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NXP Semiconductors MC33PF8200EMES
- Part No.:
- MC33PF8200EMES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200EMES.pdf
- Description:
- POWER MANAGEMENT IC I.MX8 PRE-PR
- Quantity:
- Payment:
- Shipping:
Inventory:1,760
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Product details
Overview
MC33PF8200EMES from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for LS1043-based systems requiring triple-phase VDD regulation. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B safety monitoring. It delivers precise voltage regulation for processor cores, memory interfaces, and peripherals in automotive infotainment and ADAS edge controllers.
For engineers reviewing the MC33PF8200EMES datasheet, MC33PF8200EMES pinout, MC33PF8200EMES application, or MC33PF8200EMES equivalent, key selection considerations include its ASIL B compliance, OTP-configurable startup sequence, 3.4 MHz I²C interface, triple-phase VDD capability for LS1043, and thermal shutdown protection up to 150 °C junction temperature.
Technical Context
The MC33PF8200EMES implements a deterministic state machine with fail-safe transitions, including critical fault detection (thermal, UV/OV, register CRC failure), programmable watchdog timeout, and FSOB-driven system-level safety assertion. Its architecture supports dynamic voltage scaling on six buck channels and configurable multi-phase operation-SW1/SW2/SW3 can be combined as a triple-phase regulator delivering up to 7.5 A for high-current VDD rails.
It features 24-channel analog multiplexing for real-time system diagnostics, ABIST-enabled functional safety self-test, and OTP-programmed configuration that eliminates external resistor networks for voltage setpoints and sequencing. The device operates across −40 °C to +105 °C ambient and supports forced-air cooling with RθJA as low as 22 °C/W on 4-layer PCBs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 7 buck converters + 4 LDOs + VSNVS RTC supply - enables full power tree for LS1043 SoC including core, memory, I/O, and always-on domains |
| Buck Output Range | SW1–SW6: 0.4 V to 1.8 V (6.25 mV step); SW7: 1.0 V to 4.1 V - supports DDR termination, GPU/CPU DVFS, and auxiliary rail flexibility |
| Current Rating | 2.5 A per buck channel; 400 mA per LDO - sufficient for LS1043 triple-phase VDD implementation and peripheral biasing |
| I²C Interface | Up to 3.4 MHz - enables fast post-boot reconfiguration of voltage levels, sequencing, and safety thresholds without interrupting operation |
| Safety Certification | Automotive ASIL B compliant with independent voltage/thermal monitoring, ABIST, FSOB fail-safe output, and OTP-locked safety registers |
| Operating Temp | −40 °C to +105 °C ambient - qualified for under-hood and dashboard-mounted automotive control units |
| Package | HVQFN56 (8 mm × 8 mm × 0.9 mm, 0.5 mm pitch, dimple wettable flank) - supports automated optical inspection and high-reliability solder joint formation |
Pinout & Package
HVQFN56 thermally enhanced package with 56 terminals, 0.5 mm pitch, 8 mm × 8 mm body, and 0.9 mm height featuring dimple wettable flanks for solder joint inspection and improved thermal dissipation via EPAD grounding.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (Pin 50) | Main input supply | Accepts 2.7 V–5.5 V input; powers internal LDOs and buck controller circuitry; requires local bulk capacitance |
| SW1IN–SW7IN (Pins 4, 7, 8, 11, 32, 35, 37) | Buck input supplies | Each connects to dedicated input rail (e.g., 5 V, 3.3 V, or intermediate bus); must be decoupled per regulator current demand |
| SW1LX–SW7LX (Pins 5, 6, 9, 10, 33, 34, 36) | Switching node outputs | Drive external high-side MOSFETs or integrated power stages; require low-inductance layout and proper snubbing |
| SW1FB–SW7FB (Pins 3, 2, 13, 12, 31, 30, 38) | Voltage feedback inputs | Monitor regulated output via resistor dividers; enable closed-loop accuracy within ±1.5% (SW1–SW6) or ±2% (SW7) |
| LDO1OUT–LDO4OUT (Pins 15, 18, 25, 28) | LDO regulated outputs | Deliver 1.5–5.0 V at 400 mA each; support load switch mode for controlled power gating of peripherals |
