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NXP Semiconductors MC33PF8200DBES
- Part No.:
- MC33PF8200DBES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200DBES.pdf
- Description:
- IC POWER MANAGEMENT I.MX8QM
- Quantity:
- Payment:
- Shipping:
Inventory:4,551
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Product details
Overview
MC33PF8200DBES from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed as the primary power solution for i.MX8QM processors in LPDDR4-based PMIC2 configurations. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B–compliant monitoring circuitry. It powers CPU cores, GPU, memory interfaces (LPDDR4), and peripherals in high-performance infotainment systems.
For engineers reviewing the MC33PF8200DBES datasheet, MC33PF8200DBES pinout, MC33PF8200DBES application, or MC33PF8200DBES equivalent, this page delivers verified technical context, exact regulator specifications, validated HVQFN56 pin mapping, safety-critical feature implementation details, and confirmed automotive alternative options - all aligned to Rev. 13 (6 March 2026) product data sheet.
Technical Context
The MC33PF8200DBES implements a dual-phase capable architecture: SW1/SW2, SW3/SW4, and SW5/SW6 support configurable multi-phase operation (up to quad-phase with 10 A total), while SW7 operates independently across 1.0–4.1 V at 2.5 A. Its state machine enforces ASIL B–compliant fault handling-including thermal shutdown, voltage monitor faults, watchdog timeout escalation, and fail-safe output (FSOB) assertion-without requiring external supervision logic.
OTP memory stores boot-time configuration (voltage levels, sequencing, safety thresholds), reducing external component count. Post-boot regulation parameters are dynamically adjustable via 3.4 MHz I²C, supporting runtime DVS for CPU/GPU voltage scaling and adaptive power states. The 24-channel analog multiplexer enables system-level diagnostics of rail voltages, die temperature, and external sensor inputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 7 buck converters + 4 LDOs + VSNVS RTC supply + coin cell charger - fully integrated power tree for i.MX8QM LPDDR4 platforms. |
| Buck Output Range | SW1–SW6: 0.4–1.8 V (6.25 mV steps); SW7: 1.0–4.1 V - supports core, I/O, and interface rail requirements with fine-grained control. |
| Current Rating | 2.5 A per buck channel; 400 mA per LDO; 10 mA VSNVS - sufficient for LPDDR4 memory termination, GPU voltage domains, and always-on RTC. |
| I²C Interface | Up to 3.4 MHz - enables fast register access for dynamic voltage scaling and real-time fault response in automotive timing-critical applications. |
| Safety Certification | ASIL B compliance via independent voltage/thermal monitoring, ABIST, CRC-protected registers, and fail-safe output (FSOB) - meets ISO 26262 functional safety requirements. |
| Operating Temp | −40 °C to +105 °C ambient - qualified for under-hood and dashboard-mounted automotive electronics. |
| Package | HVQFN56, 8 mm × 8 mm × 0.9 mm, wettable flank - optimized for automated optical inspection and thermal dissipation in compact PCB layouts. |
Pinout & Package
HVQFN56 package with 0.5 mm pitch, thermally enhanced exposed pad (EPAD), and wettable flank for solder joint reliability. Pin 57 (EPAD) must be connected to ground for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable precise closed-loop regulation of each buck output; support ±1.5 % (SW1–SW6) or ±2 % (SW7) accuracy. |
| SW1IN–SW7IN | Buck input supplies | Accept 2.7–5.5 V main input (VIN) or local intermediate rails; require external input capacitors per channel. |
| SW1LX–SW7LX | Switching node outputs | Drive external high-side MOSFETs or integrated power stages; tolerate −3.0 V transient spikes during dead time. |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Deliver 1.5–5.0 V at 400 mA each; support load switch mode for controlled peripheral power gating. |
| VSNVS | RTC supply output | Provides 1.8/3.0/3.3 V at 10 mA from VIN or coin cell (LICELL), enabling battery-backed secure boot and clock retention. |
| SCL/SDA | I²C interface | Support 3.4 MHz high-speed mode; require pull-up resistors to VDDIO (1.6–3.3 V) for proper signal integrity. |
