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NXP Semiconductors MC33PF8200ESES
- Part No.:
- MC33PF8200ESES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200ESES.pdf
- Description:
- IC POWER MANAGEMENT I.MX8QM
- Quantity:
- Payment:
- Shipping:
Inventory:2,394
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Product details
Overview
MC33PF8200ESES from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for i.MX8QM-based LPDDR4 memory systems. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charging, ASIL B safety monitoring, and OTP-configurable startup sequencing. It delivers precise voltage regulation for CPU cores, GPU, memory I/O, and peripherals in infotainment and ADAS platforms.
For engineers reviewing the MC33PF8200ESES datasheet, MC33PF8200ESES pinout, MC33PF8200ESES application, or MC33PF8200ESES equivalent, key selection considerations include its ASIL B compliance, 7-buck + 4-LDO architecture, 3.4 MHz I²C interface, HVQFN56 thermal-enhanced package, and LPDDR4-optimized power tree for i.MX8QM PMIC1 use case.
Technical Context
The MC33PF8200ESES implements a dual-phase capable buck regulator architecture: SW1/SW2, SW3/SW4, and SW5/SW6 support phase interleaving, while SW1–SW3 can be configured as triple-phase (up to 7.5 A), and SW1–SW4 as quad-phase (up to 10 A). SW6 supports VTT termination mode for DDR memory buses.
Its functional safety subsystem includes independent voltage monitors with programmable fault thresholds, ABIST (Analog Built-In Self-Test), CRC-protected I²C writes, fail-safe state locking via FSOB, and thermal shutdown at 150 °C - all certified to ASIL B per ISO 26262.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 7 buck converters (SW1–SW7) + 4 LDOs (LDO1–LDO4) + VSNVS RTC supply - enables full SoC power delivery from single PMIC. |
| Buck Output Range | SW1–SW6: 0.4 V to 1.8 V (6.25 mV step); SW7: 1.0 V to 4.1 V - covers core, I/O, and auxiliary rail requirements. |
| Current Rating | 2.5 A per buck channel; 400 mA per LDO - sufficient for i.MX8QM CPU clusters, GPU, LPDDR4 I/O, and peripheral rails. |
| I²C Interface | Up to 3.4 MHz operation - enables fast dynamic voltage scaling and real-time configuration during system state transitions. |
| Safety Certification | ASIL B compliant monitoring circuit - provides independent voltage/thermal/fault detection with fail-safe output (FSOB) assertion. |
| Package | HVQFN56, 8 mm × 8 mm × 0.9 mm, wettable flank - optimized for automotive thermal dissipation and solder-joint reliability inspection. |
| Operating Temp | −40 °C to +105 °C ambient - qualified for under-hood and head-unit automotive environments. |
Pinout & Package
HVQFN56, thermally enhanced very thin quad flat package, no leads, 56 terminals, 0.1 mm dimple wettable flank, 0.5 mm pitch, 8 mm × 8 mm × 0.9 mm body (SOT684-29(D)). Exposed pad (EPAD) must be connected to ground for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable closed-loop regulation of each buck output; require external resistor dividers for voltage setting. |
| SW1IN–SW7IN | Buck input supplies | Accept 2.7 V to 5.5 V input; SW1–SW6 share VIN domain; SW7 may use separate input for isolation. |
| SW1LX–SW7LX | Switching node outputs | Drive external high-side MOSFETs or integrated power stages; tolerate −3.0 V transient spikes during dead time. |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Deliver 1.5 V to 5.0 V at 400 mA; support load switch mode for rail sequencing and power gating. |
| VSNVS | RTC supply output | Provides 1.8 V / 3.0 V / 3.3 V at 10 mA from VIN or coin cell; enables battery-backed real-time clock operation. |
| SCL/SDA | I²C interface | 3.4 MHz high-speed bus for runtime configuration, monitoring, and DVS control; supports CRC and secure write protection. |
| FSOB | Fail-safe output | Open-drain signal asserted LOW during critical faults (e.g., overtemperature, UVLO, self-test failure) to trigger system-level safe state. |
| RESETBMCU | MCU reset output | Open-drain reset signal synchronized to PMIC power-up sequence; ensures deterministic SoC initialization timing. |
Key Features
| Feature | Design Value |
|---|---|
| OTP Configuration Memory | Stores boot voltage levels, power-up/down sequencing, and safety thresholds - eliminates external configuration resistors and reduces BOM count. |
| Dual/Triple/Quad-Phase Buck Support | SW1–SW4 configurable as multi-phase banks - enables high-current rails (e.g., CPU core) with reduced ripple and improved transient response. |
| VTT Termination on SW6 | Supports DDR memory VTT rail generation with dynamic tracking - meets JEDEC LPDDR4 termination accuracy requirements. |
| 24-Channel Analog MUX | Enables system-level diagnostics by routing internal voltage/temperature monitors to a single ADC input - simplifies board-level health monitoring. |
| ABIST & CRC-Protected I²C | On-chip analog self-test verifies monitor functionality at startup; I²C writes to safety registers require CRC validation - prevents unintended configuration changes. |
Applications
| Automotive Infotainment Head Unit | ADAS Domain Controller |
|---|---|
|
Use Scenario: Powering i.MX8QM SoC with LPDDR4 memory, GPU, display interfaces, and audio codecs in a vehicle head unit. IC Role / Device Role / Timing Role: Primary PMIC delivering 12 regulated rails including CPU cores (SW1–SW3), GPU (SW4), LPDDR4 VDDQ/VTT (SW5/SW6), and I/O (LDOs). Use Value: OTP-programmed sequencing ensures deterministic boot; ASIL B monitoring protects against undervoltage/overtemperature faults during runtime. |
Use Scenario: Supplying S32V234 or i.MX8QM in camera/radar fusion controllers requiring high-reliability power with safety-critical monitoring. IC Role / Device Role / Timing Role: Safety-certified power manager providing VDD_CORE, memory rails, and sensor I/O with fail-safe output (FSOB) integration into system watchdog chain. Use Value: FSOB assertion triggers immediate domain shutdown upon detected fault; ABIST validates voltage monitors before enabling power rails. |
