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NXP Semiconductors MC33PF8200D2ES
- Part No.:
- MC33PF8200D2ES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200D2ES.pdf
- Description:
- MC33PF8200D2ES - Power Managemen
- Quantity:
- Payment:
- Shipping:
Inventory:368
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Product details
Overview
MC33PF8200D2ES from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for S32V234 processor systems requiring DDR3L memory support and 10 A core rail delivery. It integrates seven high-efficiency buck converters (including SW1–SW7), four linear regulators, RTC supply with coin cell charger, ASIL B safety monitoring, and OTP-configurable startup sequencing. It delivers precise voltage regulation for CPU, GPU, memory I/O, and peripherals in advanced driver-assistance systems (ADAS).
For engineers reviewing the MC33PF8200D2ES datasheet, MC33PF8200D2ES pinout, MC33PF8200D2ES application, or MC33PF8200D2ES equivalent, key selection criteria include its ASIL B functional safety compliance, 7-buck + 4-LDO architecture, 3.4 MHz I²C interface, HVQFN56 thermal-enhanced package, and S32V234-specific DDR3L memory power tree configuration.
Technical Context
The MC33PF8200D2ES implements a dual-phase capable buck regulator architecture: SW1–SW2, SW3–SW4, and SW5–SW6 can be paired for higher current delivery, while SW1–SW3 support triple-phase operation up to 7.5 A and SW1–SW4 quad-phase up to 10 A - directly enabling the 10 A core rail specified for its S32V234 target application. Its internal state machine handles fault detection, watchdog supervision, and fail-safe transitions including FSOB assertion and hard reset coordination.
It features dedicated safety circuitry including independent voltage/thermal monitors, ABIST (analog built-in self-test), CRC-protected register writes, and programmable fault counters - all validated to meet ASIL B requirements per ISO 26262. The OTP memory stores boot-time configurations for output voltages, sequencing order, and safety thresholds, reducing external component count and startup latency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 7 buck converters + 4 LDOs + VSNVS RTC supply - provides complete power tree for S32V234 SoC, DDR3L memory, and auxiliary peripherals. |
| Buck Output Range | SW1–SW6: 0.4 V to 1.8 V (6.25 mV steps); SW7: 1.0 V to 4.1 V - supports dynamic voltage scaling for CPU/GPU cores and I/O rails. |
| Max Output Current | 2.5 A per buck channel; up to 10 A via quad-phase SW1–SW4 configuration - meets 10 A core rail requirement for S32V234 DDR3L system. |
| I²C Interface Speed | Up to 3.4 MHz - enables fast runtime reconfiguration of voltage levels, sequencing, and safety parameters during system operation. |
| Safety Certification | ASIL B compliant monitoring circuit - includes independent voltage/thermal fault detection, ABIST, CRC-protected registers, and fail-safe output (FSOB). |
| Package | HVQFN56, 8 mm × 8 mm × 0.9 mm, wettable flank - optimized for automotive thermal performance and automated optical inspection (AOI) in production. |
| Operating Temp | −40 °C to +105 °C ambient - qualified for under-hood and cockpit ADAS applications per AEC-Q100 Grade 2. |
Pinout & Package
HVQFN56 thermally enhanced package (SOT684-29(D)), 0.5 mm pitch, 8 mm × 8 mm body with 0.1 mm dimple wettable flank for reliable solder joint inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable precision closed-loop regulation (±1.5 % for SW1–SW6, ±2 % for SW7) with external resistor dividers. |
| SW1IN–SW7IN | Buck input supplies | Accept 2.7 V to 5.5 V input; SW1–SW6 share VIN domain, SW7 may use separate input for isolation. |
| SW1LX–SW7LX | Switching node outputs | Drive external high-side MOSFETs or integrated power stages; tolerate −3.0 V transient spikes during dead time. |
| LDO1OUT–LDO4OUT | Linear regulator outputs | Deliver 1.5 V to 5.0 V at 400 mA each with 3 % accuracy; support load switch mode for controlled peripheral power gating. |
| VSNVS | RTC supply output | Provides 1.8 V / 3.0 V / 3.3 V at 10 mA from main supply or coin cell - maintains real-time clock and backup memory during main power loss. |
| SCL/SDA | I²C interface | 3.4 MHz high-speed bus for runtime configuration, telemetry readback, and safety register access. |
| FSOB | Fail-safe output | Open-drain signal asserted low during critical faults (thermal, voltage, watchdog timeout) to trigger system-level safe state entry. |