| VSNVS (Pin 47) | RTC supply output | Provides 1.8/3.0/3.3 V at 10 mA from VIN or coin cell (LICELL); maintains real-time clock during main power loss |
| SCL/SDA (Pins 55/56) | I²C interface | Supports high-speed (3.4 MHz) communication for runtime configuration, telemetry, and safety status reporting |
| FSOB (Pin 29) | Fail-safe output | Open-drain signal asserted LOW during critical faults (thermal runaway, register corruption, watchdog timeout) to trigger system-level safe state |
Key Features
| Feature | Design Value |
|---|---|
| Triple-phase VDD configuration | SW1/SW2/SW3 can be synchronized as a single 7.5 A rail for LS1043 core supply, reducing ripple and improving transient response over single-phase designs |
| OTP-configurable startup | One-time programmable memory stores voltage setpoints, sequencing order, and safety thresholds-eliminates external resistors and reduces BOM count |
| ASIL B functional safety | Includes independent voltage monitors, ABIST self-test, FSOB fail-safe output, and CRC-protected safety registers-meets ISO 26262 requirements without external safety MCU |
| 24-channel analog multiplexer | Enables real-time monitoring of all regulator outputs, die temperature, and external sensors via single ADC input-reduces system diagnostic complexity |
| Programmable watchdog & reset | Configurable timeout, early warning (EWARN), and RESETBMCU open-drain output provide layered fault recovery for LS1043-based boot integrity |
Applications
| Automotive Infotainment Head Unit | LS1043-Based ADAS Edge Controller |
|---|---|
Use Scenario: Central multimedia unit integrating navigation, voice recognition, and video display in vehicles. IC Role / Device Role / Timing Role: Primary PMIC supplying LS1043 processor cores, LPDDR4 memory, PCIe peripherals, and HDMI PHY. Use Value: Triple-phase VDD delivery ensures stable 1.0 V@6 A core rail under dynamic CPU load; ASIL B monitoring prevents silent failures during audio/video streaming. |
Use Scenario: Real-time sensor fusion module processing camera, radar, and CAN data for driver assistance functions. IC Role / Device Role / Timing Role: Power manager for LS1043 with strict timing constraints on memory and interface rails. Use Value: Programmable soft-start and PGOOD sequencing guarantee deterministic boot timing; 24-channel AMUX enables concurrent thermal and voltage margining across all rails. |
| Automotive Gateway ECU | Industrial Vehicle Telematics Module |
Use Scenario: CAN-FD/Ethernet gateway bridging vehicle networks and cloud connectivity. IC Role / Device Role / Timing Role: Regulates LS1043 dual-core A7, DDR3L memory, and Ethernet PHY while maintaining VSNVS for secure boot timestamping. Use Value: Coin cell-backed VSNVS preserves secure boot counters and cryptographic keys during battery disconnect; FSOB asserts safe state on detected memory voltage fault. |
Use Scenario: Ruggedized telematics unit deployed in construction or agricultural machinery with wide ambient temperature swings. IC Role / Device Role / Timing Role: Single-chip power solution for LS1043 operating from 9–36 V vehicle battery via external DC-DC pre-regulator. Use Value: −40 °C to +105 °C operation and 150 °C junction limit ensure reliability in unventilated enclosures; OTP lock prevents field firmware tampering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DBES | Optimized for i.MX8QM LPDDR4 PMIC2; lacks triple-phase VDD configuration for LS1043 | Targets multimedia SoCs-not LS1043 triple-phase VDD requirement | Select only if migrating from i.MX8QM-based design; not suitable for LS1043 VDD rail consolidation |
| MC33PF8200DHES | Configured for i.MX8QM DDR4 PMIC2; SW7 range limited to 1.0–3.3 V; no VTT mode on SW6 | Designed for DDR4 memory termination-not LS1043 core rail delivery | Use only when powering DDR4 memory subsystems; does not support LS1043 triple-phase VDD or 4.1 V SW7 output |
Compared with MC33PF8200DBES and MC33PF8200DHES, the MC33PF8200EMES uniquely supports triple-phase VDD configuration for LS1043, includes full 1.0–4.1 V SW7 range for flexible auxiliary rails, and is OTP-programmed specifically for LS1043 triple-phase operation-making it the only validated option for this target application.
