My Inquiry
My Account
NXP Semiconductors MC33PF8200DHES
- Part No.:
- MC33PF8200DHES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200DHES.pdf
- Description:
- IC POWER MANAGEMENT I.MX8QM
- Quantity:
- Payment:
- Shipping:
Inventory:1,678
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC33PF8200DHES from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for i.MX8QM-based DDR4 memory PMIC2 applications. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B safety monitoring circuitry. Its OTP-configurable startup sequence and 3.4 MHz I²C interface enable precise, flexible power control in high-performance infotainment systems.
For engineers reviewing the MC33PF8200DHES datasheet, MC33PF8200DHES pinout, MC33PF8200DHES application, or MC33PF8200DHES equivalent, this page delivers verified technical context, validated pin functions, confirmed automotive safety features (ASIL B), exact regulator output ranges (e.g., SW1–SW6: 0.4–1.8 V; SW7: 1.0–4.1 V), and real-world use cases in i.MX8QM DDR4 memory subsystems.
Technical Context
The MC33PF8200DHES implements a dual-phase capable architecture: SW1/SW2, SW3/SW4, and SW5/SW6 can be paired for higher current delivery, while SW1–SW3 support triple-phase operation up to 7.5 A. Its integrated 24-channel analog multiplexer enables system-level diagnostics, and the dedicated FSOB safety output asserts during critical faults per ASIL B requirements.
Startup is governed by a deterministic state machine with OTP-programmed sequencing, UVLO detection at VIN, and fail-safe transitions including hard WD reset, fault shutdown, and fail-safe state entry. The device supports dynamic voltage scaling on six bucks, VTT termination on SW6, and spread-spectrum switching to reduce EMI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VIN Range | 2.7 V to 5.5 V input - powers all internal regulators and enables direct connection to automotive battery rail with robust overvoltage protection. |
| Buck Output Range (SW1–SW6) | 0.4 V to 1.8 V in 6.25 mV steps - supports core voltage scaling for i.MX8QM CPU/GPU domains and LPDDR4/DDR4 I/O rails. |
| Buck Output Range (SW7) | 1.0 V to 4.1 V - supplies auxiliary rails such as eMMC, SD card, or peripheral interfaces requiring higher voltage. |
| LDO Output Range (LDO1–LDO4) | 1.5 V to 5.0 V, ±3% accuracy - delivers stable bias for analog peripherals, sensors, or interface logic with optional load switch mode. |
| VSNVS Output | 1.8 V / 3.0 V / 3.3 V, 10 mA - provides always-on RTC supply with coin cell backup and programmable charging (LICELL input). |
| I²C Interface Speed | Up to 3.4 MHz - enables rapid runtime reconfiguration of regulator settings, fault thresholds, and sequencing parameters. |
| Safety Certification | ASIL B compliant - includes independent voltage monitors, thermal shutdown, ABIST, CRC-protected registers, and FSOB fail-safe output. |
Pinout & Package
MC33PF8200DHES uses an HVQFN56 package: 8 mm × 8 mm × 0.9 mm body, 0.5 mm pitch, thermally enhanced wettable flank design (SOT684-29(D)), with exposed EPAD connected to ground for optimal thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable closed-loop regulation; each connects to respective output via resistor divider for precise voltage setting (e.g., SW1FB sets CPU core voltage). |
| SW1IN–SW7IN | Buck input supplies | Accept main VIN or intermediate rails; SW6IN supports VTT termination mode for DDR memory bus termination. |
| SW1LX–SW7LX | Buck switching nodes | High-frequency AC outputs driving external inductors; require low-inductance layout to limit negative spikes (< −3.0 V transient allowed). |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Deliver low-noise, fixed or programmable voltages to analog/peripheral circuits; LDO2EN allows hardware-controlled enable/disable. |
| VSNVS, LICELL | RTC supply & coin cell input | VSNVS provides always-on 1.8/3.0/3.3 V; LICELL accepts 0–4.2 V coin cell for backup power and charging control. |
| SCL/SDA | I²C interface | Supports high-speed (3.4 MHz) register access for runtime tuning, fault logging, and safety-critical configuration updates. |
| FSOB | Fail-safe output | Open-drain signal asserted LOW during critical faults (thermal, voltage, watchdog timeout) to trigger system-level safe state per ASIL B. |
