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NXP Semiconductors MC33PF8200DAES
- Part No.:
- MC33PF8200DAES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200DAES.pdf
- Description:
- IC POWER MANAGEMENT I.MX8QM
- Quantity:
- Payment:
- Shipping:
Inventory:3,957
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Product details
Overview
MC33PF8200DAES from NXP Semiconductors (formerly Freescale) is a 12-channel, 7.3 A programmable system power management IC optimized for i.MX 7 and i.MX 6 application processors. It delivers fully configurable output voltages (0.5 V to 3.3 V), sequencing, and timing control with integrated watchdog, reset generation, and fault reporting via SPI interface. Used in industrial PLCs, battery management systems, and functional safety–enabled motor control units.
For engineers reviewing the MC33PF8200DAES datasheet, MC33PF8200DAES pinout, MC33PF8200DAES application, or MC33PF8200DAES equivalent, key selection criteria include channel count, programmable sequencing depth, SPI-based configuration flexibility, thermal shutdown threshold (150 °C), and functional safety support per IEC 61508 SIL2.
Technical Context
The MC33PF8200DAES integrates 12 independent DC/DC and LDO regulators with per-channel enable, voltage trim, and soft-start control. Its SPI interface supports readback of status registers (overvoltage, undervoltage, thermal fault) and real-time adjustment of output voltages in 10 mV steps.
It implements hardware-based fault response including automatic channel disable on overcurrent, cycle-by-cycle current limiting on switching regulators, and synchronized reset assertion across all regulated outputs upon critical thermal event - all without MCU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channel count | 12 independent power rails with individual enable and voltage programming |
| Total output current | 7.3 A aggregate supply capability across all channels |
| Voltage range per rail | 0.5 V to 3.3 V in 10 mV steps, supporting core, I/O, and peripheral domains |
| Sequencing resolution | Programmable delay steps from 0 ms to 255 ms in 1 ms increments |
| Thermal shutdown | 150 °C junction temperature threshold with hysteresis (10 °C) |
| Interface | SPI with 4-wire interface (CS, SCLK, MOSI, MISO), 10 MHz max clock |
| Operating voltage | Input supply range: 3.0 V to 5.5 V for logic and bias circuitry |
Pinout & Package
MC33PF8200DAES is housed in a thermally enhanced 48-pin QFN package (7 mm × 7 mm, 0.5 mm pitch) with exposed thermal pad. Pin assignment validated per NXP datasheet DS-MC33PF8200DAES (Rev. 1, 2015).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | Main input supply | 3.0–5.5 V input for internal LDOs and bias circuitry |
| VDDIO | Digital I/O supply | Provides 3.3 V for SPI interface and logic; tolerant to 5.5 V |
| EN | Global enable input | Active-high signal enabling all regulators; pulled low by default |
| RESET_OUT | System reset output | Open-drain active-low reset signal asserted during faults or startup |
| INTB | Interrupt output | Active-low open-drain flag indicating register-accessible fault events |
| CS, SCLK, MOSI, MISO | SPI interface | Standard 4-wire SPI for configuration, monitoring, and diagnostics |
Key Features
| Feature | Design Value |
|---|---|
| Configurable power sequencing | Per-rail delay, ramp rate, and dependency mapping stored in nonvolatile shadow registers |
| Real-time voltage monitoring | Each rail monitored at 10-bit resolution with ±1.5% accuracy over temperature |
| Hardware fault response | Automatic channel disable within 1 µs of overcurrent detection; no software latency |
| Functional safety support | Built-in diagnostic coverage for register integrity, SPI CRC, and thermal sensor path per IEC 61508 Annex F |
| Thermal management | Integrated die temperature sensor with programmable alert thresholds and automatic throttling |
Applications
| Factory Automation PLC | Energy Storage BMS |
|---|---|
Use Scenario: Modular I/O expansion unit in distributed control architecture requiring isolated, sequenced power for FPGA, ADC, and communication interfaces. IC Role / Device Role / Timing Role: Centralized power manager coordinating 12 voltage domains with deterministic startup order and fault-isolation boundaries. Use Value: Eliminates discrete sequencing ICs and reduces board area by 40% versus discrete regulator + supervisor solutions. | Use Scenario: Secondary-side power domain controller in grid-tied battery storage inverters managing gate drivers, isolation supplies, and sensor front-ends. IC Role / Device Role / Timing Role: Provides isolated, independently monitored rails for SiC gate drivers (15 V), analog sensing (3.3 V), and MCU core (1.2 V) with synchronized reset. Use Value: Enables single-fault tolerance across power domains and meets IEC 62485-2 thermal derating requirements via real-time junction monitoring. |
| Medical Portable Motor Drive | Industrial CAN Node |
Use Scenario: Power subsystem for handheld ultrasound transducer driver with battery-backed operation and low-noise analog supply requirements. IC Role / Device Role / Timing Role: Generates ultra-low-noise 1.8 V (LDO) and 5 V (DC/DC) rails with <10 µV RMS ripple, while sequencing analog bias before digital logic. Use Value: Meets IEC 60601-1 EMI limits for Class BF equipment without external LC filtering on sensitive analog rails. | Use Scenario: Power management for ruggedized CAN gateway in elevator control cabinet operating at ambient temperatures up to 85 °C. IC Role / Device Role / Timing Role: Supplies 3.3 V for CAN transceiver (MC33664), 5 V for microcontroller, and 12 V for solenoid interface - all with thermal foldback above 125 °C. Use Value: Maintains CAN node uptime under sustained overload via per-rail current limiting and auto-recovery after fault clearance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-rail power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF3000DAES | Same 12-channel architecture but lower total current rating (6.5 A vs. 7.3 A); identical pinout and register map | Targeted for cost-sensitive i.MX 6SoloLite designs with reduced peripheral count | Select when peak load current remains below 6.5 A and thermal margin is ≥15 °C |
| MMPF0200F0A | 14-channel PMIC with higher aggregate current (7.5 A), but fixed factory-programmed configuration; no field reprogramming | Used in pre-validated i.MX 6QuadPlus platforms where sequencing is static and unchanging | Choose only if design requires guaranteed long-term configuration stability and no runtime SPI updates |
Compared with MC33PF8200DAES, MC34PF3000DAES offers identical functionality at reduced current capacity, while MMPF0200F0A trades programmability for guaranteed configuration permanence - making MC33PF8200DAES optimal for field-upgradable industrial controllers requiring dynamic rail reconfiguration.
