My Inquiry
My Account
NXP Semiconductors MC33PF8200D2ESR2
- Part No.:
- MC33PF8200D2ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200D2ESR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX8 PRE-PR
- Quantity:
- Payment:
- Shipping:
Inventory:1,542
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC33PF8200D2ESR2 from NXP Semiconductors is an automotive-grade power management IC (PMIC) designed for S32V234 processor systems, delivering 12 regulated outputs: seven high-efficiency buck converters (SW1–SW7) and four linear regulators (LDO1–LDO4), plus RTC supply (VSNVS) and coin cell charging. It supports ASIL B functional safety, features OTP-based startup configuration, and operates from 2.7 V to 5.5 V input.
For engineers reviewing the MC33PF8200D2ESR2 datasheet, MC33PF8200D2ESR2 pinout, MC33PF8200D2ESR2 application, or MC33PF8200D2ESR2 equivalent, this page provides verified technical context, validated pin functions, confirmed safety-critical monitoring capabilities, and real-world automotive use cases aligned with S32V234 vision processing platforms.
Technical Context
The MC33PF8200D2ESR2 implements a dual-domain architecture: a digital control core managing I²C (up to 3.4 MHz), state machine sequencing, and OTP configuration; and an analog power domain integrating seven synchronous buck regulators (SW1–SW7) with programmable DVS, VTT termination on SW6, and four P-type LDOs with load-switch options. All regulators support hardware- and software-controlled enable/standby modes.
Its safety subsystem includes independent voltage monitors per rail, thermal shutdown at 150 °C, ABIST-enabled analog self-test, watchdog timer with fail-safe output (FSOB), and CRC-protected register writes - all certified to ASIL B per ISO 26262. The device uses a dedicated 24-channel analog multiplexer for system-level diagnostics and supports external clock synchronization via SYNCIN/SYNCOUT.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7 V to 5.5 V VIN - powers entire PMIC; UVLO threshold at 2.7 V ensures reliable startup in automotive battery transients. |
| Buck Regulators | 7 channels (SW1–SW7): SW1–SW6 output 0.4–1.8 V @ 2.5 A ±1.5 % accuracy; SW7 outputs 1.0–4.1 V @ 2.5 A ±2 % - enables full-core, memory, and I/O rail support for S32V234. |
| LDO Regulators | 4 channels (LDO1–LDO4): 1.5–5.0 V @ 400 mA ±3 % accuracy, each with optional load-switch mode - supplies low-noise analog, interface, and peripheral rails. |
| RTC & Backup | VSNVS output: selectable 1.8 V / 3.0 V / 3.3 V @ 10 mA; LICELL input supports coin cell charging with programmable voltage/current - maintains real-time clock and SRAM during main power loss. |
| Safety Certification | ASIL B compliance achieved via independent voltage/thermal monitoring, FSOB fail-safe output, ABIST, watchdog with configurable timeout, and I²C CRC protection - required for automotive vision ECU deployment. |
| Interface & Control | I²C up to 3.4 MHz (Fast Mode Plus); 56-pin HVQFN package with wettable flanks; OTP stores boot sequence, voltage targets, and safety thresholds - eliminates external configuration components. |
Pinout & Package
HVQFN56 (SOT684-29(D)), 8 mm × 8 mm × 0.9 mm body, 0.5 mm pitch, thermally enhanced with dimple wettable flanks - optimized for automotive PCB assembly and thermal dissipation (RθJC = 0.6 °C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Monitor regulated output voltage; enable closed-loop regulation and dynamic voltage scaling for CPU/memory rails. |
| SW1IN–SW7IN | Buck input supplies | Accept 2.7–5.5 V input; SW1–SW6 share VIN path, SW7 may be isolated for higher-voltage peripherals. |
| SW1LX–SW7LX | Switching node outputs | Drive external high-side MOSFETs; tolerate −3.0 V transient spikes during dead time - requires careful layout to limit parasitic inductance. |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Provide low-noise, fast-transient 1.5–5.0 V supplies; LDO2EN allows hardware-controlled enable/disable of LDO2. |
| VSNVS, LICELL | RTC supply & backup input | VSNVS delivers stable 1.8/3.0/3.3 V to SNVS domain; LICELL accepts 0–4.2 V coin cell for battery-backed operation. |
| SCL, SDA | I²C interface | Support 3.4 MHz Fast Mode Plus; bidirectional SDA with open-drain logic - enables real-time reconfiguration and telemetry during runtime. |