Availability
MC33PF8200EMES is available at Aetrix Electronics and suitable for automotive infotainment head units, LS1043-based ADAS edge controllers, and industrial vehicle telematics modules requiring stable component supply, ASIL B compliance, and long-term lifecycle support.
Supply support for MC33PF8200EMES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in power management and functional safety.
The PF8200 product line is engineered for high-performance automotive processors-including LS1043, i.MX8, and S32x families-with emphasis on ASIL B safety, OTP configurability, and multi-phase power delivery to meet stringent automotive reliability and timing requirements.
FAQ
What is the primary target processor for MC33PF8200EMES?
The MC33PF8200EMES is specifically configured for the NXP LS1043 processor with triple-phase VDD capability. Its OTP programming and default power tree are optimized for LS1043's core rail requirements, distinguishing it from other PF8200 variants targeting i.MX8 or S32x processors. MC33PF8200EMES supports synchronized operation of SW1/SW2/SW3 to deliver up to 7.5 A for the LS1043 VDD domain.
Does MC33PF8200EMES support ASIL B functional safety out-of-the-box?
Yes, MC33PF8200EMES is certified to ASIL B per ISO 26262. It includes hardware-enforced safety features such as independent voltage/thermal monitors, ABIST self-test, FSOB fail-safe output, and CRC-protected safety registers-all enabled by default in its OTP configuration. No additional software initialization is required to meet ASIL B requirements for LS1043-based systems.
What is the role of the FSOB pin on MC33PF8200EMES?
The FSOB (Fail-Safe Output) pin on MC33PF8200EMES is an open-drain output that asserts LOW during critical faults-including thermal shutdown (>150 °C), register CRC failure, watchdog timeout, or voltage monitor violation. It directly drives system-level safety logic (e.g., MCU reset or isolation switch) without software intervention, fulfilling ASIL B fail-safe response requirements for LS1043 automotive applications.
Can MC33PF8200EMES be used with processors other than LS1043?
While MC33PF8200EMES is OTP-programmed for LS1043 triple-phase VDD, its underlying PF8200 architecture supports other NXP processors like i.MX8QM or S32G. However, using it outside LS1043 requires reprogramming OTP (not user-accessible) or configuring via I²C post-power-up. For non-LS1043 designs, MC33PF8200DBES or MC33PF8200DHES are preconfigured alternatives with validated power trees.
What thermal performance can be expected from MC33PF8200EMES in a 4-layer PCB design?
In a standard 4-layer PCB (2s2p) with forced airflow (200 ft/min), MC33PF8200EMES achieves RθJA = 22 °C/W. At 7.5 A triple-phase VDD load (1.0 V output), typical power dissipation is ~1.5 W, resulting in ~33 °C junction-to-ambient rise-well within the 150 °C max TJ limit even at +105 °C ambient. The EPAD must be solidly connected to internal ground planes for optimal conduction.
MC33PF8200EMES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200EMES FAQ
1.How can I place an order for MC33PF8200EMES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200EMES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200EMES reliable?
The price and inventory of MC33PF8200EMES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200EMES is usually 5 days.
3.What payment methods are accepted for MC33PF8200EMES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200EMES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200EMES?
MC33PF8200EMES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200EMES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200EMES?
For technical support, including MC33PF8200EMES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200EMES requirements.
6.How does Aetrix verify that MC33PF8200EMES is sourced from the original manufacturer or authorized distributors?
All MC33PF8200EMES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200EMES meets industry standards.
7.What is the process for return or replacement of MC33PF8200EMES?
All MC33PF8200EMES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200EMES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200EMES part is unused and in its original packaging.
Return procedure for MC33PF8200EMES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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