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NXP Semiconductors MC33PF8200CXESR2
- Part No.:
- MC33PF8200CXESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200CXESR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX8 PRE-PR
- Quantity:
- Payment:
- Shipping:
Inventory:3,107
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Product details
Overview
MC33PF8200CXESR2 from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for LS1043A-based systems requiring ASIL B functional safety compliance. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and 24-channel analog multiplexer. It delivers precise voltage regulation for CPU cores, LPDDR4 memory, and peripherals in infotainment and ADAS edge compute platforms.
For engineers reviewing the MC33PF8200CXESR2 datasheet, MC33PF8200CXESR2 pinout, MC33PF8200CXESR2 application, or MC33PF8200CXESR2 equivalent, key selection criteria include ASIL B safety monitoring, OTP-configurable startup sequencing, dynamic voltage scaling across six buck channels, I²C interface up to 3.4 MHz, and thermal shutdown with junction temperature limit of 150 °C.
Technical Context
The MC33PF8200CXESR2 implements a dual-domain architecture: a safety-critical domain with ABIST, programmable fault counters (FS_CNT[3:0]), fail-safe output (FSOB), and CRC-protected register access; and a flexible power domain supporting multi-phase configurations (e.g., SW1–SW3 triple-phase up to 7.5 A) and VTT termination on SW6. Its state machine enforces strict power-up sequencing, self-test validation (STEST_NOK), and fail-safe transitions triggered by thermal, voltage, or watchdog faults.
It operates from a 2.7–5.5 V main input (VIN), supports coin cell backup (LICELL ≤ 4.2 V), and provides hardware-selectable LDO2 output via VSELECT. All seven buck outputs feature programmable current limits, spread-spectrum modulation, and manual frequency tuning - critical for EMI-sensitive automotive applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Main input voltage range | VIN = 2.7 V to 5.5 V - powers all internal regulators and enables operation across automotive battery transients |
| Buck regulator count & type | 7 buck converters (SW1–SW7) - SW1–SW6 support 0.4–1.8 V @ 2.5 A; SW7 supports 1.0–4.1 V @ 2.5 A for auxiliary rails |
| LDO regulator count & capability | 4 LDOs (LDO1–LDO4), each 1.5–5.0 V @ 400 mA ±3% accuracy - configurable as load switches for power-gating peripherals |
| Safety certification | ASIL B compliant - includes independent voltage/thermal monitoring, ABIST, FSOB fail-safe output, and OTP-controlled fault response |
| I²C interface speed | Up to 3.4 MHz - enables fast runtime reconfiguration of voltage levels, sequencing, and protection thresholds |
| Package | HVQFN56, 8 mm × 8 mm × 0.9 mm, 0.5 mm pitch, wettable flank - optimized for automated optical inspection and thermal dissipation (RθJC = 0.6 °C/W) |
| Operating temperature | −40 °C to +105 °C ambient - qualified per AEC-Q100 Grade 2 for under-hood and cockpit environments |
Pinout & Package
HVQFN56 package with exposed thermal pad (EPAD), 0.5 mm pitch, 8 mm × 8 mm body, and dimple wettable flanks for solder joint reliability in automotive reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | DNC1 | Do not connect - no internal connection; must remain floating or grounded per layout guidelines |
| 2–3, 12–13, 30–31, 38 | SWxFB (x=1–7) | Buck output voltage feedback - high-impedance inputs enabling precision closed-loop regulation with external resistor dividers |
| 4–7, 8–11, 32, 35, 37 | SWxIN (x=1–7) | Buck input supply - accepts 2.7–5.5 V input; requires local ceramic decoupling per channel |
| 5–6, 9–10, 33–34, 36 | SWxLX (x=1–7) | Switching node - connects to external low-loss inductor; tolerates −3.0 V transient spikes during dead time |
| 15, 18, 25, 28 | LDOxOUT (x=1–4) | LDO regulated output - delivers stable 1.5–5.0 V @ 400 mA with optional load switch control |
| 17, 26–27 | LDOxIN (x=1–4) | LDO input supply - shared LDO12IN for LDO1/LDO2; dedicated inputs for LDO3/LDO4 |
| 40–41 | V1P5D / V1P5A | Digital/analog 1.5 V core supplies - internally generated, low-noise outputs for PMIC logic and reference circuits |
| 46 | LICELL | Coin cell input - powers VSNVS RTC rail and enables battery-backed memory during main power loss |
| 47 | VSNVS | RTC supply output - selectable 1.8/3.0/3.3 V @ 10 mA for secure non-volatile context retention |
| 55–56 | SCL / SDA | I²C bus interface - supports standard/fast/fast-plus modes up to 3.4 MHz for real-time configuration |
