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NXP Semiconductors MC33PF8200DHESR2
- Part No.:
- MC33PF8200DHESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200DHESR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX8 PRE-PR
- Quantity:
- Payment:
- Shipping:
Inventory:4,231
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Product details
Overview
MC33PF8200DHESR2 from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for i.MX8QM DDR4 memory PMIC2 applications. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B safety monitoring. It operates from a 2.7–5.5 V input and delivers up to 2.5 A per buck channel with ±1.5% output accuracy.
For engineers reviewing the MC33PF8200DHESR2 datasheet, MC33PF8200DHESR2 pinout, MC33PF8200DHESR2 application, or MC33PF8200DHESR2 equivalent, this page provides verified technical context, validated pin functions, confirmed automotive safety features (ASIL B), OTP-configurable startup sequencing, and I²C-controlled dynamic voltage scaling - all critical for i.MX8QM-based infotainment and ADAS platform design.
Technical Context
The MC33PF8200DHESR2 implements a dual-phase capable architecture: SW1/SW2, SW3/SW4, and SW5/SW6 can be paired for higher current delivery, while SW1–SW4 support quad-phase operation up to 10 A. Its integrated state machine manages power-up/down sequencing, fault detection (OV/UV, thermal, watchdog timeout), and fail-safe transitions via FSOB assertion.
It embeds 24-channel analog multiplexing for system diagnostics, ABIST for analog self-test, and secure I²C write protection for safety-critical registers. The device uses OTP memory to store boot configuration, eliminating external resistors for voltage setpoints and sequencing order - reducing BOM count and improving startup repeatability in automotive environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7 V to 5.5 V - supports wide automotive battery range including cold-crank conditions down to 2.7 V. |
| Buck Output Accuracy | ±1.5 % for SW1–SW6, ±2 % for SW7 - ensures tight voltage regulation for CPU, GPU, and memory rails under load transients. |
| Max Buck Current | 2500 mA per channel - sufficient for powering i.MX8QM core, DDR4 VDDQ/VTT, and peripheral I/O supplies. |
| I²C Interface Speed | Up to 3.4 MHz - enables fast runtime reconfiguration of voltages, sequencing, and safety thresholds during system operation. |
| Safety Certification | ASIL B compliant monitoring circuit - includes independent voltage monitors, thermal shutdown, watchdog supervision, and ABIST for functional safety compliance. |
| Package | HVQFN56, 8 mm × 8 mm × 0.9 mm with wettable flanks - optimized for automotive thermal performance and automated optical inspection (AOI). |
| Operating Temperature | −40 °C to +105 °C ambient - qualified for under-hood and dashboard-mounted infotainment modules. |
Pinout & Package
HVQFN56 package with 0.5 mm pitch, 8 mm × 8 mm body, and exposed thermal pad (EPAD) connected to ground. Wettable flank design enables reliable solder joint inspection per automotive AEC-Q200 requirements.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable precise closed-loop regulation of each buck output; support resistor-divider programming or direct connection to regulated rail. |
| SW1IN–SW7IN | Buck input supplies | Accept main VIN or intermediate rail inputs; require local ceramic decoupling and low-ESR bulk capacitance. |
| SW1LX–SW7LX | Switching node outputs | Drive external high-side MOSFETs or internal power stages; require careful layout to minimize EMI and voltage spikes. |
| LDO1OUT–LDO4OUT | Linear regulator outputs | Provide low-noise, low-dropout supplies for analog/RTC circuits; support optional load switch mode for power gating. |
| VSNVS | RTC supply output | Delivers 1.8 V / 3.0 V / 3.3 V at 10 mA from VIN or coin cell - maintains real-time clock and backup memory during main power loss. |
| SCL/SDA | I²C interface signals | Support high-speed (3.4 MHz) communication for runtime configuration, telemetry, and safety register access. |
| FSOB | Failsafe output pin | Open-drain signal asserted LOW during critical faults (thermal, OV, UV, watchdog timeout) - triggers system-level safe state entry. |
| RESETBMCU | MCU reset output | Open-drain active-low reset signal synchronized to PMIC power-up sequence - ensures deterministic processor initialization. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable startup sequence | Eliminates external resistors and timing components; stores voltage setpoints, enable order, and soft-start timing in one-time programmable memory. |
| Dual-/quad-phase buck configuration | SW1–SW4 configurable as quad-phase regulator delivering up to 10 A - ideal for high-current DDR4 VDDQ or CPU core rails. |
| VTT termination mode on SW6 | Enables precise DDR4 VTT tracking (0.5 × VDDQ) without external components - reduces layout complexity and improves signal integrity. |
| 24-channel analog multiplexer (AMUX) | Allows system-level diagnostics by routing internal voltage/current/temperature sensors to a single ADC input - simplifies board-level monitoring. |
| ABIST and CRC-protected registers | Ensures analog monitor integrity and register data reliability before power-up - required for ASIL B functional safety compliance. |
Applications
| Automotive Infotainment Head Unit | i.MX8QM-Based ADAS Domain Controller |
|---|---|
|
Use Scenario: Powering i.MX8QM processor, LPDDR4/DDR4 memory, display interface, and audio codecs in a vehicle head unit. IC Role / Device Role / Timing Role: Primary PMIC managing 12 independent rails including CPU core (SW1–SW3), DDR4 VDDQ/VTT (SW4–SW6), RTC (VSNVS), and analog peripherals (LDO1–LDO4). Use Value: OTP-programmed sequencing ensures deterministic boot across temperature and voltage extremes; ASIL B monitoring protects against undervoltage events during engine start-stop cycles. |
Use Scenario: Supplying power to i.MX8QM, camera ISPs, Ethernet AVB, and CAN FD interfaces in a centralized ADAS controller. IC Role / Device Role / Timing Role: Dual-role PMIC providing both high-current digital rails (SW1–SW4) and low-noise analog supplies (LDO1–LDO4, VSNVS) with synchronized power-down for domain isolation. Use Value: Quad-phase capability delivers 10 A for vision processing cores; FSOB pin enables fail-safe shutdown when thermal or watchdog faults occur - meeting ISO 26262 requirements. |
