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NXP Semiconductors MC33PF8200DFESR2
- Part No.:
- MC33PF8200DFESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200DFESR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX8 PRE-PR
- Quantity:
- Payment:
- Shipping:
Inventory:2,666
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Product details
Overview
MC33PF8200DFESR2 from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for i.MX8QXP processors with DDR3L memory. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B safety monitoring. It operates from a 2.7 V to 5.5 V input and supports dynamic voltage scaling for CPU, GPU, and memory rails.
For engineers reviewing the MC33PF8200DFESR2 datasheet, MC33PF8200DFESR2 pinout, MC33PF8200DFESR2 application, or MC33PF8200DFESR2 equivalent, key selection criteria include ASIL B compliance, OTP-configurable startup sequencing, 3.4 MHz I²C interface, 56-pin HVQFN package with wettable flanks, and support for DDR3L memory power delivery in automotive infotainment systems.
Technical Context
The MC33PF8200DFESR2 implements a dual-phase capable architecture: SW1/SW2, SW3/SW4, and SW5/SW6 can be paired for higher current delivery, while SW1–SW4 support quad-phase operation up to 10 A. Its internal state machine handles fault detection, fail-safe transitions, and seamless processor handshaking via PWRON, STANDBY, and RESETBMCU signals.
It features 24-channel analog multiplexing for system diagnostics, ABIST for analog self-test, programmable soft-start/power-down sequences, and independent voltage/thermal monitoring per regulator. The FSOB pin provides fail-safe output assertion during critical faults, and XFAILB enables external synchronization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 12 channels: 7 buck (SW1–SW7) + 4 LDOs (LDO1–LDO4) + VSNVS RTC supply |
| Buck Output Range | SW1–SW6: 0.4 V–1.8 V (6.25 mV step); SW7: 1.0 V–4.1 V |
| Max Output Current | 2.5 A per buck; 400 mA per LDO; 10 mA VSNVS |
| I²C Interface | High-speed up to 3.4 MHz for runtime configuration and monitoring |
| Safety Certification | Automotive ASIL B compliant with independent voltage/thermal monitoring and ABIST |
| Input Voltage Range | VIN: 2.7 V to 5.5 V; LICELL: up to 4.2 V; absolute max 6.0 V |
| Operating Temp | −40 °C to +105 °C ambient; junction rated to 150 °C |
Pinout & Package
HVQFN56 package: 8 mm × 8 mm × 0.9 mm body, 0.5 mm pitch, thermal-enhanced wettable flank design (SOT684-29(D)), EPAD connected to ground for thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable precise closed-loop regulation of each buck output voltage |
| SW1IN–SW7IN | Buck input supplies | Accept 2.7–5.5 V input; SW7IN supports higher-voltage peripherals |
| SW1LX–SW7LX | Switching node outputs | Drive external low-side MOSFETs or integrated power stages; tolerate −3.0 V transient spikes |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Deliver 1.5–5.0 V at 400 mA with optional load switch mode |
| VSNVS | RTC supply output | Provides 1.8 V / 3.0 V / 3.3 V at 10 mA from VIN or coin cell backup |
| SCL/SDA | I²C interface | Support 3.4 MHz operation for real-time PMIC reconfiguration and telemetry |
| FSOB | Fail-safe output | Asserts low during critical faults (e.g., thermal shutdown, register corruption) to trigger system-level safety response |
| RESETBMCU | Open-drain reset | Signals MCU reset condition; active-low, pulled up externally |
Key Features
| Feature | Design Value |
|---|---|
| Dual-/quad-phase buck configuration | SW1/SW2, SW3/SW4, SW5/SW6 configurable as dual-phase; SW1–SW4 as quad-phase up to 10 A total |
| VTT termination mode | SW6 supports DDR3L VTT termination with programmable current limit and accuracy |
| OTP-based startup configuration | One-time programmable memory stores voltage setpoints, sequencing order, and safety thresholds-reducing external components |
| ASIL B functional safety | Includes independent voltage monitors, thermal shutdown, watchdog with counter, ABIST, and CRC-protected registers |
| Smart diagnostics | 24-channel analog multiplexer enables real-time monitoring of rail voltages, temperatures, and external sensors |
Applications
| Automotive Infotainment Head Unit | Advanced Driver Assistance Systems (ADAS) |
|---|---|
Use Scenario: Powering i.MX8QXP SoC, LPDDR4/DDR3L memory, display interfaces, and audio codecs in vehicle head units. IC Role / Device Role / Timing Role: Primary PMIC delivering sequenced, regulated rails for CPU cores, GPU, memory I/O, and peripheral subsystems. Use Value: Enables ASIL B-compliant power delivery with fail-safe FSOB assertion and diagnostic coverage for ISO 26262 requirements. | Use Scenario: Supplying S32V234 vision processor and associated image sensors, ISP, and CAN/FlexRay interfaces in camera-based ADAS modules. IC Role / Device Role / Timing Role: Central power controller managing core, memory, and I/O rails with synchronized startup and fault containment. Use Value: Supports DDR3L memory at 10 A peak via SW6 VTT mode and delivers robust thermal monitoring across all rails. |
| Industrial Edge Gateway | Secure Automotive Telematics Control Unit (TCU) |