| 42, 21, 24, 20, 29 | PGOOD / RESETBMCU / INTB / EWARN / FSOB | System status signaling - open-drain outputs for power-good indication, MCU reset, interrupt alerts, early warning, and fail-safe assertion |
Key Features
| Feature | Design Value |
|---|---|
| ASIL B functional safety architecture | Includes ABIST, FSOB fail-safe output, programmable fault counters (FS_CNT), and CRC-protected safety registers - eliminates need for external safety monitors in ISO 26262-compliant designs |
| OTP-configurable power sequencing | One-time programmable memory stores startup order, voltage targets, and timing delays - reduces external components and ensures repeatable boot behavior across production units |
| Multi-phase buck configuration | SW1–SW3 support triple-phase mode (7.5 A total); SW1–SW4 support quad-phase (10 A) - enables high-current CPU core rails without external phase controllers |
| VTT termination on SW6 | Configurable as DDR VTT supply (0.4–1.8 V) with current-sink capability - directly supports LPDDR4/DDR4 memory termination without discrete components |
| 24-channel analog multiplexer | Enables system-level diagnostics by routing internal voltages, temperatures, and reference signals to a single ADC - reduces BOM cost and PCB area vs. discrete monitoring solutions |
| Secure I²C write capability | Hardware-enforced write protection for safety-critical registers (e.g., FSOB enable, fault thresholds) - prevents accidental or malicious corruption during runtime |
Applications
| Automotive Infotainment Head Unit | ADAS Edge Compute Module |
|---|---|
Use Scenario: Powering i.MX8QM processor, LPDDR4 memory, and display/video interfaces in a vehicle head unit with CAN/FlexRay connectivity. IC Role / Device Role / Timing Role: Primary PMIC managing CPU core (SW1–SW3 triple-phase), GPU (SW4), memory VDD/VTT (SW5/SW6), and always-on RTC (VSNVS). Use Value: ASIL B monitoring ensures safe shutdown during overtemperature or undervoltage events; OTP sequencing guarantees deterministic boot for regulatory compliance. |
Use Scenario: Supplying S32V234 vision processor, image sensors, and Ethernet AVB in a front-camera ADAS domain controller. IC Role / Device Role / Timing Role: Central power hub delivering 1.0 V core (SW7), 0.85 V DDR3L (SW6), 1.8 V I/O (SW2), and 3.3 V peripherals (LDO2/LDO4). Use Value: Spread-spectrum switching and 24-channel AMUX enable EMI-constrained sensor fusion while providing real-time rail health telemetry to host MCU. |
| Industrial Gateway Controller | Connected Vehicle Telematics Unit |
Use Scenario: Powering LS1043A multicore SoC, eMMC, SIM card, and cellular modem in a ruggedized industrial gateway operating at −40 °C to +85 °C. IC Role / Device Role / Timing Role: Single-chip solution for all DC-DC and LDO requirements, including coin-cell-backed RTC (VSNVS) and modem power sequencing (LDO3/LDO4 load switches). Use Value: Extended temperature rating and AEC-Q100 qualification ensure long-term reliability in harsh environments; I²C configurability supports firmware updates to adapt to new peripheral loads. |
Use Scenario: Managing power for LTE/5G modem, GNSS receiver, CAN FD interface, and OTA update storage in a telematics control unit (TCU). IC Role / Device Role / Timing Role: Dual-role PMIC: primary regulator for modem SoC (SW1–SW4), secondary supervisor for battery-backed security module (VSNVS + LICELL charger). Use Value: Programmable soft-start prevents inrush current during modem wake-up; watchdog integration (WDI/RESETBMCU) enables autonomous recovery from communication lockups. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8100CXTS | Automotive PF8100 variant with QM (non-ASIL) safety grade; lacks ABIST, FSOB, FS_CNT, and secure I²C registers | Targeted for non-safety-critical i.MX8QXP/LPDDR4 systems where functional safety certification is not required | Select only if ASIL B compliance is unnecessary and cost sensitivity outweighs safety feature requirements |
| MPQ4436-AEC1 | Single 3A buck converter (no PMIC integration); AEC-Q100 Grade 1; no LDOs, OTP, I²C, or safety features | Used as discrete replacement for one buck channel only - cannot replace full 12-channel functionality of MC33PF8200CXESR2 | Consider only for partial redesign where modular power delivery is preferred over integrated PMIC architecture |
Compared with MC33PF8200CXESR2, MC33PF8100CXTS omits all ASIL B safety mechanisms and failsafe outputs, making it unsuitable for ISO 26262 applications; MPQ4436-AEC1 provides no system-level integration, requiring 11 additional ICs to match the full 12-rail capability and safety architecture.
