i.MX8QXP in ruggedized edge AI modules for factory automation, requiring LPDDR4, PCIe, and industrial I/O isolation. IC Role / Device Role / Timing Role: High-reliability PMIC delivering stable, configurable, and monitored power to compute-intensive workloads in harsh environments. Use Value: Spread-spectrum switching reduces EMI in dense PCB layouts; dynamic voltage scaling lowers active power consumption; OTP lock prevents field configuration tampering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DBES | Optimized for i.MX8QM LPDDR4 PMIC2 role; identical buck/LDO count and ASIL B safety features but different OTP configuration targeting secondary power domain. | Used as companion PMIC in dual-PMIC i.MX8QM designs (e.g., PMIC1 for CPU, PMIC2 for DDR/GPU); not intended as standalone replacement for CXES. | Select DBES only when implementing split-power architecture with MC33PF8200CXES as primary PMIC for LS1043A. |
| MC33PF8200DEES | Targeted at i.MX8QXP LPDDR4 systems; shares same HVQFN56 package, 7-buck/4-LDO topology, and ASIL B safety engine, but OTP programmed for QXP-specific sequencing and voltage targets. | Valid for i.MX8QXP-based infotainment, but lacks LS1043A-specific startup timing and memory rail configurations embedded in CXES OTP. | Choose DEES for QXP designs; CXES remains mandatory for LS1043A due to processor-specific OTP calibration and power tree mapping. |
Compared with MC33PF8200DBES and MC33PF8200DEES, the MC33PF8200CXES uniquely integrates LS1043A-optimized OTP configuration, enabling correct power-up sequencing, LPDDR4 VDDQ/VTT timing, and thermal throttling behavior without external firmware intervention.
Availability
MC33PF8200CXES is available at Aetrix Electronics and suitable for automotive infotainment, ADAS domain controllers, and telematics gateways requiring stable component supply, ASIL B certification, and long-term lifecycle support.
Supply support for MC33PF8200CXES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in processor and power management integration.
The PF8200 product line was engineered specifically for NXP's high-performance i.MX 8 and S32x application processors, delivering tightly coupled, safety-certified power delivery with minimal external components and maximum configurability via OTP and I²C.
FAQ
What is the primary processor target for MC33PF8200CXES?
The MC33PF8200CXES is specifically configured for the NXP LS1043A communications processor with LPDDR4 memory. Its OTP memory contains LS1043A-optimized power-up sequencing, voltage targets, and timing parameters - making it unsuitable for direct substitution in i.MX8QM or S32V234 designs without reprogramming (which is not supported due to one-time programmability).
Does MC33PF8200CXES support VTT termination for DDR memory?
Yes, MC33PF8200CXES supports VTT termination on SW6, configurable via OTP or I²C. This allows direct sourcing of DDR/LPDDR4 VTT rails up to 2.5 A without external termination ICs - a key feature for space-constrained automotive memory subsystems.
How does MC33PF8200CXES achieve ASIL B compliance?
MC33PF8200CXES achieves ASIL B compliance through independent voltage/thermal monitors per regulator, ABIST self-test at startup, CRC-protected I²C register writes, fail-safe output (FSOB), and programmable fault counters - all documented in NXP's ISO 26262-ready safety manual for the PF8200 family.
Can MC33PF8200CXES operate without I²C configuration after startup?
Yes, MC33PF8200CXES relies entirely on its OTP memory for initial power-up: voltages, sequencing, timing, and safety thresholds are pre-programmed. I²C is optional for runtime tuning (e.g., dynamic voltage scaling) but not required for basic operation - ensuring deterministic behavior even if host firmware fails.
What is the function of the LICELL pin on MC33PF8200CXES?
The LICELL pin on MC33PF8200CXES accepts a 0–4.2 V coin cell battery to back up the VSNVS rail (1.8/3.0/3.3 V, 10 mA), enabling real-time clock operation and secure memory retention during main power loss - critical for automotive black-box logging and secure boot integrity.
MC33PF8200CXES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200CXES FAQ
1.How can I place an order for MC33PF8200CXES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200CXES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200CXES reliable?
The price and inventory of MC33PF8200CXES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200CXES is usually 5 days.
3.What payment methods are accepted for MC33PF8200CXES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200CXES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200CXES?
MC33PF8200CXES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200CXES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200CXES?
For technical support, including MC33PF8200CXES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200CXES requirements.
6.How does Aetrix verify that MC33PF8200CXES is sourced from the original manufacturer or authorized distributors?
All MC33PF8200CXES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200CXES meets industry standards.
7.What is the process for return or replacement of MC33PF8200CXES?
All MC33PF8200CXES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200CXES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200CXES part is unused and in its original packaging.
Return procedure for MC33PF8200CXES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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