My Inquiry
My Account
NXP Semiconductors MC33PF8200DMESR2
- Part No.:
- MC33PF8200DMESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200DMESR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX8 PRE-PR
- Quantity:
- Payment:
- Shipping:
Inventory:2,699
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC33PF8200DMESR2 from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for S32V344 vision processors in ADAS applications. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B safety monitoring. It supports quad-phase VDD configuration up to 10 A and operates from 2.7 V to 5.5 V input.
For engineers reviewing the MC33PF8200DMESR2 datasheet, MC33PF8200DMESR2 pinout, MC33PF8200DMESR2 application, or MC33PF8200DMESR2 equivalent, this page delivers verified regulator accuracy (±2 % for bucks, ±3 % for LDOs), I²C interface speed (3.4 MHz), thermal shutdown threshold (150 °C), safety features (ABIST, FSOB fail-safe output), and HVQFN56 package compatibility - all critical for automotive power tree validation and functional safety compliance.
Technical Context
The MC33PF8200DMESR2 implements a dual-domain state machine with dedicated fault-handling logic for ASIL B systems: one path manages power-up sequencing and dynamic voltage scaling (DVS) across SW1–SW6, while the second executes ABIST self-tests, CRC-protected register validation, and fail-safe transitions via FSOB assertion. Its OTP memory stores startup configurations including regulator voltages, sequencing order, and safety thresholds - eliminating external resistors and reducing BOM count.
It supports flexible multi-phase configurations: SW1/SW2/SW3 can operate as triple-phase (7.5 A), SW1–SW4 as quad-phase (10 A), and SW6 provides VTT termination. All bucks feature programmable current limit, spread-spectrum modulation, and manual frequency tuning. The 24-channel analog multiplexer enables real-time system diagnostics across voltage rails, temperature sensors, and external signals.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 7 buck converters + 4 LDOs + VSNVS RTC/coin-cell supply - powers full i.MX/S32x SoC subsystems including CPU, GPU, DDR, I/O, and peripherals. |
| Buck Output Range | SW1–SW6: 0.4 V–1.8 V (6.25 mV steps); SW7: 1.0 V–4.1 V - covers core, memory, and interface rail requirements with fine-grained digital control. |
| Output Accuracy | ±2 % for bucks; ±3 % for LDOs - ensures stable operation of sensitive processor cores and LPDDR4 interfaces under load and temperature variation. |
| I²C Interface Speed | Up to 3.4 MHz - enables rapid runtime reconfiguration of DVS states and safety-critical parameter updates without interrupting system operation. |
| Safety Certification | ASIL B compliant monitoring circuit - includes independent voltage monitors, thermal shutdown (150 °C), watchdog timeout, ABIST, and FSOB fail-safe output. |
| Input Voltage Range | VIN: 2.7 V–5.5 V - compatible with automotive 3.3 V/5 V supplies and battery-backed operation during cold crank conditions. |
| Package | HVQFN56 (8 mm × 8 mm × 0.85 mm, 0.5 mm pitch, wettable flanks) - optimized for thermal dissipation (RθJB = 11 °C/W) in compact ADAS modules. |
Pinout & Package
HVQFN56 thermally enhanced plastic package with 56 terminals, 0.5 mm pitch, exposed EPAD for thermal and electrical grounding. Wettable flanks support automated optical inspection (AOI) in automotive manufacturing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable precise closed-loop regulation; each connects to respective output via resistor divider for programmable voltage setting. |
| SW1IN–SW7IN | Buck input supplies | Accept 2.7–5.5 V input; SW1–SW6 share VIN or use dedicated sources; SW7 supports higher-voltage auxiliary rails. |
| SW1LX–SW7LX | Buck switching nodes | Connect to external inductors; require low-ESR ceramic capacitors and careful layout to minimize EMI and losses. |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Deliver 1.5–5.0 V at 400 mA each; support load switch mode for controlled peripheral power gating. |
| VSNVS | RTC supply output | Provides 1.8 V / 3.0 V / 3.3 V at 10 mA from VIN or coin cell (LICELL) - maintains real-time clock during main power loss. |
| FSOB | Fail-safe output | Open-drain signal asserted LOW on critical faults (thermal, UV/OV, ABIST failure) - triggers system-level safe state entry. |