| Industrial HMI Terminal | Connected Vehicle Telematics Gateway |
|
Use Scenario: Powering i.MX8QM-based ruggedized human-machine interface with extended temperature operation and long lifecycle requirements. IC Role / Device Role / Timing Role: Single-chip power solution managing processor, eMMC, Ethernet PHY, and CAN transceiver rails across wide ambient range. Use Value: −40 °C to +105 °C rating and 150 °C junction limit ensure stable operation; spread-spectrum switching reduces EMI in dense PCB layouts. |
Use Scenario: Supporting LTE/V2X modem, GNSS, and MCU in telematics control units requiring always-on RTC and low-power standby modes. IC Role / Device Role / Timing Role: Provides VSNVS (1.8 V/3.0 V/3.3 V) from coin cell or main supply, plus programmable standby/off states for ultra-low quiescent current. Use Value: Coin cell charger with programmable voltage/current extends backup runtime; PWRON/STANDBY inputs enable hardware-controlled power state transitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DBES | Same PF8200 family, ASIL B rated, but configured for i.MX8QM LPDDR4 PMIC2 role - different OTP firmware and rail assignment. | Targets secondary PMIC position in dual-PMIC i.MX8QM designs; not interchangeable without revalidation of power tree and sequencing. | Select MC33PF8200DBES only when implementing dual-PMIC architecture where MC33PF8200ESES serves as PMIC1 and DBES as PMIC2. |
| MC33PF8100EPES | Industrial-grade PF8100 variant; lacks ASIL B safety features (no FSOB, ABIST, or fail-safe state machine); QM safety grade only. | Valid for non-safety-critical i.MX8QM applications (e.g., consumer tablets); cannot substitute in automotive ASIL B systems. | Choose MC33PF8100EPES only for cost-sensitive industrial designs without functional safety requirements. |
Compared with MC33PF8200DBES and MC33PF8100EPES, the MC33PF8200ESES uniquely combines ASIL B certification, LPDDR4-optimized OTP configuration for i.MX8QM PMIC1, and full 7-buck + 4-LDO capability - making it the designated solution for automotive infotainment primary power delivery.
Availability
MC33PF8200ESES is available at Aetrix Electronics and suitable for automotive infotainment, ADAS domain controllers, and industrial HMI terminals requiring stable component supply, long-term lifecycle support, and ASIL B-compliant power management.
Supply support for MC33PF8200ESES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in application processors and power management.
The PF8200 product line was engineered specifically for high-performance NXP application processors (i.MX 8, S32x), delivering integrated, safety-certified power delivery with minimal external components and flexible runtime control.
FAQ
What is the primary application target for the MC33PF8200ESES?
The MC33PF8200ESES is specifically configured as the primary PMIC (PMIC1) for i.MX8QM-based systems using LPDDR4 memory. Its OTP firmware, rail assignments, and sequencing are optimized for this use case - powering CPU clusters, GPU, memory I/O, and peripherals while meeting ASIL B requirements for automotive infotainment.
Does the MC33PF8200ESES support dynamic voltage scaling (DVS)?
Yes, the MC33PF8200ESES supports DVS on SW1 through SW6 via its 3.4 MHz I²C interface. Each buck converter's output voltage can be adjusted in 6.25 mV steps during operation, enabling real-time performance scaling for CPU/GPU cores and memory rails based on workload demands.
How does the MC33PF8200ESES implement functional safety?
The MC33PF8200ESES implements ASIL B compliance through independent voltage/thermal monitors, ABIST for analog path validation, CRC-protected I²C writes to safety registers, fail-safe state locking, and the FSOB pin that asserts LOW during critical faults - all verified per ISO 26262 requirements for automotive safety mechanisms.
What package type and thermal characteristics does the MC33PF8200ESES use?
The MC33PF8200ESES uses the HVQFN56 package (SOT684-29(D)) with 8 mm × 8 mm footprint, 0.9 mm height, and dimple wettable flanks. Its thermal resistance is RθJA = 22 °C/W on a 4-layer board, and RθJC = 0.6 °C/W to the bottom case - enabling reliable operation up to 105 °C ambient with proper PCB copper pour.
Can the MC33PF8200ESES be used with processors other than i.MX8QM?
While optimized for i.MX8QM LPDDR4 systems, the MC33PF8200ESES can support other NXP processors (e.g., S32V234, LS1043A) and select non-NXP SoCs. However, OTP configuration, power tree mapping, and safety feature enablement must be validated per target platform - default OTP is specific to i.MX8QM PMIC1.
MC33PF8200ESES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200ESES FAQ
1.How can I place an order for MC33PF8200ESES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200ESES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200ESES reliable?
The price and inventory of MC33PF8200ESES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200ESES is usually 5 days.
3.What payment methods are accepted for MC33PF8200ESES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200ESES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200ESES?
MC33PF8200ESES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200ESES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200ESES?
For technical support, including MC33PF8200ESES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200ESES requirements.
6.How does Aetrix verify that MC33PF8200ESES is sourced from the original manufacturer or authorized distributors?
All MC33PF8200ESES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200ESES meets industry standards.
7.What is the process for return or replacement of MC33PF8200ESES?
All MC33PF8200ESES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200ESES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200ESES part is unused and in its original packaging.
Return procedure for MC33PF8200ESES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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