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NXP Semiconductors MC33PF8200DNES
- Part No.:
- MC33PF8200DNES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200DNES.pdf
- Description:
- POWER MANAGEMENT IC I.MX8 PRE-PR
- Quantity:
- Payment:
- Shipping:
Inventory:4,646
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Product details
Overview
MC33PF8200DNES from NXP Semiconductors is an automotive-grade power management IC (PMIC) designed for S32R45 radar processors in ASIL B safety-critical systems. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and 24-channel analog multiplexer. It delivers quad-phase VDD regulation up to 10 A and supports dynamic voltage scaling for radar SoC core and memory rails.
For engineers reviewing the MC33PF8200DNES datasheet, MC33PF8200DNES pinout, MC33PF8200DNES application, or MC33PF8200DNES equivalent, this page provides verified technical context, validated pin functions, confirmed ASIL B safety features, exact OTP-programmed configuration for S32R45 quad-phase VDD, and real-world automotive radar power tree implementation details.
Technical Context
The MC33PF8200DNES implements a hierarchical state machine with fail-safe transition logic, including independent voltage/thermal monitoring, ABIST self-test, and FSOB-driven system lockdown on critical faults. Its OTP memory stores startup sequence, regulator voltages, and safety configuration - eliminating external resistors and enabling deterministic boot.
It supports I²C at 3.4 MHz for runtime reconfiguration of SWx/LDOx outputs, dynamic voltage scaling across six buck channels, and configurable multi-phase operation (dual/triple/quad-phase) for VDD rail current sharing. The device uses dedicated analog/digital ground planes (AGND/DGND), wettable-flank HVQFN56 packaging, and integrated spread-spectrum switching to reduce EMI in radar front-end environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 7 buck converters + 4 LDOs + VSNVS RTC supply + coin cell charger |
| Buck Output Range | SW1–SW6: 0.4 V–1.8 V (6.25 mV step); SW7: 1.0 V–4.1 V |
| Current Rating | 2.5 A per buck channel; 400 mA per LDO; 10 mA VSNVS |
| Safety Certification | ASIL B compliant monitoring circuit with programmable fault protection and ABIST |
| I²C Interface | High-speed mode up to 3.4 MHz for runtime voltage/frequency tuning |
| Package | HVQFN56, 8 mm × 8 mm × 0.85 mm, 0.5 mm pitch, wettable flanks |
| Operating Temp | −40 °C to +105 °C ambient; junction max 150 °C |
Pinout & Package
HVQFN56 package with thermally enhanced exposed pad (EPAD), 0.5 mm pitch, 8 mm × 8 mm body, and wettable flanks for automated optical inspection (AOI) in automotive PCB assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable precise closed-loop regulation of each buck output voltage |
| SW1IN–SW7IN | Buck input supplies | Accept 2.7 V–5.5 V input; support independent or shared VIN domains |
| SW1LX–SW7LX | Buck switching nodes | Connect to external low-ESR ceramic output capacitors and shielded inductors |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Deliver 1.5 V–5.0 V at 400 mA with optional load switch control |
| VSNVS | RTC supply output | Provides 1.8 V / 3.0 V / 3.3 V at 10 mA with battery backup via LICELL |
| SCL/SDA | I²C interface | Support 3.4 MHz high-speed mode for fast register access and DVS updates |
| FSOB | Failsafe output | Open-drain signal asserting system-level safe state during critical faults |
| INTB/PGOOD | Interrupt & power-good | Enable processor coordination of power sequencing and fault response |
Key Features
| Feature | Design Value |
|---|---|
| Quad-phase VDD regulation | SW1–SW4 configured as single 10 A rail for S32R45 processor core supply |
| OTP-configured startup | Eliminates 12+ external resistors; ensures repeatable, validated boot sequence |
| ASIL B functional safety | Independent voltage monitors, thermal shutdown, ABIST, and FSOB-driven fail-safe state |
| 24-channel analog mux | Enables system-level diagnostics by routing internal rail/temperature signals to ADC |
| Spread-spectrum switching | Reduces peak EMI amplitude in 77 GHz radar band without compromising efficiency |
Applications
| Radar Processor Power | Automotive ADAS Domain Controller |
|---|---|
Use Scenario: Powers S32R45 radar SoC in 77 GHz automotive radar modules requiring quad-phase VDD delivery and strict ASIL B compliance. IC Role / Device Role / Timing Role: Primary PMIC managing core, memory, I/O, and RTC rails with synchronized startup and fault containment. Use Value: Enables deterministic 10 A VDD rail with <2% output accuracy, reducing need for external margining and simplifying thermal design. | Use Scenario: Integrated into central ADAS domain controllers combining radar, camera, and sensor fusion processing. IC Role / Device Role / Timing Role: Centralized power hub supplying i.MX 8 and S32R devices while coordinating PGOOD sequencing across subsystems. Use Value: Single-chip solution replaces 3–4 discrete regulators, cutting BOM count and PCB area by >40% versus discrete PMIC alternatives. |
| Functional Safety Gateway | Radar ECU with Battery Backup |
Use Scenario: Used in safety-critical gateway ECUs where fail-safe behavior must be guaranteed under voltage/thermal faults. IC Role / Device Role / Timing Role: Monitors all rails and asserts FSOB to trigger MCU-initiated safe shutdown within <100 µs of fault detection. Use Value: Meets ISO 26262 ASIL B requirements without external safety monitor ICs, lowering system complexity. | Use Scenario: Powers radar ECU with persistent RTC and memory retention during vehicle ignition-off periods. IC Role / Device Role / Timing Role: Provides VSNVS 1.8 V/3.0 V/3.3 V output and programmable coin cell charging (up to 4.2 V). Use Value: Maintains clock/calendar and SRAM state for >10 years using CR2032 battery, eliminating supercapacitor aging concerns. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DHES | Configured for i.MX8QM DDR4 PMIC2; lacks quad-phase VDD tuning for S32R45 | Targets multimedia SoCs, not radar processors; no S32R45 OTP mapping | Select only if migrating from i.MX8QM DDR4 designs; requires full revalidation for radar use |
| MC33PF8200EMES | Triple-phase VDD configuration for LS1043; missing SW4 phase and associated OTP settings | Optimized for networking SoCs; does not support S32R45 quad-phase timing or safety flags | Not suitable for S32R45 radar; insufficient phase count and safety feature enablement |
Compared with MC33PF8200DHES and MC33PF8200EMES, the MC33PF8200DNES uniquely provides factory-programmed quad-phase VDD configuration, S32R45-specific OTP safety registers, and validated startup sequence - making it the only drop-in solution for new 77 GHz radar ECU designs.
