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NXP Semiconductors MC33PF8200EMESR2
- Part No.:
- MC33PF8200EMESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200EMESR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX8 PRE-PR
- Quantity:
- Payment:
- Shipping:
Inventory:2,245
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Product details
Overview
MC33PF8200EMESR2 from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for LS1043-based systems requiring triple-phase VDD regulation. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B safety monitoring. It supports dynamic voltage scaling, programmable power sequencing, and I²C configuration up to 3.4 MHz.
For engineers reviewing the MC33PF8200EMESR2 datasheet, MC33PF8200EMESR2 pinout, MC33PF8200EMESR2 application, or MC33PF8200EMESR2 equivalent, key selection criteria include ASIL B compliance, triple-phase VDD capability for LS1043, OTP-configurable startup, thermal shutdown protection, and wettable-flank HVQFN56 packaging for automotive reflow reliability.
Technical Context
The MC33PF8200EMESR2 implements a dual-domain architecture: a high-accuracy analog regulation core with seven synchronous buck stages (SW1–SW7) and four P-type LDOs, plus a safety-critical digital state machine supporting fail-safe transitions, ABIST, CRC-protected register writes, and FSOB-driven system lockdown. Its internal 24-channel analog multiplexer enables real-time diagnostics across all regulated outputs and thermal zones.
It features hardware-enforced safety mechanisms including independent voltage monitors with programmable fault thresholds, advanced thermal monitoring (10 die temperature sensors), external watchdog synchronization via XFAILB, and OTP-configurable fail-safe counter limits (FS_CNT[3:0]). The triple-phase VDD configuration for LS1043 is implemented using SW1/SW2/SW3 in coordinated interleaved mode with shared current sensing and synchronized soft-start.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 7 buck converters + 4 LDOs + VSNVS RTC supply - delivers full power tree for LS1043 SoC including core, memory, I/O, and always-on domains |
| Buck Output Range | SW1–SW6: 0.4 V–1.8 V (6.25 mV step); SW7: 1.0 V–4.1 V - supports DDR termination (VTT), GPU/CPU cores, and peripheral rails |
| Current Rating | 2500 mA per buck; 400 mA per LDO - enables triple-phase VDD operation up to 7.5 A when SW1/SW2/SW3 are configured jointly |
| I²C Interface | Up to 3.4 MHz high-speed mode - allows rapid runtime reconfiguration of voltage levels, sequencing, and safety thresholds without interrupting operation |
| Safety Certification | ASIL B compliant monitoring circuit - includes independent voltage/thermal fault detection, ABIST, FSOB fail-safe output, and OTP-locked safety parameters |
| Input Voltage Range | VIN: 2.7 V–5.5 V - compatible with automotive 12 V battery-supplied intermediate rails (e.g., 3.3 V or 5 V pre-regulators) |
| Package | HVQFN56, 8 mm × 8 mm × 0.9 mm, 0.5 mm pitch, dimple wettable flank - ensures solder joint reliability under automotive thermal cycling and vibration |
Pinout & Package
HVQFN56 package with exposed thermal pad (EPAD), 0.5 mm pitch, 8 mm × 8 mm body, 0.9 mm height, and dimple wettable flanks for automated optical inspection (AOI) and IPC-A-610 Class 3 solder joint validation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1LX, SW2LX, SW3LX | Triple-phase VDD switching nodes | Interleaved high-current outputs configured for LS1043 VDD rail; require low-inductance layout and phase-matched LC filters |
| SW1FB, SW2FB, SW3FB | Triple-phase VDD feedback inputs | Enable closed-loop regulation across all three phases; support remote sensing for load-point accuracy |
| VIN | Main PMIC input supply | Accepts 2.7–5.5 V; powers internal LDOs, logic, and buck high-side drivers - must be decoupled with ≥22 µF ceramic + bulk capacitance |
| FSOB | Fail-Safe Output (open-drain) | Asserts LOW during critical faults (thermal runaway, UV/OV, ABIST failure); directly drives system reset or safety controller |
| SCL / SDA | I²C interface signals | Support 3.4 MHz high-speed mode; require 2.2 kΩ pull-ups to VDDIO (1.6–3.3 V); tolerate 6 V max for robustness |
