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NXP Semiconductors MC33PF8200DNESR2
- Part No.:
- MC33PF8200DNESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200DNESR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX8 PRE-PR
- Quantity:
- Payment:
- Shipping:
Inventory:4,610
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Product details
Overview
MC33PF8200DNESR2 from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for S32R45 radar processors in ASIL B–compliant systems. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and safety monitoring circuitry. It supports quad-phase VDD configuration up to 10 A and operates from 2.7 V to 5.5 V input.
For engineers reviewing the MC33PF8200DNESR2 datasheet, MC33PF8200DNESR2 pinout, MC33PF8200DNESR2 application, or MC33PF8200DNESR2 equivalent, key selection criteria include ASIL B functional safety compliance, I²C programmability at 3.4 MHz, OTP-configurable startup sequencing, quad-phase VDD capability for S32R45, and thermal shutdown protection up to 150 °C junction temperature.
Technical Context
The MC33PF8200DNESR2 implements a deterministic state machine with fail-safe transitions, ABIST-enabled analog self-test, and independent voltage/thermal monitoring per regulator channel. Its safety architecture includes programmable fault counters, FSOB fail-safe output, CRC-protected register writes, and OTP-bypassable safety features.
It supports dynamic voltage scaling on six buck channels (SW1–SW6), configurable multi-phase operation (dual/triple/quad), VTT termination on SW6, and spread-spectrum switching. The 24-channel analog multiplexer enables system-level diagnostics across voltage, temperature, and current rails.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 7 buck + 4 LDO + VSNVS RTC supply = 12 regulated outputs |
| Buck Output Range | SW1–SW6: 0.4 V–1.8 V (6.25 mV step); SW7: 1.0 V–4.1 V |
| Max Output Current | 2.5 A per buck; 400 mA per LDO; 10 mA VSNVS |
| I²C Interface Speed | Up to 3.4 MHz - enables fast runtime reconfiguration during processor DVFS transitions |
| Safety Certification | ASIL B compliant monitoring circuit - supports automotive radar domain safety requirements |
| Operating Temperature | −40 °C to +105 °C ambient - qualified for under-hood automotive environments |
| Package | HVQFN56 (8 mm × 8 mm × 0.85 mm, 0.5 mm pitch) with wettable flanks for solder inspection |
Pinout & Package
HVQFN56 thermally enhanced package with 56 terminals, exposed EPAD for thermal dissipation, and wettable flanks for automated optical inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable precise closed-loop regulation of each buck output voltage |
| SW1IN–SW7IN | Buck input supplies | Accept 2.7–5.5 V input; support independent or shared VIN routing |
| SW1LX–SW7LX | Buck switching nodes | Connect to external low-loss inductors and synchronous rectifiers |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Provide low-noise, load-switchable 1.5–5.0 V supplies for peripherals |
| VSNVS | RTC supply output | Delivers 1.8/3.0/3.3 V @ 10 mA from system rail or coin cell backup |
| SCL / SDA | I²C interface | 3.4 MHz high-speed bus for runtime configuration and telemetry readback |
| FSOB | Fail-safe output | Open-drain signal asserting safe state during critical faults per ASIL B logic |
| INTB / PGOOD | System status outputs | Indicate global power-good status and interrupt MCU on regulator faults |
Key Features
| Feature | Design Value |
|---|---|
| Quad-phase VDD configuration | SW1–SW4 combined as single 10 A rail for S32R45 core supply with synchronized switching |
| OTP memory | One-time programmable configuration stores boot voltage, sequencing order, and safety thresholds - eliminates external resistor networks |
| ABIST-enabled monitoring | Analog built-in self-test validates all voltage monitors and toggling signals before startup - required for ASIL B diagnostic coverage |
| VTT termination mode | SW6 configurable as DDR VTT terminator with programmable current sink/source - supports LPDDR4 memory interfaces |
| Thermal protection | Independent die temperature monitoring with shutdown at 150 °C - prevents thermal runaway in radar ECU enclosures |
| Watchdog integration | Programmable internal counter + external WDI input - enables MCU-initiated reset or autonomous fault recovery |
Applications
| Radar Processing Unit (S32R45) | Automotive ADAS Domain Controller |
|---|---|
Use Scenario: Powers S32R45 radar SoC in 77 GHz front-end modules requiring quad-phase VDD, low-noise analog supplies, and ASIL B–compliant safety monitoring. IC Role / Device Role / Timing Role: Primary PMIC delivering core VDD (10 A), memory I/O (1.8 V), analog subsystem (1.6 V), and RTC backup (VSNVS). Use Value: Enables deterministic startup sequence, real-time voltage margining via I²C, and fail-safe shutdown during radar sensor overtemperature events. |
Use Scenario: Supplies multiple processing clusters (radar, vision, fusion) and high-speed interfaces (MIPI, Ethernet) in centralized ADAS ECUs. IC Role / Device Role / Timing Role: Centralized power hub managing 12 independent rails with coordinated sequencing and cross-rail fault propagation. Use Value: Reduces BOM count by consolidating discrete regulators; supports dynamic power states (standby, LP_Off, QPU_Off) to meet ISO 26262 sleep-mode requirements. |
| Automotive Infotainment Head Unit | Industrial Radar Sensor Module |
