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NXP Semiconductors MC33PF8200DEES
- Part No.:
- MC33PF8200DEES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200DEES.pdf
- Description:
- IC POWER MANAGEMENT I.MX8QXP
- Quantity:
- Payment:
- Shipping:
Inventory:2,574
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Product details
Overview
MC33PF8200DEES from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for i.MX8QXP processors with LPDDR4 memory. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B safety monitoring. It delivers precise voltage regulation (e.g., SW1–SW6: 0.4–1.8 V, ±1.5% accuracy; 2.5 A per channel) in automotive infotainment systems requiring functional safety compliance.
For engineers reviewing the MC33PF8200DEES datasheet, MC33PF8200DEES pinout, MC33PF8200DEES application, or MC33PF8200DEES equivalent, this page provides verified technical context, validated pin functions, confirmed ASIL B safety architecture, I²C-configurable DVS support, and real-world use cases in i.MX8QXP-based ADAS and infotainment platforms - all derived from NXP's official PF8100/PF8200 Rev. 13 product data sheet.
Technical Context
The MC33PF8200DEES implements a dual-domain power architecture: six programmable buck regulators (SW1–SW6) support dynamic voltage scaling and multi-phase configurations (dual-, triple-, or quad-phase), while SW7 operates independently (1.0–4.1 V, 2.5 A) for auxiliary rails. Its integrated 24-channel analog multiplexer enables system-level diagnostics, and OTP memory stores startup sequences to eliminate external configuration components.
Safety-critical operation is enforced via ASIL B-compliant monitoring: independent voltage fault detection (OV/UV), thermal shutdown at 150 °C, ABIST self-test, CRC-protected I²C writes, and fail-safe output (FSOB) that asserts during critical failures. The state machine supports seamless transitions between RUN, STANDBY, POWER DOWN, and FAIL-SAFE states - all synchronized with i.MX8QXP boot and runtime requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 7 buck converters + 4 LDOs + VSNVS RTC supply + coin cell charger - fully integrated power tree for i.MX8QXP LPDDR4 systems. |
| Buck Output Range | SW1–SW6: 0.4–1.8 V (6.25 mV step, ±1.5% accuracy); SW7: 1.0–4.1 V (±2% accuracy) - supports core, I/O, and memory rail requirements. |
| Current Rating | 2.5 A per buck channel; 400 mA per LDO - sufficient for CPU clusters, GPU, DDR PHY, and peripherals without external current boosting. |
| I²C Interface | Up to 3.4 MHz high-speed interface - enables rapid register tuning for dynamic voltage scaling and runtime power state transitions. |
| Safety Certification | ASIL B compliant monitoring circuit - includes independent voltage monitors, thermal protection, watchdog supervision, and FSOB fail-safe output. |
| OTP Memory | One-time programmable memory storing boot sequence, voltage setpoints, and power-up timing - eliminates external resistors and reduces BOM count. |
| Operating Temp | −40 °C to +105 °C ambient - qualified for automotive cabin and head-unit environments per AEC-Q100. |
Pinout & Package
HVQFN56 package (8 mm × 8 mm × 0.9 mm, 0.5 mm pitch, wettable flank), thermally enhanced with exposed pad (EPAD) connected to ground for efficient heat dissipation in automotive PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable closed-loop regulation of each buck output; support precision trimming and adaptive compensation. |
| SW1IN–SW7IN | Buck input supplies | Accept 2.7–5.5 V main input (VIN) or local decoupled sources; require external input capacitors per regulator. |
| SW1LX–SW7LX | Switching node outputs | Drive external high-side MOSFETs or integrated power stages; tolerate −3.0 V transient spikes during dead time. |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Deliver 1.5–5.0 V @ 400 mA each; support load switch mode for controlled peripheral power gating. |
| VSNVS | RTC supply output | Provides 1.8/3.0/3.3 V @ 10 mA from VIN or coin cell (LICELL) - maintains real-time clock and backup memory during main power loss. |
| SCL/SDA | I²C interface | High-speed (3.4 MHz) bidirectional control bus for runtime configuration, telemetry readback, and safety register access. |
| FSOB | Fail-safe output | Open-drain signal asserted LOW during critical faults (thermal, voltage, watchdog timeout) - triggers system-level safe shutdown. |