| SCL/SDA | I²C interface | Supports 3.4 MHz Fast Mode Plus; requires pull-ups to VDDIO (1.6–3.3 V); enables runtime configuration and telemetry readback. |
| EPAD | Exposed thermal pad | Must be soldered to solid ground plane; primary thermal path (RθJC = 0.6 °C/W) and low-impedance reference for analog circuits. |
Key Features
| Feature | Design Value |
|---|---|
| One-Time Programmable (OTP) memory | Stores boot-time voltage, sequencing, safety thresholds, and DVS tables - eliminates external configuration components and ensures repeatable startup. |
| Quad-phase VDD capability (SW1–SW4) | Delivers up to 10 A at sub-1.8 V with interleaved switching - reduces ripple, improves transient response, and lowers per-phase current stress for S32V344 core supply. |
| ASIL B functional safety architecture | Includes ABIST, CRC-protected registers, independent voltage/thermal monitors, and FSOB-driven fail-safe state - meets ISO 26262 requirements without external safety MCU. |
| VTT termination on SW6 | Configurable as DDR VTT supply (0.4 V–1.8 V) with current sink/source capability - supports LPDDR4 and DDR4 memory termination without discrete components. |
| 24-channel analog multiplexer (AMUX) | Enables real-time monitoring of internal rails, die temperature, external sensors, and diagnostic signals - supports predictive maintenance and field failure analysis. |
Applications
| Automotive ADAS Camera Module | S32V344-Based Vision Processing Unit |
|---|---|
Use Scenario: Front-facing stereo camera processing raw image data for object detection and lane departure warning. IC Role / Device Role / Timing Role: Primary PMIC supplying S32V344 CPU cores (SW1–SW3 quad-phase), ISP (SW4), DDR4 memory (SW6 VTT + SW5), and I/O (LDOs). Use Value: Enables deterministic power-up sequencing, real-time DVS for workload-adaptive core voltage scaling, and ASIL B-compliant fault containment via FSOB. |
Use Scenario: Embedded vision ECU performing sensor fusion and deep learning inference in autonomous driving stacks. IC Role / Device Role / Timing Role: Central power controller managing 12 regulated rails across S32V344, LPDDR4, MIPI CSI-2 interfaces, and CAN FD transceivers. Use Value: Reduces external component count by 12+ resistors/caps; OTP-configured startup cuts firmware initialization time; AMUX enables in-field thermal profiling. |
| Automotive Infotainment Head Unit | Industrial Machine Vision Controller |
Use Scenario: High-resolution display and voice assistant platform using i.MX8QM with dual-display output and audio DSP. IC Role / Device Role / Timing Role: Secondary PMIC (PMIC2) powering GPU, display PHY, and audio codecs - coordinated with primary PMIC via SYNCIN/SYNCOUT. Use Value: Synchronized switching reduces system-level EMI; I²C-controlled soft-start prevents inrush current during display wake-up events. |
Use Scenario: Factory-floor vision inspection system requiring long-term reliability and field-upgradable power profiles. IC Role / Device Role / Timing Role: Power manager for S32V344-based edge AI inference engine operating in extended temperature (-40 °C to 105 °C). Use Value: ASIL B monitoring ensures safe shutdown during thermal runaway; coin-cell backup (LICELL) preserves calibration data during power interruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DHES | Targeted for i.MX8QM DDR4 PMIC2; identical ASIL B safety features and HVQFN56 package but different OTP configuration and default sequencing. | Optimized for dual-SoC i.MX8QM systems where MC33PF8200DMESR2 serves S32V344 and DHES serves memory subsystem. | Select DHES only when deploying i.MX8QM alongside S32V344 and requiring synchronized DDR4 power delivery. |
| MC33PF8100CHES | Automotive PF8100 variant for i.MX8QM DDR4 PMIC2; lacks ABIST, FSOB, and fail-safe state machine - rated QM, not ASIL B. | Applicable in non-safety-critical infotainment domains where functional safety certification is not required. | Choose CHES only for cost-sensitive QM applications; MC33PF8200DMESR2 is mandatory for ASIL B ADAS vision systems. |
Compared with MC33PF8200DHES and MC33PF8100CHES, the MC33PF8200DMESR2 uniquely combines quad-phase VDD support for S32V344 with full ASIL B safety architecture - making it the sole option for production ADAS camera modules requiring ISO 26262 compliance and 10 A core rail delivery.