Use Scenario: Powers i.MX8QM-based infotainment systems with GPU, display, and audio subsystems requiring clean, sequenced supplies. IC Role / Device Role / Timing Role: Secondary PMIC handling peripheral rails (SDCARD, eMMC, USB PHY) while interfacing with primary PF8x00 for CPU core. Use Value: Leverages I²C slave addressing and OTP-programmed timing to avoid conflicts with main PMIC; supports hot-plug detection via LDO load switches. |
Use Scenario: Used in ruggedized industrial radar sensors operating in extended temperature (-40 °C to +105 °C) and high-vibration environments. IC Role / Device Role / Timing Role: Single-chip power solution for FPGA-based radar signal processors and RF front-end biasing. Use Value: HVQFN56 wettable flanks ensure solder joint reliability; thermal monitoring and ABIST reduce field failure rates in unattended deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DHES | Configured for i.MX8QM DDR4 PMIC2; lacks quad-phase VDD tuning for S32R45 | Targeted at multimedia SoCs, not radar-specific; no S32R45 OTP firmware image | Select only if migrating from i.MX8QM designs - requires full revalidation of safety-critical sequences |
| MC33PF8100ERES | PF8100 variant; no ASIL B monitoring, no FSOB, no ABIST, no fail-safe state machine | Qualified for QM (Quality Management) only - unsuitable for radar safety domains | Use only in non-safety-critical industrial or consumer applications where cost is prioritized over functional safety |
Compared with MC33PF8200DHES and MC33PF8100ERES, the MC33PF8200DNESR2 uniquely delivers quad-phase VDD configuration for S32R45, ASIL B–certified monitoring, and fail-safe transition logic - making it the only drop-in option for automotive radar ECUs requiring ISO 26262 compliance.
Availability
MC33PF8200DNESR2 is available at Aetrix Electronics and suitable for automotive radar systems, ADAS domain controllers, and industrial sensor modules requiring stable component supply, long-term lifecycle support, and ASIL B–qualified power management.
Supply support for MC33PF8200DNESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in radar, vision, and edge AI processing.
The PF8200 product line was engineered specifically for high-performance automotive processors including S32R45 and i.MX8 series, emphasizing functional safety, multi-phase scalability, and seamless integration with NXP's radar SDK and safety libraries.
FAQ
What is the safety qualification level of the MC33PF8200DNESR2?
The MC33PF8200DNESR2 is designed to meet ASIL B functional safety requirements per ISO 26262. It includes independent voltage/thermal monitoring, ABIST, FSOB fail-safe output, CRC-protected registers, and a deterministic state machine with fail-safe transitions - all verified in the MC33PF8200DNESR2 OTP configuration for S32R45 radar use cases.
Does the MC33PF8200DNESR2 support quad-phase operation for S32R45 VDD?
Yes, the MC33PF8200DNESR2 supports quad-phase VDD configuration using SW1–SW4, delivering up to 10 A for the S32R45 core supply. This capability is enabled by OTP programming and confirmed in the MC33PF8200DNESR2 datasheet revision 7.0, section 12.1, under "Buck regulators".
What package type and thermal characteristics does the MC33PF8200DNESR2 use?
The MC33PF8200DNESR2 uses the HVQFN56 package (8 mm × 8 mm × 0.85 mm, 0.5 mm pitch) with wettable flanks. Its thermal resistance is RθJA = 27 °C/W on a 4-layer board, and RθJC = 0.6 °C/W to the case bottom - enabling reliable operation up to 105 °C ambient in radar ECU enclosures.
Can the MC33PF8200DNESR2 be used with non-NXP processors?
While optimized for NXP S32R45 and i.MX8 processors, the MC33PF8200DNESR2 can power other high-performance SoCs. Its 7 buck + 4 LDO architecture, 0.4–4.1 V output ranges, and 3.4 MHz I²C interface provide flexibility - but OTP configuration, safety features, and sequencing must be validated independently for non-NXP platforms.
What is the role of the FSOB pin on the MC33PF8200DNESR2?
The FSOB (Fail-Safe Output) pin on the MC33PF8200DNESR2 is an open-drain output that asserts LOW during critical faults (e.g., thermal shutdown, voltage monitor failure, ABIST error). It directly interfaces with system-level safety controllers to initiate fail-safe actions - a mandatory feature for ASIL B compliance in the MC33PF8200DNESR2 configuration.
MC33PF8200DNESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200DNESR2 FAQ
1.How can I place an order for MC33PF8200DNESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200DNESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200DNESR2 reliable?
The price and inventory of MC33PF8200DNESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200DNESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF8200DNESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200DNESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200DNESR2?
MC33PF8200DNESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200DNESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200DNESR2?
For technical support, including MC33PF8200DNESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200DNESR2 requirements.
6.How does Aetrix verify that MC33PF8200DNESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF8200DNESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200DNESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF8200DNESR2?
All MC33PF8200DNESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200DNESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200DNESR2 part is unused and in its original packaging.
Return procedure for MC33PF8200DNESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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