| RESETBMCU | MCU reset output | Open-drain reset signal synchronized to PMIC power-up sequence - ensures deterministic processor initialization. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-phase & multi-phase buck configuration | SW1/SW2, SW3/SW4, or SW5/SW6 can be paired as dual-phase; SW1–SW3 support triple-phase (7.5 A); SW1–SW4 support quad-phase (10 A) - scales current delivery for high-performance CPU/GPU cores. |
| VTT termination on SW6 | Configurable VTT mode for DDR memory termination - eliminates need for external VTT regulators in LPDDR4 designs. |
| 24-channel analog multiplexer (AMUX) | Enables real-time monitoring of internal voltages, temperatures, and external sensor signals - supports predictive diagnostics and system health reporting. |
| Programmable soft-start & power-down sequencing | OTP-configurable timing and order for all 12 regulators - prevents inrush current, ensures proper processor boot order, and avoids latch-up. |
| ABIST and CRC-protected registers | On-chip analog built-in self-test validates voltage monitors pre-boot; I²C writes to safety registers require CRC check - meets ASIL B integrity requirements. |
Applications
| Automotive Infotainment Head Unit | i.MX8QXP-Based ADAS Camera Module |
|---|---|
|
Use Scenario: Central display unit with multimedia playback, navigation, and voice assistant, operating in vehicle cabin environment (−40 °C to +85 °C). IC Role / Device Role / Timing Role: Primary PMIC supplying i.MX8QXP CPU cores (SW1–SW3), GPU (SW4), LPDDR4 memory (SW5/SW6 VTT), and peripherals (LDO1–LDO4). Use Value: ASIL B monitoring ensures safe shutdown during overtemperature or undervoltage events; OTP-stored boot sequence guarantees repeatable power-up across production units. |
Use Scenario: Front-facing camera ECU processing video streams for lane departure warning and automatic emergency braking. IC Role / Device Role / Timing Role: Power manager delivering tightly regulated 0.8 V core, 1.1 V GPU, 1.2 V LPDDR4 I/O, and 3.3 V sensors - all sequenced to match i.MX8QXP boot ROM requirements. Use Value: 3.4 MHz I²C allows dynamic voltage scaling during low-power vision processing modes; FSOB output halts image capture if critical rail fault occurs. |
| Automotive Digital Cluster Instrument Panel | Connected Vehicle Telematics Control Unit (TCU) |
|
Use Scenario: High-resolution TFT display with graphics acceleration, requiring stable low-noise power for display driver ICs and touch controller. IC Role / Device Role / Timing Role: Supplies 1.8 V display interface (SW6), 1.2 V GPU (SW4), 3.3 V CAN transceivers (LDO3), and RTC (VSNVS) with coin cell backup. Use Value: Spread-spectrum switching reduces EMI in sensitive analog front-end circuits; AMUX monitors display rail ripple to trigger diagnostic alerts. |
Use Scenario: Cellular-connected gateway managing OTA updates, GNSS positioning, and vehicle-to-cloud communication under varying battery conditions. IC Role / Device Role / Timing Role: Powers i.MX8QXP application processor, LTE modem (SW7), GNSS RF section (LDO2), and eMMC storage (SW5) - all with brown-out immunity down to 2.7 V VIN. Use Value: Watchdog timer and early warning (EWARN) pin enable firmware recovery before full system lockup; PGOOD signals coordinate modem power-up with baseband initialization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DBES | Same PF8200 family, ASIL B rated, but configured for i.MX8QM + LPDDR4 PMIC2 role - different OTP firmware, optimized for second PMIC in dual-PMIC i.MX8QM systems. | Targeted at i.MX8QM-based platforms requiring two PMICs (PMIC1/PMIC2); not pin-compatible or OTP-compatible with MC33PF8200DEES. | Select only for i.MX8QM dual-PMIC architectures; requires separate hardware design and firmware integration. |
| MC33PF8100CCES | PF8100 variant, QM grade (not ASIL B), same pinout and basic regulator count, but lacks ABIST, FSOB, safety registers, and fail-safe state machine. | Valid for non-safety-critical industrial i.MX8QXP designs; cannot substitute in ASIL B automotive applications without requalification. | Use only where functional safety is not required; not suitable for automotive infotainment or ADAS without additional system-level safety mechanisms. |
Compared with MC33PF8200DBES and MC33PF8100CCES, the MC33PF8200DEES uniquely combines i.MX8QXP-specific OTP configuration, ASIL B safety features, and LPDDR4-optimized VTT support - making it the sole qualified option for automotive infotainment systems requiring certified functional safety and guaranteed boot reliability.