| FSOB | Fail-safe output | Open-drain ASIL B–compliant safety signal; asserts low on critical faults (thermal, UV/OV, watchdog timeout) to halt system execution. |
| RESETBMCU | MCU reset output | Open-drain active-low reset signal synchronized to PMIC power-up sequence and fault conditions. |
Key Features
| Feature | Design Value |
|---|---|
| Configurable multi-phase buck operation | SW1/SW2, SW3/SW4, SW5/SW6 support dual-phase; SW1–SW4 support quad-phase up to 10 A - reduces ripple and improves transient response for CPU/GPU cores. |
| VTT termination mode on SW6 | Enables DDR/LPDDR memory termination without external components - simplifies layout and ensures JEDEC-compliant VTT tracking. |
| OTP-programmed startup sequence | Eliminates external resistor networks and configuration EEPROM; stores voltage targets, ramp rates, and power-up order for deterministic boot. |
| 24-channel analog multiplexer (AMUX) | Allows software-selectable monitoring of internal rails, die temperature, and up to 24 external analog signals - enables predictive diagnostics and system health reporting. |
| ABIST and CRC-protected registers | On-chip analog built-in self-test validates voltage monitors pre-boot; I²C writes include CRC to prevent corruption of safety-critical configuration registers. |
Applications
| Automotive Infotainment Head Unit | i.MX8QM-Based ADAS Domain Controller |
|---|---|
|
Use Scenario: Central display unit with multimedia playback, navigation, voice recognition, and vehicle telemetry. IC Role / Device Role / Timing Role: Primary PMIC supplying i.MX8QM CPU cores (SW1–SW3), GPU (SW4), LPDDR4 memory (SW5/SW6 VTT), and CAN/FlexRay interface LDOs (LDO1–LDO4). Use Value: ASIL B–compliant fault detection ensures safe degradation (e.g., FSOB assertion) during voltage or thermal anomalies, meeting OEM functional safety requirements. |
Use Scenario: Sensor fusion hub aggregating camera, radar, and ultrasonic inputs for real-time perception processing. IC Role / Device Role / Timing Role: Dual-rail power source delivering dynamically scaled core voltages (SW1–SW4 DVS) and isolated I/O supplies (LDO2/LDO3) for mixed-signal sensor interfaces. Use Value: 3.4 MHz I²C enables sub-10 µs register updates during algorithmic load changes, maintaining tight voltage regulation during burst-mode AI inference. |
| Connected Vehicle Telematics Control Unit (TCU) | Advanced Digital Instrument Cluster |
|
Use Scenario: LTE/V2X communication module with secure boot, OTA update capability, and GNSS timing reference. IC Role / Device Role / Timing Role: Power manager providing VSNVS RTC supply (coin cell backup), secure MCU core rail (SW7), and isolated communication interface LDOs (LDO1/LDO4). Use Value: OTP-stored cryptographic key provisioning sequence and ABIST-verified boot path ensure hardware-rooted trust for secure firmware validation. |
Use Scenario: High-resolution TFT display with HUD projection, driver monitoring, and haptic feedback. IC Role / Device Role / Timing Role: Multi-rail source powering display controller (SW2), GPU (SW4), LPDDR4 frame buffer (SW5/SW6), and touch controller LDO (LDO3). Use Value: Quad-phase SW1–SW4 configuration delivers <15 mV ripple at 3 A load, eliminating visible flicker in high-brightness display modes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DHES | Targeted for i.MX8QM DDR4 memory PMIC2; SW6 configured for DDR4 VTT; different OTP calibration for DDR4 timing margins. | Requires DDR4-specific memory controller interface; not validated for LPDDR4 timing closure. | Select only when platform uses DDR4 memory and requires matching VTT slew rate and termination voltage. |
| MC33PF8200ETES | Targeted for i.MX8QM DDR4 memory PMIC1; includes dedicated VDDQ/VTT sequencing for DDR4 PHY; higher thermal derating for sustained 105 °C operation. | Optimized for DDR4 memory subsystem power delivery; lacks LPDDR4-specific low-latency DVS tuning. | Prefer for DDR4-based designs where memory bandwidth >3200 MT/s and thermal margin >15 °C is required. |
Compared with MC33PF8200DBES, MC33PF8200DHES provides tighter DDR4 VTT regulation but lacks LPDDR4-optimized DVS latency, while MC33PF8200ETES offers enhanced thermal robustness for DDR4 PHY power but omits LPDDR4-specific startup timing sequences - making MC33PF8200DBES the only validated option for i.MX8QM LPDDR4 PMIC2 deployments.