Availability
MC33PF8200DNES is available at Aetrix Electronics and suitable for automotive radar modules, ADAS domain controllers, and functional safety gateways requiring stable component supply, long-term lifecycle support, and ASIL B-compliant power architecture.
Supply support for MC33PF8200DNES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in radar, vision, and safety-critical processing.
The PF8200 product line delivers highly integrated, OTP-configurable PMICs for NXP's S32x and i.MX 8 application processors - engineered to simplify power architecture, accelerate time-to-certification for ASIL B systems, and reduce total system cost in high-performance automotive electronics.
FAQ
What is the primary target processor for the MC33PF8200DNES?
The MC33PF8200DNES is specifically configured for the NXP S32R45 radar processor, supporting its quad-phase VDD rail requirement. Its OTP memory contains S32R45-specific startup sequences, voltage setpoints, and safety flag configurations - distinct from PF8200 variants targeting i.MX8 or LS1043 platforms. This makes MC33PF8200DNES the only PF8200 variant qualified for 77 GHz radar ECU deployment.
Does the MC33PF8200DNES support ASIL B functional safety out of the box?
Yes, the MC33PF8200DNES implements ASIL B-compliant monitoring circuits per ISO 26262, including independent voltage/thermal fault detection, ABIST self-test, programmable watchdog timeout, and failsafe output (FSOB) assertion. Its OTP memory is pre-programmed with ASIL B safety parameters for S32R45, eliminating need for external safety monitors or custom firmware validation.
Can the MC33PF8200DNES be used with processors other than S32R45?
The MC33PF8200DNES hardware is compatible with other i.MX 8 and S32x processors, but its OTP configuration is locked to S32R45 quad-phase VDD operation. Using it with non-S32R45 SoCs requires disabling OTP and reprogramming via I²C - which voids ASIL B certification and invalidates factory-validated startup sequences. For non-radar applications, MC33PF8200DEES or MC33PF8200DFES are recommended.
What is the role of the FSOB pin on the MC33PF8200DNES?
The FSOB (Fail-Safe Output) pin on the MC33PF8200DNES is an open-drain output that asserts LOW during critical faults - including overvoltage, undervoltage, thermal shutdown, or ABIST failure - to trigger immediate system-level safe state activation. Unlike generic PGOOD, FSOB is tied directly to the ASIL B safety state machine and cannot be disabled via I²C, ensuring hardware-enforced fail-safe behavior in the MC33PF8200DNES.
How does the MC33PF8200DNES handle power sequencing for radar SoC boot?
The MC33PF8200DNES executes a deterministic, OTP-defined power-up sequence: V1P5D/V1P5A power first, then VSNVS, followed by SW1–SW4 (quad-phase VDD), SW5–SW7, and LDOs - all with programmable soft-start delays. This sequence is hardened in OTP and immune to I²C corruption, guaranteeing repeatable S32R45 boot timing across temperature and voltage corners without external sequencing ICs.
MC33PF8200DNES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200DNES FAQ
1.How can I place an order for MC33PF8200DNES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200DNES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200DNES reliable?
The price and inventory of MC33PF8200DNES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200DNES is usually 5 days.
3.What payment methods are accepted for MC33PF8200DNES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200DNES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200DNES?
MC33PF8200DNES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200DNES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200DNES?
For technical support, including MC33PF8200DNES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200DNES requirements.
6.How does Aetrix verify that MC33PF8200DNES is sourced from the original manufacturer or authorized distributors?
All MC33PF8200DNES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200DNES meets industry standards.
7.What is the process for return or replacement of MC33PF8200DNES?
All MC33PF8200DNES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200DNES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200DNES part is unused and in its original packaging.
Return procedure for MC33PF8200DNES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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