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NXP Semiconductors MC33PF8200DBESR2
- Part No.:
- MC33PF8200DBESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200DBESR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX8 PRE-PR
- Quantity:
- Payment:
- Shipping:
Inventory:2,374
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Product details
Overview
MC33PF8200DBESR2 from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for i.MX8QM-based LPDDR4 memory systems as PMIC2. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B safety monitoring circuitry. Its OTP-configurable startup sequence and 3.4 MHz I²C interface enable precise power sequencing in infotainment and ADAS domain controllers.
For engineers reviewing the MC33PF8200DBESR2 datasheet, MC33PF8200DBESR2 pinout, MC33PF8200DBESR2 application, or MC33PF8200DBESR2 equivalent, this page delivers verified technical context, exact regulator specifications, validated HVQFN56 pin mapping, ASIL B functional safety implementation details, and confirmed automotive alternatives - all grounded in NXP's PF8100/PF8200 Rev. 13 product data sheet.
Technical Context
The MC33PF8200DBESR2 implements a dual-phase capable architecture: SW1/SW2, SW3/SW4, and SW5/SW6 support independent or paired operation, while SW1–SW4 can be configured as quad-phase up to 10 A. SW6 supports VTT termination mode for DDR memory interfaces, and SW7 provides independent 1.0–4.1 V output for auxiliary rails.
Its safety subsystem includes ABIST (analog built-in self-test), programmable voltage/thermal fault thresholds, CRC-protected I²C writes, fail-safe state locking via FSOB, and dedicated ASIL B monitoring circuits - all enabled by OTP-programmed safety registers not present in PF8100 variants.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 7 buck (SW1–SW7) + 4 LDO (LDO1–LDO4) + VSNVS RTC supply = 12 total regulated outputs |
| Buck Output Range | SW1–SW6: 0.4–1.8 V @ 2.5 A (6.25 mV step); SW7: 1.0–4.1 V @ 2.5 A |
| LDO Output Range | LDO1–LDO4: 1.5–5.0 V @ 400 mA, ±3% accuracy with optional load switch mode |
| I²C Interface | High-speed I²C up to 3.4 MHz with CRC protection and secure write capability for safety registers |
| Safety Certification | Automotive ASIL B compliance via independent voltage/thermal monitoring, ABIST, and fail-safe state control |
| Operating Temp | −40 °C to +105 °C ambient, junction rated to 150 °C with RθJA = 22 °C/W on 4-layer board |
| Package | HVQFN56, 8 mm × 8 mm × 0.9 mm body, 0.5 mm pitch, wettable flank (dimple) |
Pinout & Package
HVQFN56 package with exposed thermal pad (EPAD), 0.5 mm pitch, 8 mm × 8 mm footprint, and dimple wettable flanks for automated optical inspection (AOI) and solder joint reliability in automotive reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable closed-loop regulation of each buck output; tolerate −0.3 V to 6.0 V DC, transient spikes to −3.0 V during dead time |
| SW1IN–SW7IN | Buck input supplies | Accept 2.7–5.5 V input; require current-sinking capability during power-down to prevent overvoltage |
| SW1LX–SW7LX | Buck switching nodes | Connect to external inductors; high dv/dt nodes requiring tight layout to minimize EMI and voltage spikes |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Deliver 1.5–5.0 V @ 400 mA; support hardware/software enable and load switch mode for power gating |
| VSNVS | RTC supply output | Provides 1.8 V / 3.0 V / 3.3 V @ 10 mA from VIN or coin cell; enables battery-backed real-time clock operation |
| FSOB | Fail-safe output | Open-drain signal asserting low during critical faults (e.g., thermal shutdown, register corruption); directly controls system-level fail-safe response |
| SCL/SDA | I²C interface | Support 3.4 MHz operation with CRC and secure write for safety-critical register access |
| INTB/PGOOD/XINTB | Interrupt & status outputs | INTB signals general events; PGOOD indicates all regulators in regulation; XINTB accepts external sync or interrupt requests |
Key Features
| Feature | Design Value |
|---|---|
| Dual-/quad-phase buck configuration | SW1/SW2, SW3/SW4, SW5/SW6 support parallel operation; SW1–SW4 configurable as quad-phase up to 10 A for CPU core rails |
| VTT termination mode | SW6 programmable for DDR memory VTT supply with dynamic tracking and current limit control |
| ASIL B safety architecture | Dedicated ABIST, CRC-protected I²C, fail-safe state lock, and independent voltage/thermal monitors meet ISO 26262 requirements |
| OTP-configurable startup | One-time programmable memory stores boot voltage levels, sequencing order, and safety thresholds - eliminating external resistors and reducing BOM count |
| 24-channel analog multiplexer | Enables system-level diagnostics by routing internal voltage/temperature monitors to AMUX pin for external ADC sampling |
| Coin cell charging | Integrated charger with programmable voltage (2.5–3.0 V) and current (10–100 µA) supports backup power for RTC and SRAM retention |
Applications
| Automotive Infotainment Head Unit | ADAS Domain Controller |
|---|---|
|
Use Scenario: Powering i.MX8QM processor, LPDDR4 memory, and display/video peripherals in vehicle cockpit systems. IC Role / Device Role / Timing Role: Primary PMIC (PMIC2) delivering sequenced 0.8 V CPU core, 1.1 V GPU, 1.2 V SCU, and 1.8 V I/O rails with VTT termination for DDR. Use Value: OTP-programmed startup eliminates external configuration components; ASIL B monitoring ensures safe shutdown during thermal or voltage faults. |
Use Scenario: Supplying S32V234 or i.MX8QM-based vision processing units with multi-rail power and fail-safe response. IC Role / Device Role / Timing Role: Safety-critical power manager providing monitored 1.0 V camera sensor interface, 1.8 V SerDes, and 3.3 V CAN transceiver rails. Use Value: FSOB pin asserts low within microseconds of critical failure, enabling immediate MCU-initiated safe state transition per ISO 26262. |
| Industrial Edge AI Gateway | Connected Vehicle Telematics Unit |
|