Use Scenario: Powering i.MX8QM-based gateways handling cellular (LTE), Wi-Fi, and industrial protocol stacks in harsh environments. IC Role / Device Role / Timing Role: High-reliability PMIC providing redundant monitoring, wide-temp operation, and programmable power states. Use Value: Leverages OTP configuration and 3.4 MHz I²C for remote firmware updates and dynamic rail tuning without hardware changes. | Use Scenario: Supporting secure boot, cryptographic acceleration, and OTA update functions in automotive TCUs using i.MX8QXP with DDR3L. IC Role / Device Role / Timing Role: Safety-aware power manager with secure I²C write capability and fail-safe output for security-critical power domains. Use Value: Integrates coin cell charging for RTC backup and uses ABIST to validate analog monitors before secure boot execution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DEES | Same PF8200 family, configured for i.MX8QXP with LPDDR4 memory instead of DDR3L; identical ASIL B safety features and pinout | Targets LPDDR4-based designs requiring higher memory bandwidth; not optimized for DDR3L VTT termination | Select MC33PF8200DEES only when LPDDR4 memory is used and VTT termination is unnecessary |
| MC33PF8200DHES | Configured for i.MX8QM with DDR4 memory PMIC2 role; includes SW6 VTT mode for DDR4, different OTP settings and voltage ranges | Designed for quad-core i.MX8QM with DDR4, not compatible with i.MX8QXP DDR3L memory topology | Choose MC33PF8200DHES only for i.MX8QM + DDR4 systems where higher core count and memory bandwidth are required |
Compared with MC33PF8200DEES and MC33PF8200DHES, the MC33PF8200DFESR2 uniquely combines ASIL B compliance, DDR3L-optimized VTT termination on SW6, and OTP configuration validated for i.MX8QXP - making it the only drop-in solution for automotive infotainment platforms using that specific memory interface.
Availability
MC33PF8200DFESR2 is available at Aetrix Electronics and suitable for automotive infotainment head units, ADAS vision processing modules, and industrial edge gateways requiring stable component supply, long-term lifecycle support, and ASIL B-certified power management.
Supply support for MC33PF8200DFESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The PF8200 product line delivers automotive-qualified, ASIL B-compliant PMICs engineered specifically for NXP's i.MX 8 and S32x application processors - emphasizing safety, configurability, and integration density for high-performance embedded systems.
FAQ
What is the primary target processor for MC33PF8200DFESR2?
The MC33PF8200DFESR2 is specifically configured for the NXP i.MX8QXP application processor with DDR3L memory. Its OTP programming, voltage ranges, and SW6 VTT termination mode are validated for this platform. It is not intended for i.MX8QM or S32V234 without reconfiguration, and its safety features align with automotive infotainment use cases requiring ASIL B compliance.
Does MC33PF8200DFESR2 support dynamic voltage scaling (DVS)?
Yes, MC33PF8200DFESR2 supports DVS on SW1 through SW6, enabling real-time adjustment of output voltages during operation via its 3.4 MHz I²C interface. This allows adaptive power management for CPU, GPU, and memory domains based on workload, improving efficiency without compromising performance in i.MX8QXP-based systems.
How does the fail-safe output (FSOB) function in MC33PF8200DFESR2?
The FSOB pin in MC33PF8200DFESR2 asserts low during critical failures-including thermal shutdown, register corruption, watchdog timeout, or voltage monitor faults. It is directly tied to the internal safety state machine and remains asserted until a hard reset or power cycle clears the fault condition, enabling deterministic system-level safety responses per ISO 26262.
What is the role of the LICELL pin on MC33PF8200DFESR2?
The LICELL pin on MC33PF8200DFESR2 accepts input from a coin cell battery (up to 4.2 V) to back up the VSNVS RTC supply. It enables battery charging with programmable current and voltage, ensuring continuous real-time clock operation and memory retention during main power loss-critical for automotive telematics and infotainment logging functions.
Is MC33PF8200DFESR2 pin-compatible with other PF8200 variants?
Yes, all PF8200 variants-including MC33PF8200DFESR2-share the identical 56-pin HVQFN package (SOT684-29(D)) and pinout. Differences lie solely in OTP configuration, safety feature enablement, and pre-programmed memory content; no PCB layout change is required when migrating between PF8200 part numbers targeting the same processor family.
MC33PF8200DFESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200DFESR2 FAQ
1.How can I place an order for MC33PF8200DFESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200DFESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200DFESR2 reliable?
The price and inventory of MC33PF8200DFESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200DFESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF8200DFESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200DFESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200DFESR2?
MC33PF8200DFESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200DFESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200DFESR2?
For technical support, including MC33PF8200DFESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200DFESR2 requirements.
6.How does Aetrix verify that MC33PF8200DFESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF8200DFESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200DFESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF8200DFESR2?
All MC33PF8200DFESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200DFESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200DFESR2 part is unused and in its original packaging.
Return procedure for MC33PF8200DFESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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