Availability
MC33PF8200CXESR2 is available at Aetrix Electronics and suitable for automotive infotainment, ADAS edge compute, and connected vehicle telematics applications requiring stable component supply, AEC-Q100 qualification, and ASIL B functional safety compliance.
Supply support for MC33PF8200CXESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based application processors and power management.
The PF8200 product line was engineered specifically for NXP's i.MX 8 and S32x processor families, delivering tightly coupled, safety-certified power delivery with minimal external components and deterministic startup behavior.
FAQ
What is the safety qualification level of the MC33PF8200CXESR2?
The MC33PF8200CXESR2 is certified to ASIL B per ISO 26262, with built-in functional safety features including ABIST, fail-safe output (FSOB), programmable fault counters (FS_CNT), CRC-protected registers, and independent voltage/thermal monitoring - all verified in the device's safety manual and supported by NXP's FMEDA report.
Does the MC33PF8200CXESR2 support LPDDR4 memory power delivery?
Yes, the MC33PF8200CXESR2 supports LPDDR4 memory through dedicated rails: SW5 and SW6 provide configurable VDDQ and VTT supplies, while VSNVS delivers the 1.8 V/3.0 V/3.3 V RTC rail. Its OTP configuration and I²C interface allow precise voltage sequencing and dynamic scaling aligned with LPDDR4 JEDEC specifications.
How does the MC33PF8200CXESR2 handle power-up sequencing?
The MC33PF8200CXESR2 uses on-chip OTP memory to store and execute a deterministic power-up sequence - including voltage ramp rates, enable timing, and inter-rail dependencies - eliminating external sequencing ICs. This sequence is validated during startup and enforced by the integrated state machine before releasing PGOOD.
Can the MC33PF8200CXESR2 be used with non-NXP processors?
Yes, the MC33PF8200CXESR2 is compatible with non-NXP processors such as LS1043A (as indicated in its ordering table) and other high-performance SoCs. Its 3.4 MHz I²C interface, programmable regulators, and flexible LDO configurations allow adaptation to diverse voltage and sequencing requirements beyond i.MX and S32x families.
What package type and thermal performance does the MC33PF8200CXESR2 use?
The MC33PF8200CXESR2 uses the HVQFN56 package (8 mm × 8 mm × 0.9 mm) with dimple wettable flanks and an exposed thermal pad. Its thermal resistance is RθJC = 0.6 °C/W and RθJA = 22 °C/W on an eight-layer board, enabling reliable operation up to 105 °C ambient with proper PCB copper pour and thermal vias under the EPAD.
MC33PF8200CXESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200CXESR2 FAQ
1.How can I place an order for MC33PF8200CXESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200CXESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200CXESR2 reliable?
The price and inventory of MC33PF8200CXESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200CXESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF8200CXESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200CXESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200CXESR2?
MC33PF8200CXESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200CXESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200CXESR2?
For technical support, including MC33PF8200CXESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200CXESR2 requirements.
6.How does Aetrix verify that MC33PF8200CXESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF8200CXESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200CXESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF8200CXESR2?
All MC33PF8200CXESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200CXESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200CXESR2 part is unused and in its original packaging.
Return procedure for MC33PF8200CXESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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