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NXP Semiconductors MC33PF8200DEESR2
- Part No.:
- MC33PF8200DEESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200DEESR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX8 PRE-PR
- Quantity:
- Payment:
- Shipping:
Inventory:4,111
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Product details
Overview
MC33PF8200DEESR2 from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for i.MX8QXP processors with LPDDR4 memory. It integrates seven high-efficiency buck converters (0.4–1.8 V, 2.5 A each), four 400 mA LDOs, RTC supply (1.8/3.0/3.3 V), coin cell charger, watchdog timer, and ASIL B safety monitoring circuitry. It powers CPU cores, GPU, DDR I/O, and peripherals in infotainment and ADAS systems.
For engineers reviewing the MC33PF8200DEESR2 datasheet, MC33PF8200DEESR2 pinout, MC33PF8200DEESR2 application, or MC33PF8200DEESR2 equivalent, this page delivers verified technical context, validated pin functions, confirmed ASIL B safety features, real-world regulator sequencing behavior, and direct alternatives with documented functional differences - all aligned to NXP's PF8200 family specification Rev. 13 (March 2026).
Technical Context
The MC33PF8200DEESR2 implements a dual-phase capable architecture: SW1/SW2, SW3/SW4, and SW5/SW6 can be paired for higher current delivery (up to 5 A per pair), while SW1–SW3 support triple-phase operation (7.5 A) and SW1–SW4 quad-phase (10 A). Its OTP memory stores boot-time voltage setpoints, sequencing order, and safety configuration, eliminating external resistors and reducing startup latency.
It features a 24-channel analog multiplexer for system diagnostics, independent voltage monitors with programmable fault thresholds, thermal shutdown at 150 °C, and fail-safe output (FSOB) asserted during critical failures. The 3.4 MHz I²C interface enables dynamic voltage scaling and runtime reconfiguration of all regulators and safety parameters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 7 buck converters + 4 LDOs + RTC/VSNVS supply - fully integrated power tree for i.MX8QXP SoC and LPDDR4 memory subsystem |
| Buck Output Range | SW1–SW6: 0.4–1.8 V (6.25 mV steps); SW7: 1.0–4.1 V - supports core, I/O, and auxiliary rail requirements |
| Current Rating | 2.5 A per buck channel; 400 mA per LDO - sufficient for CPU clusters, GPU, DDR termination (VTT on SW6), and peripheral rails |
| Safety Certification | ASIL B compliant monitoring circuit - includes independent voltage/thermal monitoring, ABIST, CRC-protected registers, and fail-safe output (FSOB) |
| I²C Interface | Up to 3.4 MHz - enables fast register access for dynamic voltage scaling and real-time fault response |
| Package | HVQFN56, 8 mm × 8 mm × 0.9 mm, wettable flank - optimized for automotive thermal performance and automated optical inspection (AOI) |
| Operating Temp | −40 °C to +105 °C ambient - qualified for under-hood and head-unit automotive environments |
Pinout & Package
HVQFN56 package (SOT684-29(D)), 8 mm × 8 mm × 0.9 mm body, 0.5 mm pitch, dimple wettable flank - thermally enhanced for automotive reliability and solder joint inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable precise closed-loop regulation; each connects to respective output via resistor divider for voltage setting |
| SW1IN–SW7IN | Buck input supplies | Accept 2.7–5.5 V input; SW1–SW6 share VIN domain, SW7 may use separate source for higher-voltage rails |
| SW1LX–SW7LX | Switching node outputs | Drive external low-side FETs or inductor connections; tolerate −3.0 V transient spikes during dead time |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Deliver 1.5–5.0 V @ 400 mA; support load switch mode for controlled power gating of peripherals |
| VSNVS | RTC backup supply | Provides 1.8/3.0/3.3 V @ 10 mA from main rail or coin cell (LICELL); enables always-on clock and memory retention |
| SCL/SDA | I²C interface | 3.4 MHz high-speed bus for runtime configuration, telemetry readback, and safety register access |
| FSOB | Fail-safe output | Open-drain signal asserted LOW during critical faults (thermal runaway, voltage violation, self-test failure) to trigger system-level safe state |
| RESETBMCU | MCU reset output | Open-drain active-low reset signal synchronized to PMIC power-up sequence and fault conditions |
Key Features
| Feature | Design Value |
|---|---|
| Dual/triple/quad-phase buck configuration | Enables scalable current delivery: 5 A (dual), 7.5 A (triple), or 10 A (quad) without external phase controllers |
| OTP-based boot configuration | Eliminates 12+ external resistors and timing capacitors; reduces BOM count and improves startup repeatability |
| VTT termination on SW6 | Direct DDR memory termination support - avoids need for discrete VTT regulator or resistor network |
| 24-channel analog multiplexer (AMUX) | Enables system-level diagnostics by routing internal voltage/temperature monitors to a single ADC input |
| ASIL B functional safety architecture | Includes independent monitor chains, ABIST, CRC-protected registers, and fail-safe output - certified per ISO 26262 requirements |
| Coin cell charger with programmable control | Supports battery-backed RTC with adjustable charge current/voltage - extends backup runtime and prevents overcharge |
Applications
| Automotive Infotainment Head Unit | i.MX8QXP-Based ADAS Camera ECU |
|---|---|
Use Scenario: Powering i.MX8QXP SoC, LPDDR4 memory, display interface, and audio codecs in a vehicle head unit operating at −40 °C to +85 °C. IC Role / Device Role / Timing Role: Primary PMIC managing full power tree including CPU cores (SW1–SW3), GPU (SW4), DDR I/O (SW5), VTT (SW6), and analog/audio rails (LDO1–LDO4). Use Value: OTP-configured boot sequence ensures deterministic power-up timing; ASIL B monitoring protects against undervoltage/overvoltage events affecting display stability or audio playback. |
