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NXP Semiconductors MC33PF8200DFES
- Part No.:
- MC33PF8200DFES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200DFES.pdf
- Description:
- I.MX8QXP WITH DDR3L
- Quantity:
- Payment:
- Shipping:
Inventory:1,666
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Product details
Overview
MC33PF8200DFES from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for i.MX8QXP processors with DDR3L memory. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B safety monitoring. It operates from a 2.7 V to 5.5 V input and delivers up to 2.5 A per buck channel.
For engineers reviewing the MC33PF8200DFES datasheet, MC33PF8200DFES pinout, MC33PF8200DFES application, or MC33PF8200DFES equivalent, this page provides verified technical context, validated pin functions, confirmed automotive safety features (ASIL B), exact regulator voltage ranges and current ratings, and real-world use cases in infotainment and ADAS platforms requiring functional safety compliance.
Technical Context
The MC33PF8200DFES implements a dual-domain architecture: a high-speed digital state machine manages power sequencing, fault response, and I²C communication (up to 3.4 MHz), while analog regulation blocks handle precise voltage control across 12 channels. Its OTP memory stores startup configuration-including regulator enable order, voltage setpoints, and soft-start timing-eliminating external resistive programming components.
It supports dynamic voltage scaling on six buck regulators (SW1–SW6), configurable multi-phase operation (dual-, triple-, or quad-phase), VTT termination on SW6, and independent monitoring of all 12 outputs via dedicated VMON pins. Safety-critical functions-including ABIST, CRC-protected register writes, thermal shutdown, and fail-safe output (FSOB)-are hardware-enforced to meet ASIL B requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | VIN: 2.7 V to 5.5 V - powers entire PMIC; UVLO threshold at 2.7 V ensures reliable startup under automotive battery transients. |
| Buck Regulators | 7 channels (SW1–SW7); SW1–SW6: 0.4 V–1.8 V @ 2.5 A, ±1.5% accuracy; SW7: 1.0 V–4.1 V @ 2.5 A, ±2% - covers CPU core, GPU, memory I/O, and auxiliary rails. |
| LDO Regulators | 4 channels (LDO1–LDO4): 1.5 V–5.0 V @ 400 mA, ±3% accuracy with optional load switch mode - supplies low-noise analog, interface, and peripheral rails. |
| RTC & Backup Supply | VSNVS: 1.8 V / 3.0 V / 3.3 V @ 10 mA; LICELL input supports coin cell charging with programmable voltage/current - enables secure real-time clock and SRAM retention during main power loss. |
| Safety Certification | Automotive ASIL B compliant - includes independent voltage/thermal monitoring, ABIST, FSOB fail-safe output, watchdog with programmable timeout, and CRC-protected I²C writes. |
| Interface & Control | I²C up to 3.4 MHz; OTP-configurable power-up/down sequence; programmable soft-start; 24-channel analog multiplexer for system diagnostics - enables deterministic boot, runtime reconfiguration, and field diagnostics. |
| Package | HVQFN56, 8 mm × 8 mm × 0.9 mm, 0.5 mm pitch, wettable flank - optimized for automotive thermal performance and solder-joint inspection. |
Pinout & Package
HVQFN56 package with 56 terminals, thermally enhanced wettable flank design (SOT684-29(D)), 8 mm × 8 mm body, 0.9 mm height, and exposed EPAD connected to ground for optimal thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB (Pins 2,3,12,13,30,31,38) | Buck output voltage feedback | High-impedance inputs for closed-loop regulation; support external resistor dividers to set precise output voltages per channel. |
| SW1IN–SW7IN (Pins 4,7,8,11,32,35,37) | Buck input supply | Accepts 2.7–5.5 V input; each connects to local bulk capacitance to minimize ripple and support high di/dt switching currents. |
| SW1LX–SW7LX (Pins 5,6,9,10,33,34,36) | Buck switching node | High-frequency switched nodes driving external inductors; require tight layout with minimal parasitic inductance to limit voltage spikes. |
| LDO1OUT–LDO4OUT (Pins 15,18,25,28) | LDO regulated output | Low-noise, fixed or adjustable outputs; LDO1/LDO2 share common input (LDO12IN); LDO3/LDO4 have independent inputs (LDO3IN/LDO4IN). |
| VSNVS (Pin 47) | RTC and backup supply output | Programmable 1.8/3.0/3.3 V rail; powered from VIN or coin cell (LICELL); maintains timekeeping and memory retention during main power loss. |
| SCL/SDA (Pins 55/56) | I²C interface | Supports fast-mode Plus (3.4 MHz); enables runtime voltage adjustment, status readback, fault logging, and safety register access. |
| FSOB (Pin 29) | Fail-safe output | Open-drain ASIL B safety signal; asserts LOW on critical faults (thermal runaway, voltage monitor failure, ABIST error) to trigger system-level fail-safe response. |