| FSOB, INTB, RESETBMCU | Safety & system control | FSOB asserts low on critical fault; INTB signals general interrupts; RESETBMCU provides open-drain MCU reset - all ASIL B–monitored outputs. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-phase & quad-phase buck configuration | SW1+SW2, SW3+SW4, or SW5+SW6 can operate as dual-phase regulators; SW1–SW4 combine into quad-phase mode supporting up to 10 A core supply - matches S32V234's 10 A DDR3L core requirement. |
| VTT termination on SW6 | SW6 supports VTT (0.6 V) or standard 0.4–1.8 V output - directly powers DDR3L data bus termination without external circuitry. |
| 24-channel analog multiplexer (AMUX) | Routes internal voltage/temperature monitors to single AMUX pin for external ADC sampling - enables system-level health diagnostics without additional sensors. |
| OTP-configurable power-up sequence | Stores regulator enable order, voltage targets, soft-start timing, and safety thresholds - eliminates need for external sequencer or resistor networks. |
| Fail-safe output (FSOB) | Dedicated open-drain pin asserting low on critical faults (thermal runaway, voltage monitor failure, ABIST error) - triggers immediate system shutdown per ASIL B requirements. |
Applications
| Automotive Vision Processing Unit | ADAS Camera Module Power System |
|---|---|
Use Scenario: Powers NXP S32V234 SoC in front-facing ADAS camera, supplying core, memory, ISP, and sensor interface rails under automotive temperature and vibration conditions. IC Role / Device Role / Timing Role: Primary PMIC providing synchronized 10 A core (quad-phase SW1–SW4), DDR3L VDD/VTT (SW6), and low-noise analog (LDO1/LDO2) for image signal chain. Use Value: Meets ASIL B requirements via FSOB, ABIST, and independent rail monitoring; OTP eliminates external configuration, reducing BOM count by 7+ passive components. |
Use Scenario: Delivers tightly regulated, low-noise power to CMOS image sensor, ISP, and CAN/FlexRay transceivers in compact rear-view camera module. IC Role / Device Role / Timing Role: Single-chip solution generating 1.1 V core, 1.8 V I/O, 3.3 V interface, and 1.8 V/3.3 V SNVS from 5 V input; VSNVS + LICELL maintains timestamp during ignition cycles. Use Value: Integrated RTC backup and coin cell charger eliminate discrete backup circuit; LDO load-switch mode reduces standby current to <1 µA per rail. |
| Automotive Infotainment Head Unit | Robo-Taxi Sensor Fusion Hub |
Use Scenario: Supplies i.MX8QM and companion processors in central infotainment display, managing GPU, DDR4, eMMC, and audio codec rails. IC Role / Device Role / Timing Role: Secondary PMIC (PMIC2) configured for LPDDR4 memory and GPU voltage domains; interfaces via I²C to primary PMIC for coordinated sequencing. Use Value: Dynamic voltage scaling on SW1–SW6 enables real-time GPU frequency/power tuning; spread-spectrum switching reduces EMI in sensitive audio bands. |
Use Scenario: Centralized power hub for multi-sensor fusion ECU combining S32V234 (vision), S32R274 (radar), and S32G (gateway) processors. IC Role / Device Role / Timing Role: Configured as master PMIC with synchronized SYNCOUT driving secondary PMICs; AMUX enables unified thermal/voltage telemetry across all domains. Use Value: External clock sync ensures phase-aligned switching across multiple PMICs - suppresses beat frequencies and simplifies EMI filtering in dense sensor modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DBES | Optimized for i.MX8QM LPDDR4 PMIC2; identical ASIL B safety features and 7-buck/4-LDO architecture but different OTP configuration and default sequencing. | Targets multimedia SoCs rather than vision processors; lacks DDR3L-specific VTT tuning and 10 A quad-phase core configuration. | Select MC33PF8200D2ESR2 for S32V234 DDR3L systems requiring 10 A core and automotive vision safety certification. |
| MPQ4436-AEC1 | Single 4 A buck converter (no LDOs, no OTP, no ASIL B); supports 3.3–36 V input; lacks integrated monitoring, AMUX, or safety outputs. | Used for non-safety auxiliary rails (e.g., fan, display backlight); cannot replace MC33PF8200D2ESR2 as primary SoC PMIC. | Use MPQ4436-AEC1 only for supplemental high-voltage DC-DC conversion where functional safety and multi-rail integration are not required. |
Compared with MC33PF8200DBES and MPQ4436-AEC1, the MC33PF8200D2ESR2 uniquely integrates ASIL B–certified safety monitoring, OTP-configurable 10 A quad-phase core supply, DDR3L VTT termination, and RTC backup - making it the sole qualified solution for S32V234 vision ECUs demanding full functional safety compliance.