| RESETBMCU | MCU reset output | Open-drain active-low reset signal synchronized to PMIC power-up sequence and fault conditions. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-/triple-/quad-phase buck configuration | SW1–SW2, SW3–SW4, SW5–SW6 support dual-phase; SW1–SW3 enable triple-phase (7.5 A); SW1–SW4 enable quad-phase (10 A) - matches S32V234 core rail demand. |
| VTT termination mode on SW6 | Configurable as DDR3L VTT supply with precise 0.6 × VDDQ tracking - eliminates need for external termination regulator. |
| OTP-based startup configuration | One-time programmable memory stores voltage setpoints, power-up/down sequences, and safety thresholds - removes external resistors and simplifies BOM. |
| 24-channel analog multiplexer (AMUX) | Enables system-level diagnostics by routing internal voltage/temperature monitor outputs to a single ADC input - reduces external sensing components. |
| ASIL B functional safety subsystem | Includes independent voltage/thermal monitors, ABIST, CRC-protected I²C writes, and fail-safe output (FSOB) - certified for automotive safety-critical domains. |
| Coin cell charger with programmable control | Charges backup battery at user-defined current/voltage; supports seamless RTC and SRAM retention during main power interruption. |
Applications
| ADAS Camera Processing Unit | S32V234-Based Vision ECU |
|---|---|
Use Scenario: High-resolution stereo camera module processing real-time object detection and lane recognition in automotive forward-facing ADAS. IC Role / Device Role / Timing Role: Primary PMIC supplying S32V234 SoC core (10 A), DDR3L memory, image sensor I/O, and ISP peripherals with ASIL B–compliant monitoring. Use Value: Enables deterministic power sequencing, failsafe shutdown on thermal/voltage fault, and uninterrupted RTC operation during ignition cycling. |
Use Scenario: Central vision electronic control unit integrating multiple camera inputs, radar fusion, and neural network inference acceleration. IC Role / Device Role / Timing Role: Delivers tightly regulated 0.8 V core, 1.2 V GPU, 1.5 V DDR3L VDDQ, and 0.75 V VTT rails with dynamic voltage scaling synchronized to workload. Use Value: Quad-phase SW1–SW4 configuration meets 10 A peak core demand; VTT mode on SW6 ensures DDR3L signal integrity without external components. |
| Automotive Infotainment Head Unit | Robo-Taxi Sensor Fusion Hub |
Use Scenario: Next-generation infotainment platform combining navigation, voice assistant, and driver monitoring using S32V234 alongside display and audio processors. IC Role / Device Role / Timing Role: Powers S32V234 application processor, LPDDR4 memory (via companion PMIC), display interface, and audio codec with low-noise LDOs. Use Value: 3.4 MHz I²C allows rapid runtime adjustment of display backlight and audio rail voltages; OTP reduces boot time by eliminating external configuration. |
Use Scenario: Autonomous vehicle compute module aggregating data from cameras, LiDAR, ultrasonic sensors, and GNSS for real-time path planning. IC Role / Device Role / Timing Role: Provides redundant, ASIL B–monitored power to dual S32V234 processors and safety-critical communication interfaces (CAN FD, Ethernet AVB). Use Value: FSOB output triggers hardware-level safe state on any detected fault; 24-channel AMUX enables centralized health monitoring across all sensor power rails. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DBES | Optimized for i.MX8QM LPDDR4 memory PMIC2 role; lacks S32V234-specific DDR3L timing and 10 A core rail tuning. | Targets NXP i.MX8QM-based infotainment, not S32V234 ADAS vision systems. | Select MC33PF8200D2ES when powering S32V234 with DDR3L and requiring 10 A core capability; DBES is unsuitable due to mismatched memory interface and safety configuration. |
| MC33PF8200DHES | Configured for i.MX8QM DDR4 memory PMIC2; supports different VDDQ/VTT ranges and lacks S32V234 OTP firmware and ASIL B validation for vision workloads. | Designed for high-end multimedia gateways, not automotive vision processing with strict thermal/fault response requirements. | MC33PF8200D2ES is required for S32V234 DDR3L systems; DHES does not provide the validated 10 A quad-phase core rail or DDR3L VTT tracking needed. |
Compared with MC33PF8200DBES and MC33PF8200DHES, the MC33PF8200D2ES uniquely delivers S32V234-optimized 10 A core rail via quad-phase buck configuration, DDR3L-specific VTT termination, and ASIL B–certified safety logic - making it the only validated option for production ADAS vision ECUs.