| EPAD | Exposed thermal pad | Must be soldered to solid ground plane for thermal dissipation (RθJC = 0.6 °C/W) and EMI reduction |
Key Features
| Feature | Design Value |
|---|---|
| Triple-phase VDD configuration | SW1/SW2/SW3 operate in synchronized interleaved mode delivering up to 7.5 A at <1% ripple for LS1043 processor core supply |
| ASIL B functional safety | Includes independent voltage monitors, 10-die thermal sensors, ABIST, FSOB fail-safe output, and OTP-locked safety counters |
| OTP-configurable startup | One-time programmable memory stores voltage targets, sequencing order, soft-start timing, and safety thresholds - eliminates external configuration resistors |
| 24-channel analog multiplexer | Enables real-time monitoring of all regulator outputs, input rails, and thermal zones via single ADC input - reduces BOM and board space |
| RTC with coin cell backup | VSNVS provides 1.8/3.0/3.3 V at 10 mA from VIN or LICELL; integrated charger supports programmable charge current/voltage for Li-MnO₂ cells |
| Dynamic voltage scaling (DVS) | SW1–SW6 support runtime voltage adjustment via I²C - enables power-aware DVFS for LS1043 performance states without hardware changes |
Applications
| Automotive ADAS Domain Controller | LS1043-Based Secure Gateway |
|---|---|
Use Scenario: Powering LS1043 SoC in vehicle-to-everything (V2X) gateways with CAN FD, Ethernet AVB, and secure boot. IC Role / Device Role / Timing Role: Primary PMIC providing triple-phase VDD, DDR termination (SW6 in VTT mode), and isolated RTC domain for secure time-stamping. Use Value: ASIL B monitoring ensures safe shutdown during voltage/thermal faults; OTP configuration guarantees consistent power-up behavior across firmware updates. |
Use Scenario: Supplying LS1043 in automotive secure gateway applications requiring cryptographic acceleration and firewall processing. IC Role / Device Role / Timing Role: Central power manager delivering core (VDD), memory (VDDQ/VTT), I/O (1.8 V/3.3 V), and always-on (VSNVS) rails with fail-safe control. Use Value: FSOB output triggers hardware-level security lockdown on detected faults; 24-channel AMUX enables runtime health telemetry for OTA diagnostics. |
| Industrial Edge AI Appliance | Ruggedized Telematics Unit |
Use Scenario: Powering LS1043 in fanless edge servers performing real-time video analytics at −40°C to +105°C ambient. IC Role / Device Role / Timing Role: High-reliability PMIC with thermal derating, spread-spectrum switching, and wettable-flank QFN for extended lifetime in convection-cooled enclosures. Use Value: Junction temperature monitoring (TJ ≤ 150°C) and RθJA = 22 °C/W (4-layer board) enable passive cooling; triple-phase VDD minimizes input capacitance requirements. |
Use Scenario: Supporting LS1043 in telematics control units (TCUs) exposed to automotive vibration, wide temperature swings, and battery transients. IC Role / Device Role / Timing Role: Automotive-qualified PMIC with 5.5 V absolute max VIN rating, AEC-Q100 HBM 2000 V ESD, and 105°C operating range. Use Value: Dimple wettable flanks ensure solder joint integrity during thermal cycling; SYNCIN/SYNCOUT pins enable clock synchronization with baseband modems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DBES | Configured for i.MX8QM LPDDR4 PMIC2; lacks triple-phase VDD tuning for LS1043; OTP pre-programmed for different SoC sequence | Targeted at multimedia SoCs, not communication processors; no LS1043-specific VDD phase coordination | Select only if migrating from i.MX8QM-based design; requires full OTP reprogramming and layout revision for LS1043 use |
| MC33PF8200DHES | Optimized for i.MX8QM DDR4 PMIC2; SW6 configured for VTT, SW7 for 1.2 V memory I/O; no triple-phase VDD support | Designed for DDR4 memory subsystems, not processor core supply; missing LS1043-specific safety and sequencing parameters | Not suitable for LS1043 VDD; use only for DDR4 memory power delivery where triple-phase core regulation is unnecessary |
Compared with MC33PF8200DBES and MC33PF8200DHES, the MC33PF8200EMESR2 uniquely provides OTP-locked triple-phase VDD configuration, LS1043-specific power sequencing, and fail-safe response tailored for communication processor gateways - making it the only drop-in solution for this target application.