Availability
MC33PF8200DBES is available at Aetrix Electronics and suitable for automotive infotainment head units, i.MX8QM-based ADAS domain controllers, and connected vehicle telematics control units requiring stable component supply, long-term lifecycle assurance, and ASIL B–certified power management.
Supply support for MC33PF8200DBES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and functional safety-certified power management.
The PF8200 product line was engineered specifically to deliver ASIL B–compliant, multi-rail power sequencing and dynamic voltage scaling for NXP's i.MX 8 and S32x processor families in safety-critical automotive systems.
FAQ
What is the primary target processor and memory configuration for the MC33PF8200DBES?
The MC33PF8200DBES is specifically configured for i.MX8QM processors with LPDDR4 memory in the PMIC2 role. Its OTP programming, voltage sequencing, and DVS timing are validated for LPDDR4 interface requirements - including VDDQ, VTT, and low-latency core rail transitions - as documented in the MC33PF8200DB.zip OTP report.
Does the MC33PF8200DBES support ASIL B functional safety compliance out of the box?
Yes, the MC33PF8200DBES achieves ASIL B compliance through integrated features: independent voltage/thermal monitors, ABIST self-test, CRC-protected safety registers, fail-safe output (FSOB), and programmable fault escalation paths. These are enabled by default in its automotive OTP image and require no external safety controller to meet ISO 26262 requirements.
How does the MC33PF8200DBES handle LPDDR4 memory termination (VTT)?
The MC33PF8200DBES configures SW6 in VTT termination mode, delivering a tightly regulated, dynamically tracked VTT rail referenced to LPDDR4 VDDQ. This eliminates external termination ICs and ensures JEDEC-compliant VTT slew rate, voltage accuracy (±1 %), and current sourcing/sinking capability required for LPDDR4-4266 operation.
Can the MC33PF8200DBES be used with DDR4 memory instead of LPDDR4?
No - the MC33PF8200DBES OTP and characterization are specific to LPDDR4 timing, voltage margins, and sequencing. For DDR4, NXP specifies MC33PF8200DHES (PMIC2) or MC33PF8200ETES (PMIC1); using MC33PF8200DBES with DDR4 risks timing violations, VTT instability, and failure to meet JEDEC DDR4-2400+ specifications.
What is the role of the FSOB pin on the MC33PF8200DBES and how is it triggered?
The FSOB (Fail-Safe Output) pin on the MC33PF8200DBES is an open-drain safety signal that asserts low during critical faults: thermal shutdown (>150 °C), input UVLO, buck regulator overvoltage/undervoltage, watchdog timeout escalation, or ABIST self-test failure. It directly interfaces with system-level safety microcontrollers to initiate controlled shutdown or limp-home mode.
MC33PF8200DBES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200DBES FAQ
1.How can I place an order for MC33PF8200DBES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200DBES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200DBES reliable?
The price and inventory of MC33PF8200DBES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200DBES is usually 5 days.
3.What payment methods are accepted for MC33PF8200DBES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200DBES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200DBES?
MC33PF8200DBES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200DBES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200DBES?
For technical support, including MC33PF8200DBES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200DBES requirements.
6.How does Aetrix verify that MC33PF8200DBES is sourced from the original manufacturer or authorized distributors?
All MC33PF8200DBES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200DBES meets industry standards.
7.What is the process for return or replacement of MC33PF8200DBES?
All MC33PF8200DBES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200DBES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200DBES part is unused and in its original packaging.
Return procedure for MC33PF8200DBES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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