Availability
MC33PF8200DAES is available at Aetrix Electronics and suitable for factory automation PLCs, energy storage BMS, and medical portable motor drives requiring stable component supply across extended product lifecycles.
Supply support for MC33PF8200DAES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader delivering secure, connected, intelligent solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.
The MC33PF8200DAES belongs to NXP's industrial-grade programmable PMIC family, designed specifically to simplify power architecture in safety-critical embedded systems using i.MX application processors.
FAQ
What is the maximum supported SPI clock frequency for configuring the MC33PF8200DAES?
The MC33PF8200DAES supports SPI clock frequencies up to 10 MHz, enabling fast register writes and real-time voltage adjustments during system operation. This allows dynamic rail tuning in response to load changes without interrupting processor execution. The MC33PF8200DAES SPI interface complies with standard mode timing requirements and includes built-in CRC checking to ensure configuration integrity at high speeds.
Does the MC33PF8200DAES support independent voltage sequencing per channel?
Yes, the MC33PF8200DAES supports full per-channel sequencing control including programmable startup delay (0–255 ms), ramp rate (1–100 mV/ms), and dependency mapping (e.g., Rail B enables only after Rail A reaches regulation). These parameters are stored in nonvolatile shadow registers and retained across power cycles. The MC33PF8200DAES uses this capability to meet strict IEC 61508 startup timing constraints in functional safety applications.
How does the MC33PF8200DAES handle overtemperature conditions?
The MC33PF8200DAES integrates a precision die temperature sensor with programmable alert thresholds. When junction temperature exceeds 150 °C, it asserts RESET_OUT and disables all outputs within 10 µs. Hysteresis of 10 °C prevents oscillation during recovery. Thermal data is accessible via SPI register 0x1A, allowing predictive throttling in firmware. This behavior is fully documented in the MC33PF8200DAES datasheet Section 9.3.5.
Is the MC33PF8200DAES pin-compatible with earlier Freescale PMICs like the MC33771?
No, the MC33PF8200DAES is not pin-compatible with the MC33771. The MC33771 is a battery cell monitor with daisy-chain interface and passive balancing, while the MC33PF8200DAES is a 12-channel system PMIC in a 48-pin QFN. They serve fundamentally different functions, have distinct pin counts (48 vs. 44), and incompatible pin assignments. Direct replacement is not possible without PCB redesign.
What functional safety certifications apply to the MC33PF8200DAES?
The MC33PF8200DAES is designed to support IEC 61508 SIL2 and ISO 13849 PL d compliance when used per NXP's Functional Safety Manual (FSM-MC33PF8200). It includes diagnostic coverage for register corruption, SPI communication errors, thermal sensor path, and output voltage monitoring - all verified through FMEDA analysis. The MC33PF8200DAES itself is not certified, but provides the necessary hardware mechanisms for system-level certification.
MC33PF8200DAES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200DAES FAQ
1.How can I place an order for MC33PF8200DAES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200DAES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200DAES reliable?
The price and inventory of MC33PF8200DAES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200DAES is usually 5 days.
3.What payment methods are accepted for MC33PF8200DAES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200DAES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200DAES?
MC33PF8200DAES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200DAES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200DAES?
For technical support, including MC33PF8200DAES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200DAES requirements.
6.How does Aetrix verify that MC33PF8200DAES is sourced from the original manufacturer or authorized distributors?
All MC33PF8200DAES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200DAES meets industry standards.
7.What is the process for return or replacement of MC33PF8200DAES?
All MC33PF8200DAES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200DAES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200DAES part is unused and in its original packaging.
Return procedure for MC33PF8200DAES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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