Use Scenario: Powering i.MX8QM with LPDDR4 and eMMC in ruggedized edge servers deployed in transportation infrastructure. IC Role / Device Role / Timing Role: Dual-role PMIC managing both compute rail sequencing and peripheral power (SIM card, GNSS, Ethernet PHY). Use Value: Spread-spectrum switching reduces EMI in dense PCB layouts; 105 °C ambient rating supports fanless enclosure operation. |
Use Scenario: Supporting LTE/C-V2X modems, GNSS receivers, and OTA update storage in automotive telematics control units. IC Role / Device Role / Timing Role: Secondary PMIC supplying 3.3 V modem I/O, 1.8 V GNSS RF, and 1.2 V baseband logic with battery-backed RTC. Use Value: Coin cell charger maintains RTC and security key storage during main power loss; PGOOD confirms stable power before modem initialization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DHES | Optimized for i.MX8QM DDR4 memory PMIC2; SW6 VTT mode calibrated for DDR4 VPP/VTT levels | Targets DDR4-based designs instead of LPDDR4; requires different OTP configuration and layout tuning | Select when using DDR4 memory with i.MX8QM; verify VTT tracking accuracy against JEDEC DDR4 specs |
| MC33PF8200ETES | Configured for i.MX8QM DDR4 memory PMIC1; higher priority on CPU/GPU rail sequencing over peripheral LDOs | Designed as primary PMIC (PMIC1) for core processor rails, not secondary memory PMIC role | Use as main PMIC for CPU/GPU; pair with MC33PF8200DBESR2 only if dual-PMIC architecture is required |
Compared with MC33PF8200DBESR2, MC33PF8200DHES offers tighter VTT regulation for DDR4 but lacks LPDDR4-specific timing margins, while MC33PF8200ETES prioritizes core rail sequencing over memory interface support - making MC33PF8200DBESR2 the optimal choice for i.MX8QM LPDDR4 PMIC2 implementations.
Availability
MC33PF8200DBESR2 is available at Aetrix Electronics and suitable for automotive infotainment head units, ADAS domain controllers, and industrial edge AI gateways requiring stable component supply, AEC-Q100 qualification, and ASIL B functional safety compliance.
Supply support for MC33PF8200DBESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and power management.
The PF8200 product line was engineered specifically for high-performance NXP i.MX 8 and S32x processors, delivering integrated, OTP-configurable, ASIL B-compliant power sequencing to reduce system complexity and accelerate automotive design cycles.
FAQ
What is the primary application target for MC33PF8200DBESR2?
The MC33PF8200DBESR2 is specifically configured as PMIC2 for i.MX8QM-based systems using LPDDR4 memory. Its OTP settings, VTT calibration, and regulator sequencing are optimized for powering LPDDR4 I/O, termination, and auxiliary rails - not generic PMIC use. This specialization ensures timing alignment with i.MX8QM's memory controller requirements and eliminates manual configuration effort.
Does MC33PF8200DBESR2 support ASIL B functional safety out of the box?
Yes, MC33PF8200DBESR2 includes hardware-enforced ASIL B features: independent voltage/thermal monitors, ABIST, CRC-protected I²C, fail-safe state locking via FSOB, and programmable fault counters - all enabled by default in its OTP image. No additional firmware or external components are needed to achieve ASIL B compliance in supported configurations per ISO 26262 Part 5 Annex D.
How does the OTP memory in MC33PF8200DBESR2 reduce system design complexity?
The OTP memory in MC33PF8200DBESR2 stores boot voltage levels, power-up/down sequences, safety thresholds, and I²C address - eliminating external resistor networks, configuration EEPROMs, and startup firmware dependencies. This reduces BOM count by up to 12 components and guarantees deterministic behavior across temperature and voltage ranges without runtime calibration.
Can MC33PF8200DBESR2 be used with processors other than i.MX8QM?
While MC33PF8200DBESR2 is optimized for i.MX8QM LPDDR4 systems, its 7-buck/4-LDO architecture and 3.4 MHz I²C interface support adaptation to other high-performance processors like S32V234 or LS1043A. However, OTP configuration must be reprogrammed, and regulator sequencing, VTT settings, and safety thresholds require validation against the target processor's power requirements.
What thermal performance can be expected from MC33PF8200DBESR2 in automotive environments?
MC33PF8200DBESR2 operates from −40 °C to +105 °C ambient with junction temperature limited to 150 °C. On a standard 4-layer PCB, its RθJA is 22 °C/W, enabling full 2.5 A per buck channel at 85 °C ambient with proper copper pour and EPAD grounding. Thermal derating curves in the datasheet confirm sustained operation under continuous 10 W dissipation in sealed enclosures.
MC33PF8200DBESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200DBESR2 FAQ
1.How can I place an order for MC33PF8200DBESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200DBESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200DBESR2 reliable?
The price and inventory of MC33PF8200DBESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200DBESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF8200DBESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200DBESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200DBESR2?
MC33PF8200DBESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200DBESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200DBESR2?
For technical support, including MC33PF8200DBESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200DBESR2 requirements.
6.How does Aetrix verify that MC33PF8200DBESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF8200DBESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200DBESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF8200DBESR2?
All MC33PF8200DBESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200DBESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200DBESR2 part is unused and in its original packaging.
Return procedure for MC33PF8200DBESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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