Availability
MC33PF8200EMESR2 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, LS1043-based secure gateways, and ruggedized telematics units requiring stable component supply, ASIL B compliance, and long-term lifecycle support.
Supply support for MC33PF8200EMESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade PMIC design.
The PF8200 product line was developed specifically to deliver ASIL B-compliant, OTP-configurable power management for NXP's high-performance communication processors like LS1043 and S32G, emphasizing triple-phase core regulation, fail-safe monitoring, and automotive reflow reliability.
FAQ
What is the primary target application for the MC33PF8200EMESR2?
The MC33PF8200EMESR2 is specifically engineered for LS1043-based automotive communication processors requiring triple-phase VDD regulation. Its OTP configuration, ASIL B safety features, and wettable-flank HVQFN56 package make it ideal for secure gateways, V2X units, and telematics control modules operating across −40°C to +105°C.
Does the MC33PF8200EMESR2 support dynamic voltage scaling (DVS)?
Yes, the MC33PF8200EMESR2 supports DVS on SW1 through SW6 via its 3.4 MHz I²C interface. This allows real-time adjustment of output voltages during LS1043 performance state transitions, enabling energy-efficient operation without hardware modifications or sequencer reprogramming.
How does the MC33PF8200EMESR2 implement ASIL B compliance?
The MC33PF8200EMESR2 achieves ASIL B compliance through independent voltage/thermal monitors, 10-die temperature sensors, ABIST self-test, FSOB fail-safe output, CRC-protected register writes, and OTP-locked safety parameters (e.g., FS_CNT[3:0], OTP_FS_MAX_CNT). These features are validated per ISO 26262 requirements for automotive safety mechanisms.
What is the function of the FSOB pin on the MC33PF8200EMESR2?
The FSOB (Fail-Safe Output) pin on the MC33PF8200EMESR2 is an open-drain output that asserts LOW during critical failures - including thermal runaway, input overvoltage, ABIST test failure, or safety counter overflow. It directly interfaces with external safety controllers or system reset logic to enforce fail-safe shutdown.
Can the MC33PF8200EMESR2 be used with processors other than LS1043?
The MC33PF8200EMESR2 is OTP-programmed for LS1043 triple-phase VDD and associated power sequencing. While its 7-buck/4-LDO architecture is adaptable, using it with other processors (e.g., i.MX8QM or S32G) requires custom OTP programming, validation of regulator configurations, and verification of safety parameter alignment - not supported out-of-box.
MC33PF8200EMESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200EMESR2 FAQ
1.How can I place an order for MC33PF8200EMESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200EMESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200EMESR2 reliable?
The price and inventory of MC33PF8200EMESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200EMESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF8200EMESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200EMESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200EMESR2?
MC33PF8200EMESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200EMESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200EMESR2?
For technical support, including MC33PF8200EMESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200EMESR2 requirements.
6.How does Aetrix verify that MC33PF8200EMESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF8200EMESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200EMESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF8200EMESR2?
All MC33PF8200EMESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200EMESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200EMESR2 part is unused and in its original packaging.
Return procedure for MC33PF8200EMESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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