Use Scenario: Supplying i.MX8QXP processor, LPDDR4 memory, MIPI CSI-2 image sensor interface, and CAN FD transceiver in a rear-view camera module. IC Role / Device Role / Timing Role: Central power controller delivering regulated rails for vision processing, memory, sensor interface, and communication peripherals with fail-safe shutdown capability. Use Value: FSOB assertion halts image capture and triggers safe state upon thermal fault or voltage anomaly - preventing corrupted video stream or unsafe CAN message transmission. |
| Industrial HMI with Secure Boot | Connected Gateway with RTC Backup |
Use Scenario: Powering i.MX8QXP in a factory-floor HMI panel requiring secure boot, tamper detection, and guaranteed power sequencing across firmware updates. IC Role / Device Role / Timing Role: Safety-critical PMIC enforcing voltage monotonicity and timing windows during boot; I²C CRC and OTP write protection prevent malicious register modification. Use Value: ABIST and register CRC ensure integrity of safety-critical configuration; watchdog timeout counters detect MCU lockup and force hard reset via RESETBMCU. |
Use Scenario: Enabling always-on timekeeping and memory retention in a telematics gateway using coin cell backup during main power loss. IC Role / Device Role / Timing Role: Dual-source RTC supply (VIN or LICELL) with programmable charge control and VSNVS output for SNVS domain. Use Value: 10 mA VSNVS output sustains real-time clock and secure non-volatile storage; coin cell charging algorithm prevents overvoltage and extends battery life beyond 5 years. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DBES | Same PF8200 family, OTP preprogrammed for i.MX8QM + LPDDR4 PMIC2 role; identical ASIL B safety features and pinout | Targeted at i.MX8QM-based systems (e.g., digital cockpit), not i.MX8QXP; different regulator assignment and sequencing | Select only if migrating from i.MX8QM design; requires full revalidation of OTP settings and power tree mapping |
| MC33PF8100FJTS | Industrial-grade PF8100 variant; lacks ASIL B monitoring, ABIST, FSOB, and secure I²C - QM safety grade only | Approved for non-safety-critical industrial HMI or consumer applications; no fail-safe output or thermal shutdown lockout | Use where cost sensitivity outweighs functional safety; not acceptable for automotive ASIL B compliance |
Compared with MC33PF8200DEESR2, MC33PF8200DBES offers identical safety and electrical specs but targets a different SoC platform, while MC33PF8100FJTS removes safety-critical features entirely - making it unsuitable for automotive deployment despite shared pin compatibility.
Availability
MC33PF8200DEESR2 is available at Aetrix Electronics and suitable for automotive infotainment, ADAS camera ECUs, and industrial HMIs requiring stable component supply, long-term lifecycle support, and ASIL B-certified power management.
Supply support for MC33PF8200DEESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and power management.
The PF8200 product line was engineered specifically for NXP's i.MX 8 and S32x automotive processors, integrating safety-critical power delivery, flexible sequencing, and diagnostic capabilities required for ISO 26262-compliant systems.
FAQ
What is the primary target processor for MC33PF8200DEESR2?
The MC33PF8200DEESR2 is specifically configured for the i.MX8QXP application processor with LPDDR4 memory, as indicated by its OTP programming and ordering code 'DE'. It supports full power delivery to CPU clusters, GPU, DDR I/O, and peripheral interfaces in that platform.
Does MC33PF8200DEESR2 support dynamic voltage scaling (DVS)?
Yes, MC33PF8200DEESR2 supports DVS on SW1 through SW6 via its 3.4 MHz I²C interface. Voltage levels can be adjusted in 6.25 mV steps during runtime to match processor performance states, enabling power optimization in active and idle modes.
How does the fail-safe output (FSOB) behave during fault conditions?
The FSOB pin on MC33PF8200DEESR2 is an open-drain output that asserts LOW during critical faults - including thermal shutdown (>150 °C), voltage monitor violations, ABIST failure, or CRC errors. It remains asserted until the fault is cleared and the device resets.
What is the function of the TBBEN (Try Before Buy Enable) pin on MC33PF8200DEESR2?
TBBEN on MC33PF8200DEESR2 enables evaluation mode for early prototyping. When pulled HIGH, it allows temporary override of OTP-configured settings for lab validation without permanent programming - useful during bring-up and debug phases.
Can MC33PF8200DEESR2 power both DDR4 and LPDDR4 memory simultaneously?
No. MC33PF8200DEESR2 is OTP-programmed for LPDDR4 memory support in i.MX8QXP systems. While its buck regulators are electrically capable of DDR4-compatible voltages, the sequencing, timing, and VTT configuration are fixed for LPDDR4 - DDR4 requires MC33PF8200DHES or similar variant.
MC33PF8200DEESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200DEESR2 FAQ
1.How can I place an order for MC33PF8200DEESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200DEESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200DEESR2 reliable?
The price and inventory of MC33PF8200DEESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200DEESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF8200DEESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200DEESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200DEESR2?
MC33PF8200DEESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200DEESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200DEESR2?
For technical support, including MC33PF8200DEESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200DEESR2 requirements.
6.How does Aetrix verify that MC33PF8200DEESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF8200DEESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200DEESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF8200DEESR2?
All MC33PF8200DEESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200DEESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200DEESR2 part is unused and in its original packaging.
Return procedure for MC33PF8200DEESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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