| EPAD (Pin 57) | Thermal pad | Must be soldered to solid ground plane; primary thermal path for heat dissipation; reduces junction-to-board thermal resistance to 11 °C/W. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-based startup configuration | Eliminates 12+ external resistors and capacitors for voltage setpoints and sequencing; reduces BOM count and improves startup repeatability across temperature and voltage. |
| ASIL B functional safety architecture | Hardware-enforced monitoring of all 12 regulators, thermal sensors, and internal clocks; ABIST, CRC-protected registers, and FSOB provide traceable fault containment per ISO 26262. |
| Multi-phase buck configurability | SW1/SW2, SW3/SW4, or SW5/SW6 can operate as dual-phase; SW1/SW2/SW3 as triple-phase (7.5 A); SW1–SW4 as quad-phase (10 A) - scales current delivery for high-performance CPU/GPU cores. |
| VTT termination on SW6 | Configurable as DDR3L VTT rail (0.675 V @ 2.5 A) with active sink/source capability - eliminates need for discrete VTT regulator in memory subsystems. |
| 24-channel analog multiplexer (AMUX) | Enables system-level diagnostics by routing internal voltage monitors, die temperature sensors, and reference voltages to a single ADC input - simplifies board-level health monitoring. |
| Programmable watchdog & reset logic | WDI input accepts MCU watchdog pulses; RESETBMCU and INTB provide open-drain fault signaling; PWRON/STANDBY support hardware-controlled power states. |
Applications
| Automotive Infotainment Head Unit | ADAS Domain Controller |
|---|---|
|
Use Scenario: Powering i.MX8QXP processor, LPDDR4/DDR3L memory, display interface, audio codec, and CAN/FlexRay peripherals in a vehicle head unit. IC Role / Device Role / Timing Role: Primary PMIC managing 12-rail power tree including CPU core (SW1–SW3), GPU (SW4), memory I/O (SW5/SW6 VTT), and always-on RTC (VSNVS). Use Value: OTP-programmed sequencing ensures deterministic boot within <100 ms; ASIL B monitoring protects against undervoltage faults during CAN bus arbitration or display wake-up events. |
Use Scenario: Supplying S32V234 or i.MX8QM-based vision processing units with DDR3L memory, MIPI camera interfaces, and Ethernet AVB connectivity. IC Role / Device Role / Timing Role: Dual-role PMIC delivering high-current core rails (SW1–SW4 in multi-phase) and low-noise analog supplies (LDO1–LDO4) for image signal processors and SerDes PHYs. Use Value: Spread-spectrum switching and 24-channel AMUX enable EMI reduction and real-time thermal/voltage margining - critical for vision pipeline stability under varying ambient conditions. |
| Industrial HMI with Secure Boot | Telematics Control Unit (TCU) |
|
Use Scenario: Powering i.MX8QXP-based rugged HMI with eMMC, SIM card, GPS, and isolated RS-485 interfaces in factory automation equipment. IC Role / Device Role / Timing Role: Centralized power manager providing isolated 3.3 V/1.8 V I/O rails (SW5/SW6), coin-cell-backed RTC (VSNVS), and secure reset signaling (RESETBMCU/FSOB). Use Value: Fail-safe output (FSOB) and watchdog integration enable hardware-enforced secure boot verification; OTP prevents unauthorized firmware loading during power-up. |
Use Scenario: Supporting LTE/C-V2X modem, GNSS receiver, and automotive Ethernet switch in a cellular-connected TCU operating across −40°C to +105°C. IC Role / Device Role / Timing Role: Automotive-qualified PMIC delivering 1.1 V CPU core (SW1), 1.8 V DDR3L I/O (SW5), 3.3 V modem interface (SW7), and 1.5 V GNSS LDO (LDO2). Use Value: ASIL B monitoring ensures continuous validity of modem power rails during OTA updates; thermal shutdown (TJ > 150°C) prevents latch-up in sealed enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DEES | Same PF8200 family, identical 7-buck/4-LDO topology and ASIL B safety architecture; differs only in OTP configuration targeting i.MX8QXP with LPDDR4 (not DDR3L). | Optimized for LPDDR4 memory systems requiring tighter voltage tolerance (±0.5%) and higher bandwidth; lacks DDR3L-specific VTT calibration. | Select MC33PF8200DEES only when using LPDDR4; MC33PF8200DFES is mandatory for DDR3L memory with VTT termination. |
| MC33PF8200DHES | Same package and pinout; OTP configured for i.MX8QM with DDR4 memory PMIC2 role; adds DDR4-specific timing controls and VPP generation capability not present in DFES. | Targets quad-core i.MX8QM with DDR4-2400; supports VPP (2.5 V) and VDDQ (1.2 V) rails with dynamic refresh control - incompatible with DDR3L signaling. | Not interchangeable with MC33PF8200DFES; requires different memory controller interface and PCB layout due to DDR4-specific voltage and timing requirements. |
Compared with MC33PF8200DEES and MC33PF8200DHES, the MC33PF8200DFES uniquely supports DDR3L VTT termination, includes OTP-locked DDR3L memory timing parameters, and is validated for automotive infotainment systems using i.MX8QXP with DDR3L - making it the only drop-in solution for that specific memory interface.