Availability
MC33PF8200D2ES is available at Aetrix Electronics and suitable for automotive ADAS camera modules, S32V234-based vision ECUs, and robotic vehicle sensor fusion hubs requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 qualified sourcing.
Supply support for MC33PF8200D2ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive processors and power management.
The PF8200 product line is engineered specifically for NXP's S32x automotive processors, delivering integrated, ASIL B–compliant power delivery with configurable multi-phase buck regulation and comprehensive safety monitoring for ADAS and autonomous driving systems.
FAQ
What processor and memory configuration is the MC33PF8200D2ES specifically designed for?
The MC33PF8200D2ES is factory-configured for the NXP S32V234 processor with DDR3L memory, delivering a 10 A core rail via quad-phase SW1–SW4 operation and supporting DDR3L-specific VTT termination on SW6. Its OTP firmware and safety settings are validated exclusively for this target application.
Does the MC33PF8200D2ES support ASIL B functional safety, and how is it implemented?
Yes, the MC33PF8200D2ES implements ASIL B–compliant safety features including independent voltage/thermal monitors, analog built-in self-test (ABIST), CRC-protected I²C register writes, programmable fault counters, and a dedicated fail-safe output (FSOB). These are enabled and validated in its OTP configuration for S32V234 ADAS use cases.
What is the purpose of the FSOB pin on the MC33PF8200D2ES?
The FSOB (Fail-Safe Output) pin on the MC33PF8200D2ES is an open-drain output that asserts low during critical faults - including overtemperature, undervoltage/overvoltage on any monitored rail, watchdog timeout, or ABIST failure. It directly signals the host system to enter a defined safe state, as required for ASIL B compliance.
Can the MC33PF8200D2ES be used with processors other than the S32V234?
The MC33PF8200D2ES is OTP-programmed for S32V234 + DDR3L operation and cannot be reconfigured for other processors. While the underlying PF8200 silicon supports i.MX8 and LS series processors, the D2ES variant's firmware, safety settings, and power tree are fixed and unmodifiable - limiting its use to the intended S32V234 application.
What package type and thermal characteristics does the MC33PF8200D2ES use?
The MC33PF8200D2ES uses the HVQFN56 package (SOT684-29(D)), 8 mm × 8 mm × 0.9 mm with dimple wettable flanks. Its thermal resistance is RθJA = 22 °C/W on a 4-layer board, supporting operation from −40 °C to +105 °C ambient, and is qualified to AEC-Q100 Grade 2 for automotive under-hood deployment.
MC33PF8200D2ES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Bulk
- Product Status:
- Active
- Applications:
- -
- Current - Supply:
- -
- Voltage - Supply:
- 2.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200D2ES FAQ
1.How can I place an order for MC33PF8200D2ES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200D2ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200D2ES reliable?
The price and inventory of MC33PF8200D2ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200D2ES is usually 5 days.
3.What payment methods are accepted for MC33PF8200D2ES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200D2ES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200D2ES?
MC33PF8200D2ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200D2ES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200D2ES?
For technical support, including MC33PF8200D2ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200D2ES requirements.
6.How does Aetrix verify that MC33PF8200D2ES is sourced from the original manufacturer or authorized distributors?
All MC33PF8200D2ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200D2ES meets industry standards.
7.What is the process for return or replacement of MC33PF8200D2ES?
All MC33PF8200D2ES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200D2ES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200D2ES part is unused and in its original packaging.
Return procedure for MC33PF8200D2ES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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