Availability
MC33PF8200DEES is available at Aetrix Electronics and suitable for automotive infotainment head units, i.MX8QXP-based ADAS camera modules, and digital instrument clusters requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant traceability.
Supply support for MC33PF8200DEES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in application processor power management.
The PF8200 product line was engineered specifically for NXP's i.MX 8 and S32x automotive processors, delivering integrated, safety-certified power delivery with minimal external components and deterministic boot behavior.
FAQ
What is the primary target processor for the MC33PF8200DEES?
The MC33PF8200DEES is specifically configured for the NXP i.MX8QXP application processor with LPDDR4 memory, as confirmed by its OTP firmware, ordering code suffix "DE", and supporting documentation (MC33PF8200DE.zip). It powers CPU cores, GPU, memory interfaces, and peripherals in automotive infotainment and ADAS systems.
Does the MC33PF8200DEES support functional safety certification?
Yes, the MC33PF8200DEES is ASIL B compliant per ISO 26262, featuring independent voltage monitors, thermal shutdown, ABIST self-test, CRC-protected I²C writes, and a dedicated fail-safe output (FSOB) - all documented in the PF8100/PF8200 Rev. 13 datasheet Section 12.4 and Figure 5.
How many buck regulators does the MC33PF8200DEES integrate, and what are their key specs?
The MC33PF8200DEES integrates seven buck regulators: SW1–SW6 deliver 0.4–1.8 V at ±1.5% accuracy and 2.5 A each; SW7 delivers 1.0–4.1 V at ±2% accuracy and 2.5 A. SW6 supports VTT termination for LPDDR4, and SW1–SW4 support multi-phase configurations up to 10 A.
What package type and thermal characteristics apply to the MC33PF8200DEES?
The MC33PF8200DEES uses the HVQFN56 package (8 mm × 8 mm × 0.9 mm, 0.5 mm pitch, dimple wettable flank). Its thermal resistance is RθJA = 22 °C/W on a 4-layer board and RθJC = 0.6 °C/W to the case, enabling reliable operation up to +105 °C ambient with proper PCB copper pour on the EPAD.
Can the MC33PF8200DEES be used with processors other than i.MX8QXP?
While the MC33PF8200DEES is optimized for i.MX8QXP with LPDDR4, the PF8200 family supports other NXP processors (e.g., S32V234, LS1043A) and select non-NXP SoCs. However, MC33PF8200DEES's OTP configuration is fixed for i.MX8QXP - alternative part numbers (e.g., MC33PF8200D2ES for S32V234) must be used for other targets.
MC33PF8200DEES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200DEES FAQ
1.How can I place an order for MC33PF8200DEES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200DEES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200DEES reliable?
The price and inventory of MC33PF8200DEES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200DEES is usually 5 days.
3.What payment methods are accepted for MC33PF8200DEES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200DEES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200DEES?
MC33PF8200DEES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200DEES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200DEES?
For technical support, including MC33PF8200DEES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200DEES requirements.
6.How does Aetrix verify that MC33PF8200DEES is sourced from the original manufacturer or authorized distributors?
All MC33PF8200DEES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200DEES meets industry standards.
7.What is the process for return or replacement of MC33PF8200DEES?
All MC33PF8200DEES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200DEES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200DEES part is unused and in its original packaging.
Return procedure for MC33PF8200DEES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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