| RESETBMCU, INTB, EWARN | System control signals | RESETBMCU resets MCU on fault; INTB signals general interrupts; EWARN provides early warning before fault escalation. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable startup sequence | Eliminates external resistors and timing components; stores voltage targets, ramp rates, and power-up order for repeatable, reliable boot across i.MX8QM DDR4 platforms. |
| Dual/triple/quad-phase buck configuration | Enables scalable current delivery: SW1/SW2 dual-phase (5 A), SW1–SW3 triple-phase (7.5 A), or SW1–SW4 quad-phase (10 A) for high-current CPU/GPU cores. |
| VTT termination on SW6 | Directly supplies DDR4 VTT rail with precision regulation and current sensing - removes need for external VTT regulator and reduces BOM count. |
| 24-channel analog multiplexer (AMUX) | Routes internal voltage/current/temperature sensor data to external ADC or MCU for real-time health monitoring and predictive diagnostics. |
| ASIL B functional safety architecture | Includes independent monitor chains, ABIST, CRC-protected registers, FSOB fail-safe output, and lock-down behavior during critical failures - certified for automotive infotainment. |
| Programmable soft-start & power-down sequencing | Prevents inrush current and ensures controlled voltage ramping/down across 12 channels - essential for avoiding latch-up in complex SoC memory subsystems. |
Applications
| Automotive Infotainment Head Unit | i.MX8QM DDR4 Memory Subsystem |
|---|---|
Use Scenario: High-resolution display, multi-zone audio, navigation, and connectivity in Tier-1 head units requiring ASIL-compliant power integrity. IC Role / Device Role / Timing Role: Primary PMIC supplying CPU cores, GPU, DDR4 memory (VDDQ/VTT), and peripherals with synchronized sequencing and fault containment. Use Value: Enables single-chip power solution for i.MX8QM DDR4 PMIC2 role, reducing board area by 30% vs. discrete regulators and meeting ASIL B diagnostic coverage requirements. |
Use Scenario: DDR4 memory interface in advanced driver assistance systems (ADAS) domain controllers where timing margin and voltage stability are critical. IC Role / Device Role / Timing Role: Dedicated DDR4 PMIC providing VDDQ (1.2 V), VTT (0.6 V), and VPP (2.5 V) with sub-10 mV ripple and <1 µs response to load transients. Use Value: SW6's integrated VTT termination eliminates external components, improves signal integrity on 2400+ MT/s DDR4 buses, and reduces EMI through spread-spectrum switching. |
| Advanced Digital Cluster | Vehicle Telematics Gateway |
Use Scenario: Real-time rendering of vehicle metrics, ADAS alerts, and video streaming in digital instrument clusters operating at −40°C to +105°C ambient. IC Role / Device Role / Timing Role: Power manager delivering multiple low-noise, tightly regulated rails to SoC, display driver, and CAN/FlexRay transceivers with thermal-aware throttling. Use Value: On-die thermal monitoring and automatic derating prevent thermal runaway during sustained GPU load, extending product lifetime in sealed enclosures. |
Use Scenario: Cellular/V2X gateway aggregating data from multiple ECUs, requiring robust power for LTE modem, GNSS, and secure MCU under varying battery conditions. IC Role / Device Role / Timing Role: Centralized power hub supplying modem core (SW1), RF front-end (SW7), secure element (LDO3), and RTC (VSNVS) with battery-backed retention. Use Value: Coin cell charger (LICELL) and VSNVS maintain clock/calendar during ignition-off; OTP ensures consistent power-up behavior across firmware updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DBES | Same PF8200 family, identical 56-pin HVQFN package and ASIL B safety architecture; configured for i.MX8QM LPDDR4 PMIC2 (not DDR4). | Targets LPDDR4 memory subsystems with different VDDQ/VTT voltage requirements and timing profiles than DDR4. | Select MC33PF8200DBES only when powering LPDDR4; MC33PF8200DHES is required for DDR4-specific VTT and sequencing. |
| MC33PF8200ETES | Same PF8200 family and package; OTP programmed for i.MX8QM DDR4 PMIC1 role - supplies CPU/GPU cores and VDDIO, not memory rails. | Designed for processor core power (PMIC1), lacking DDR4-specific VTT regulation and memory interface timing optimizations. | Use MC33PF8200ETES for CPU/GPU primary power; MC33PF8200DHES is mandatory for DDR4 memory rail generation and termination. |
Compared with MC33PF8200DBES and MC33PF8200ETES, the MC33PF8200DHES uniquely combines DDR4-specific VTT regulation, OTP-locked memory rail sequencing, and ASIL B compliance for DDR4 memory subsystems - making it non-interchangeable for DDR4 PMIC2 implementations.
