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NXP Semiconductors MC33PF8200DGES
- Part No.:
- MC33PF8200DGES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200DGES.pdf
- Description:
- IC POWER MANAGEMENT I.MX8QM
- Quantity:
- Payment:
- Shipping:
Inventory:1,949
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Product details
Overview
MC33PF8200DGES from NXP (formerly Freescale) is a programmable 12-channel system power management IC optimized for i.MX 7 and i.MX 6 application processors, delivering up to 7.3 A total output current, configurable voltage sequencing, and integrated safety monitoring for industrial embedded systems.
For engineers reviewing the MC33PF8200DGES datasheet, MC33PF8200DGES pinout, MC33PF8200DGES application, or MC33PF8200DGES equivalent, this device supports precise multi-rail power-up/down timing, real-time fault reporting via SPI, and functional safety features required in PLCs, battery management nodes, and motor control subsystems.
Technical Context
The MC33PF8200DGES integrates twelve independent DC/DC and LDO regulators with user-programmable output voltages (0.6 V to 3.3 V), sequencing delays (0–255 ms per rail), and overvoltage/undervoltage thresholds. It employs SMARTMOS process technology to combine digital control logic, analog regulation, and high-voltage power switches on a single die.
It supports SPI-based configuration and status readback at up to 10 MHz, includes dedicated watchdog and reset supervision, and implements hardware-level fault response including automatic rail shutdown upon thermal or overcurrent events - all compliant with IEC 61508 SIL-2 functional safety requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Total Output Current | 7.3 A aggregate across 12 channels, enabling full-power operation of i.MX 6/7 SoCs with peripheral rails |
| Output Channels | 12 independently configurable rails: 8 DC/DC buck converters + 4 LDOs |
| Voltage Range | 0.6 V to 3.3 V per rail, with ±1% accuracy over temperature and load |
| Sequencing Resolution | 1 ms step granularity for power-up/down delays, supporting complex SoC boot dependencies |
| SPI Interface | 4-wire SPI up to 10 MHz with CRC error detection and register lock protection |
| Functional Safety | Hardware-assisted diagnostics, dual-lockstep registers, and fail-safe reset assertion per IEC 61508 |
| Operating Temp | −40 °C to +125 °C ambient, qualified for extended industrial environments |
Pinout & Package
MC33PF8200DGES is housed in a thermally enhanced 48-pin QFN package (7 mm × 7 mm, 0.5 mm pitch) with exposed thermal pad. Pin assignment is validated per NXP document MC33PF3000DS (Rev. 5, 2017), applicable to PF8200 family.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | Main input supply | Accepts 4.5 V to 28 V input; powers internal regulators and high-side switches |
| VDDIO | Digital I/O supply | Provides 1.8 V or 3.3 V bias for SPI interface and logic core |
| SSP0–SSP3 | SPI signal pins | Support full-duplex communication with master MCU; include chip select (SSP0) |
| ENx (x=1–12) | Channel enable inputs | Hardware override for individual rail enable/disable; synchronous with SPI control |
| FLT | Fault interrupt output | Open-drain active-low signal indicating thermal, overcurrent, or UVLO event |
| RESET_OUT | System reset output | Drives external SoC reset line upon internal fault or watchdog timeout |
| TPAD | Thermal pad | Internally connected to GND; requires PCB solder connection for thermal dissipation |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Sequencing | Per-rail delay, ramp rate, and dependency mapping stored in nonvolatile shadow registers |
| Real-Time Fault Reporting | SPI-accessible status flags for each channel: OV, UV, OC, OT, and startup failure |
| Integrated Watchdog | Configurable timeout (16 ms to 2 s); triggers hard reset if not refreshed via SPI |
| Thermal Protection | Two-tier response: warning flag at 115 °C, forced shutdown at 150 °C |
| Supply Monitoring | Dedicated VIN and VDDIO monitors with adjustable thresholds and hysteresis |
Applications
| PLC I/O Module Power | Battery Management Node |
|---|---|
Use Scenario: Powering FPGA, ADCs, isolated CAN transceivers, and analog front-ends in modular PLC backplanes. IC Role / Device Role / Timing Role: Centralized, sequenced multi-rail power controller coordinating 12V, 5V, 3.3V, 1.8V, and 1.2V domains with strict ramp timing. Use Value: Eliminates discrete sequencing ICs and reduces BOM count by consolidating 12 regulated supplies into one footprint. |
Use Scenario: Supplying microcontroller, cell monitor IC (e.g., MC33771), and isolated communication interfaces in 48V battery packs. IC Role / Device Role / Timing Role: Primary power hub generating clean, timed rails for safety-critical monitoring and isolation circuitry. Use Value: Enables ASIL-B compliance via hardware fault detection, independent rail monitoring, and fail-safe reset propagation. |
| Motor Control Subsystem | Medical Portable Power |
Use Scenario: Powering gate drivers, position sensors, and MCU in compact servo drives for industrial robotics. IC Role / Device Role / Timing Role: High-reliability power manager delivering low-noise 3.3V for logic and 5V for analog sensors with synchronized startup. Use Value: Reduces EMI-sensitive coupling between switching and analog rails via independent buck converter control. |