| Industrial Vehicle Telematics Gateway | Secure Automotive Communication Module |
|
Use Scenario: Powering i.MX8QM, cellular modem (LTE/5G), GNSS receiver, and secure element in a fleet management gateway. IC Role / Device Role / Timing Role: Centralized power manager handling wide-input (9–16 V automotive) conversion via external pre-regulator feeding VIN, plus coin-cell-backed RTC for time-stamped event logging. Use Value: LICELL input and programmable coin cell charger maintain accurate timekeeping during battery disconnect; I²C CRC prevents unauthorized register writes to safety-critical functions. |
Use Scenario: Enabling secure boot and cryptographic acceleration in a hardware-secured module using i.MX8QM's CAAM engine. IC Role / Device Role / Timing Role: Safety-aware PMIC supplying isolated power domains for secure/non-secure worlds, with separate LDOs for CAAM analog references and VSNVS for tamper-detection timestamping. Use Value: ABIST and OTP-locked safety registers prevent fault injection attacks; FSOB assertion halts secure operations upon detected voltage/thermal anomalies - preserving cryptographic key integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DBESR2 | Configured for i.MX8QM LPDDR4 memory PMIC2; lacks DDR4-specific VTT calibration and timing margins. | Targeted at LPDDR4-based systems; not validated for DDR4 VDDQ/VTT stability under high-speed toggle conditions. | Select MC33PF8200DHESR2 when powering DDR4 memory subsystems requiring precise VTT tracking and higher voltage accuracy. |
| MC33PF8200ETESR2 | Configured for i.MX8QM DDR4 memory PMIC1; different OTP mapping for rail assignment and sequencing priority. | Optimized for primary DDR4 power domain (VDD, VDDQ); does not include secondary PMIC2-specific monitoring for auxiliary memory rails. | Choose MC33PF8200DHESR2 for secondary DDR4 PMIC roles where independent fault reporting and dedicated VTT control are required. |
Compared with MC33PF8200DBESR2 and MC33PF8200ETESR2, MC33PF8200DHESR2 provides DDR4-specific OTP calibration, enhanced VTT termination accuracy, and dedicated monitoring for secondary memory power domains - making it the only validated option for i.MX8QM DDR4 PMIC2 implementations.
Availability
MC33PF8200DHESR2 is available at Aetrix Electronics and suitable for automotive infotainment, ADAS domain controllers, and industrial telematics gateways requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant sourcing.
Supply support for MC33PF8200DHESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based application processors and functional-safety power management.
The PF8200 product line was developed specifically to deliver ASIL B-compliant, OTP-configurable power solutions for NXP's i.MX 8 and S32x processor families - enabling robust, scalable, and safety-certifiable power architectures in automotive electronics.
FAQ
What is the primary application target for MC33PF8200DHESR2?
MC33PF8200DHESR2 is specifically configured for i.MX8QM DDR4 memory PMIC2 applications. It delivers tightly regulated VDDQ and VTT rails with ASIL B monitoring, OTP-programmed sequencing, and quad-phase capability - ensuring stable operation in automotive infotainment and ADAS systems where DDR4 timing margins are critical.
Does MC33PF8200DHESR2 support dynamic voltage scaling (DVS)?
Yes, MC33PF8200DHESR2 supports DVS on SW1–SW6 via high-speed I²C (up to 3.4 MHz). This allows real-time adjustment of output voltages during processor frequency scaling, optimizing power efficiency in i.MX8QM-based systems without requiring hardware changes or OTP reprogramming.
How does the FSOB pin function in MC33PF8200DHESR2?
The FSOB pin in MC33PF8200DHESR2 is an open-drain failsafe output that asserts LOW during critical faults - including thermal shutdown, input overvoltage, watchdog timeout, or ABIST failure. It directly interfaces with system-level safety controllers to initiate fail-safe states per ISO 26262 requirements.
What is the role of the LICELL input on MC33PF8200DHESR2?
The LICELL input on MC33PF8200DHESR2 accepts a coin cell (up to 4.2 V) to back up the VSNVS rail (1.8/3.0/3.3 V, 10 mA). It enables continuous RTC operation and SRAM retention during main power loss - with programmable charge current and voltage for battery longevity in automotive storage conditions.
Is MC33PF8200DHESR2 pin-compatible with other PF8200 variants?
Yes, MC33PF8200DHESR2 shares the identical HVQFN56 package, pinout, and electrical interface with all PF8200 family members. Differences are limited to OTP configuration, safety feature enablement (e.g., ABIST, secure I²C), and pre-programmed rail assignments - no PCB redesign is needed when migrating between PF8200 variants.
MC33PF8200DHESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200DHESR2 FAQ
1.How can I place an order for MC33PF8200DHESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200DHESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200DHESR2 reliable?
The price and inventory of MC33PF8200DHESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200DHESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF8200DHESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200DHESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200DHESR2?
MC33PF8200DHESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200DHESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200DHESR2?
For technical support, including MC33PF8200DHESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200DHESR2 requirements.
6.How does Aetrix verify that MC33PF8200DHESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF8200DHESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200DHESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF8200DHESR2?
All MC33PF8200DHESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200DHESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200DHESR2 part is unused and in its original packaging.
Return procedure for MC33PF8200DHESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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