Availability
MC33PF8200DHES is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, and vehicle telematics gateways requiring stable component supply, long-term lifecycle support, and ASIL B-certified power management.
Supply support for MC33PF8200DHES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in application processors and power management.
The PF8200 product line was engineered specifically for NXP's i.MX 8 and S32x application processors, delivering integrated, safety-certified power solutions that reduce system complexity and accelerate time-to-market for high-performance automotive electronics.
FAQ
What is the primary application target for the MC33PF8200DHES?
The MC33PF8200DHES is specifically configured as the DDR4 memory PMIC2 for NXP i.MX8QM-based systems. It supplies and sequences VDDQ, VTT, and related memory interface rails with ASIL B safety compliance, distinguishing it from PMIC1 (core power) or LPDDR4 variants. Its OTP image is preprogrammed for DDR4 timing and voltage requirements.
Does the MC33PF8200DHES support VTT termination for DDR4 memory?
Yes, the MC33PF8200DHES supports VTT termination via SW6, which is configurable for DDR4 VTT (0.6 V) with precision regulation and current sensing. This eliminates the need for an external VTT regulator and ensures tight voltage tolerance (<±15 mV) required for stable 2400+ MT/s DDR4 operation.
What safety certifications does the MC33PF8200DHES meet?
The MC33PF8200DHES meets ASIL B functional safety requirements per ISO 26262. It includes independent voltage/thermal monitors, ABIST, CRC-protected registers, fail-safe output (FSOB), and deterministic fault-handling state machine - all validated in the PF8200 automotive qualification.
Can the MC33PF8200DHES be used with processors other than i.MX8QM?
While the MC33PF8200DHES is OTP-configured for i.MX8QM DDR4 PMIC2, the underlying PF8200 silicon supports other NXP processors (e.g., S32V234, LS1043A) and select non-NXP SoCs. However, the DHES variant's OTP image is locked to i.MX8QM DDR4; alternate configurations require different part numbers (e.g., MC33PF8200D2ES for S32V234).
What is the role of the LICELL and VSNVS pins on the MC33PF8200DHES?
LICELL accepts a 0–4.2 V coin cell to back up the VSNVS rail, which provides 1.8 V / 3.0 V / 3.3 V at 10 mA for RTC and battery-backed memory. The integrated charger supports programmable charge current and voltage, ensuring reliable timekeeping and data retention during vehicle ignition-off periods.
MC33PF8200DHES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200DHES FAQ
1.How can I place an order for MC33PF8200DHES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200DHES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200DHES reliable?
The price and inventory of MC33PF8200DHES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200DHES is usually 5 days.
3.What payment methods are accepted for MC33PF8200DHES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200DHES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200DHES?
MC33PF8200DHES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200DHES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200DHES?
For technical support, including MC33PF8200DHES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200DHES requirements.
6.How does Aetrix verify that MC33PF8200DHES is sourced from the original manufacturer or authorized distributors?
All MC33PF8200DHES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200DHES meets industry standards.
7.What is the process for return or replacement of MC33PF8200DHES?
All MC33PF8200DHES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200DHES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200DHES part is unused and in its original packaging.
Return procedure for MC33PF8200DHES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC33PF8200DHES Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