Availability
MC33PF8200D2ESR2 is available at Aetrix Electronics and suitable for automotive vision processing units, ADAS camera modules, and infotainment head units requiring stable component supply, long-term lifecycle support, and ASIL B–compliant power management.
Supply support for MC33PF8200D2ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive processors and functional safety-certified power management.
The PF8200 product line was developed specifically to deliver ASIL B–compliant, highly integrated power solutions for NXP's S32x and i.MX 8 application processors - emphasizing reduced BOM, simplified layout, and robust diagnostic coverage for next-generation automotive ECUs.
FAQ
What is the primary target processor for the MC33PF8200D2ESR2?
The MC33PF8200D2ESR2 is specifically configured for the NXP S32V234 vision processor, supporting its 10 A core supply requirement via quad-phase buck configuration (SW1–SW4), DDR3L memory interface with VTT termination on SW6, and ASIL B–compliant safety monitoring essential for automotive vision ECUs.
Does the MC33PF8200D2ESR2 support dynamic voltage scaling (DVS)?
Yes, the MC33PF8200D2ESR2 supports DVS on SW1 through SW6 - all six buck regulators can adjust output voltage in 6.25 mV steps across their full range (0.4–1.8 V). This enables real-time power optimization for the S32V234 CPU and memory domains during varying computational loads.
How does the MC33PF8200D2ESR2 meet ASIL B functional safety requirements?
The MC33PF8200D2ESR2 meets ASIL B via independent voltage/thermal monitors per rail, ABIST-enabled analog self-test, fail-safe output (FSOB), watchdog timer with configurable timeout and fail-safe assertion, CRC-protected I²C writes, and dedicated safety registers stored in OTP - all validated per ISO 26262.
What is the role of the LICELL and VSNVS pins on the MC33PF8200D2ESR2?
The LICELL pin accepts 0–4.2 V coin cell input to back up the VSNVS rail, which delivers selectable 1.8 V / 3.0 V / 3.3 V at 10 mA to the SNVS domain. This maintains real-time clock operation and SRAM retention during main power loss - critical for automotive ignition cycle logging and secure boot continuity in the MC33PF8200D2ESR2.
Can the MC33PF8200D2ESR2 be used with processors other than S32V234?
While optimized for S32V234, the MC33PF8200D2ESR2 can power other processors including i.MX8QM, i.MX8QXP, and LS1043A - provided the OTP configuration is adapted and voltage/current requirements align. Its 7-buck/4-LDO architecture and ASIL B safety features remain applicable, but default sequencing and safety thresholds are S32V234–specific.
MC33PF8200D2ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200D2ESR2 FAQ
1.How can I place an order for MC33PF8200D2ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200D2ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200D2ESR2 reliable?
The price and inventory of MC33PF8200D2ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200D2ESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF8200D2ESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200D2ESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200D2ESR2?
MC33PF8200D2ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200D2ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200D2ESR2?
For technical support, including MC33PF8200D2ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200D2ESR2 requirements.
6.How does Aetrix verify that MC33PF8200D2ESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF8200D2ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200D2ESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF8200D2ESR2?
All MC33PF8200D2ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200D2ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200D2ESR2 part is unused and in its original packaging.
Return procedure for MC33PF8200D2ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC33PF8200D2ESR2 Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