Availability
MC33PF8200DFES is available at Aetrix Electronics and suitable for automotive infotainment, ADAS domain controllers, and telematics control units requiring stable component supply, ASIL B functional safety compliance, and long-term automotive lifecycle support.
Supply support for MC33PF8200DFES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The PF8200 product line is engineered specifically for high-performance NXP application processors (i.MX 8, S32x), integrating safety-critical power delivery, intelligent monitoring, and OTP-configurable flexibility to reduce system-level design complexity.
FAQ
What is the input voltage range supported by the MC33PF8200DFES?
The MC33PF8200DFES supports a main input voltage range of 2.7 V to 5.5 V on the VIN pin. This range accommodates automotive battery variations including cold-crank (down to ~6.0 V transient) and stop-start operation. Absolute maximum rating is 6.0 V, but sustained operation above 5.5 V is limited to ≤1800 seconds over device lifetime per datasheet specification.
Does the MC33PF8200DFES support DDR3L memory VTT termination?
Yes, the MC33PF8200DFES supports DDR3L VTT termination through its SW6 buck regulator, which is configurable for VTT mode (0.675 V ±1%) with up to 2.5 A sink/source capability. This is explicitly enabled in the OTP configuration for the DFES variant, distinguishing it from LPDDR4-optimized versions like DEES.
What safety certifications does the MC33PF8200DFES meet?
The MC33PF8200DFES is certified to ASIL B per ISO 26262, with hardware-enforced safety features including independent voltage/thermal monitoring, ABIST (analog built-in self-test), CRC-protected I²C register writes, fail-safe output (FSOB), and programmable watchdog with fault counter. It also meets AEC-Q100 Grade 2 (−40°C to +105°C) and has HBM ESD rating of 2000 V.
Can the MC33PF8200DFES be used with processors other than i.MX8QXP?
While the MC33PF8200DFES OTP is preconfigured for i.MX8QXP with DDR3L, its 7-buck/4-LDO architecture, I²C programmability, and wide output voltage ranges make it adaptable to other high-performance processors - including i.MX8QM, S32V234, and select non-NXP SoCs - provided external sequencing and voltage requirements align and OTP is reprogrammed accordingly.
What is the purpose of the FSOB pin on the MC33PF8200DFES?
The FSOB (Fail-Safe Output) pin on the MC33PF8200DFES is an open-drain safety signal that asserts LOW during critical failures - such as thermal shutdown, regulator undervoltage/overvoltage, ABIST failure, or watchdog timeout. It directly interfaces with system-level safety controllers to initiate fail-safe transitions, ensuring compliance with ASIL B requirements.
MC33PF8200DFES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200DFES FAQ
1.How can I place an order for MC33PF8200DFES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200DFES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200DFES reliable?
The price and inventory of MC33PF8200DFES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200DFES is usually 5 days.
3.What payment methods are accepted for MC33PF8200DFES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200DFES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200DFES?
MC33PF8200DFES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200DFES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200DFES?
For technical support, including MC33PF8200DFES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200DFES requirements.
6.How does Aetrix verify that MC33PF8200DFES is sourced from the original manufacturer or authorized distributors?
All MC33PF8200DFES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200DFES meets industry standards.
7.What is the process for return or replacement of MC33PF8200DFES?
All MC33PF8200DFES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200DFES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200DFES part is unused and in its original packaging.
Return procedure for MC33PF8200DFES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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