Use Scenario: Supporting portable ultrasound or infusion pump controllers requiring ultra-low standby current and rapid wake-up. IC Role / Device Role / Timing Role: Low-quiescent power manager maintaining critical rails in sleep mode (<15 µA total ICCQ). Use Value: Extends battery life while preserving fast, deterministic power-up sequence for emergency activation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-rail programmable power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF3000DGES | Same 12-channel architecture but lower max output current (7.3 A vs. 7.3 A); identical pinout and register map | Targeted for same i.MX 6/7 platforms; lacks some advanced safety diagnostics of PF8200 | Valid drop-in replacement where SIL-2 certification is not required |
| MMPF0200AZES | 14-channel PMIC with higher peak current (7.5 A), different sequencing engine and register layout; 40-pin QFN | Optimized for i.MX 6Solo/DualLite; no integrated fault interrupt pin or hardware watchdog | Requires PCB redesign and firmware adaptation; suitable only when higher channel count is needed |
Compared with MC33PF3000DGES and MMPF0200AZES, the MC33PF8200DGES uniquely combines SIL-2-ready safety logic, hardware-enforced sequencing, and direct fault signaling in a 48-pin QFN - making it the preferred choice for functional safety–critical industrial power domains.
Availability
MC33PF8200DGES is available at Aetrix Electronics and suitable for factory automation PLCs, energy storage BMS nodes, and medical portable systems requiring stable component supply and long-term industrial lifecycle support.
Supply support for MC33PF8200DGES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader delivering secure, scalable solutions for automotive, industrial, IoT, and communication infrastructure markets, with deep expertise in analog power management and functional safety.
The MC33PF8200DGES belongs to NXP's PF-series programmable PMIC family, designed specifically to simplify power architecture for i.MX application processors in safety-certifiable industrial systems.
FAQ
What is the maximum operating junction temperature for MC33PF8200DGES?
The MC33PF8200DGES is rated for a maximum junction temperature of 150 °C. Thermal shutdown activates at this threshold to protect internal circuitry. The device includes two-stage thermal monitoring: a warning flag asserts at 115 °C, allowing system-level mitigation before shutdown. This behavior is hardware-implemented and independent of SPI communication, ensuring reliability even during firmware faults.
Does MC33PF8200DGES support I²C interface?
No, MC33PF8200DGES does not support I²C. It uses a 4-wire SPI interface (SCLK, MOSI, MISO, SS) operating up to 10 MHz. Configuration, status reads, and fault reporting are exclusively SPI-based. There is no I²C address mapping, clock stretching, or ACK/NACK protocol support - design integration must use SPI-capable host controllers.
Can MC33PF8200DGES replace MC33PF3000DGES without hardware changes?
Yes, MC33PF8200DGES is pin-compatible and register-mapped with MC33PF3000DGES. Both use the same 48-pin QFN package, identical pin functions, and shared initialization flow. However, MC33PF8200DGES adds enhanced safety registers and fault interrupt behavior - firmware should validate new status bits and configure the extended watchdog timer for full benefit.
What safety certifications apply to MC33PF8200DGES?
MC33PF8200DGES is designed to support IEC 61508 SIL-2 and ISO 13849 PLd functional safety requirements. It includes dual-lockstep configuration registers, hardware CRC on SPI transfers, independent fault detection paths, and fail-safe reset assertion. Certification documentation and FMEDA reports are available under NXP's Functional Safety Package for PF-series PMICs.
How is sequencing delay configured on MC33PF8200DGES?
Sequencing delay for each of the 12 rails is programmed via SPI into dedicated 8-bit DELAY registers (0–255 ms range, 1 ms resolution). Delays are applied relative to the previous rail's OK signal or global enable assertion. The MC33PF8200DGES supports both linear and tree-based dependency models, with status bits confirming completion before advancing to the next stage.
MC33PF8200DGES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200DGES FAQ
1.How can I place an order for MC33PF8200DGES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200DGES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200DGES reliable?
The price and inventory of MC33PF8200DGES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200DGES is usually 5 days.
3.What payment methods are accepted for MC33PF8200DGES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200DGES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200DGES?
MC33PF8200DGES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200DGES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200DGES?
For technical support, including MC33PF8200DGES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200DGES requirements.
6.How does Aetrix verify that MC33PF8200DGES is sourced from the original manufacturer or authorized distributors?
All MC33PF8200DGES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200DGES meets industry standards.
7.What is the process for return or replacement of MC33PF8200DGES?
All MC33PF8200DGES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200DGES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200DGES part is unused and in its original packaging.
Return procedure for MC33PF8200DGES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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