Availability
MC33PF8200DMESR2 is available at Aetrix Electronics and suitable for automotive ADAS camera modules, S32V344-based vision ECUs, and industrial machine vision controllers requiring stable component supply, long-term lifecycle support, and AEC-Q100 Grade 2 qualification.
Supply support for MC33PF8200DMESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in automotive processors and power management.
The PF8200 product line was engineered specifically for NXP's S32x automotive processors, delivering integrated, safety-certified power delivery with minimal external components - targeting ADAS, domain controllers, and zonal architectures.
FAQ
What is the primary target processor for the MC33PF8200DMESR2?
The MC33PF8200DMESR2 is specifically configured for the NXP S32V344 vision processor in automotive ADAS applications. Its OTP programming enables quad-phase VDD delivery and safety-critical monitoring tailored to the S32V344's power architecture, distinguishing it from variants intended for i.MX8 or LS series processors.
Does the MC33PF8200DMESR2 support dynamic voltage scaling (DVS)?
Yes, the MC33PF8200DMESR2 supports DVS on SW1 through SW6 via its high-speed I²C interface (up to 3.4 MHz). This allows real-time adjustment of output voltages based on S32V344 workload demands - for example, lowering core voltage during idle states to reduce power consumption while maintaining ASIL B monitoring integrity throughout.
How does the fail-safe output (FSOB) function in the MC33PF8200DMESR2?
The FSOB pin on the MC33PF8200DMESR2 is an open-drain output that asserts LOW during critical failures - including thermal shutdown (>150 °C), ABIST self-test failure, voltage monitor faults, or watchdog timeout. It directly interfaces with system-level safety controllers to initiate fail-safe state transitions without software intervention.
What is the role of the 24-channel analog multiplexer (AMUX) in the MC33PF8200DMESR2?
The AMUX in the MC33PF8200DMESR2 routes up to 24 internal and external analog signals - including die temperature, regulator outputs, and external sensor inputs - to a shared ADC. This enables comprehensive system health monitoring, field diagnostics, and predictive maintenance without adding external mux ICs or routing complexity.
Is the MC33PF8200DMESR2 pin-compatible with other PF8200 variants like MC33PF8200DHES?
Yes, all PF8200 variants including MC33PF8200DMESR2 and MC33PF8200DHES share identical HVQFN56 pinout, electrical characteristics, and package dimensions. Differences reside solely in OTP configuration, safety feature enablement, and default startup sequences - allowing PCB reuse across S32V344 and i.MX8QM platforms.
MC33PF8200DMESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200DMESR2 FAQ
1.How can I place an order for MC33PF8200DMESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200DMESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200DMESR2 reliable?
The price and inventory of MC33PF8200DMESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200DMESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF8200DMESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200DMESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200DMESR2?
MC33PF8200DMESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200DMESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200DMESR2?
For technical support, including MC33PF8200DMESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200DMESR2 requirements.
6.How does Aetrix verify that MC33PF8200DMESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF8200DMESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200DMESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF8200DMESR2?
All MC33PF8200DMESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200DMESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200DMESR2 part is unused and in its original packaging.
Return procedure for MC33PF8200DMESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC33PF8200DMESR2 Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
