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NXP Semiconductors MC33PF8200ESESR2
- Part No.:
- MC33PF8200ESESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200ESESR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX8 PRE-PR
- Quantity:
- Payment:
- Shipping:
Inventory:4,160
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Product details
Overview
MC33PF8200ESESR2 from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for i.MX 8 and S32x processors. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply with coin cell charging, ASIL B safety monitoring, and OTP-configurable startup sequencing - enabling full power delivery to CPU, LPDDR4/DDR4 memory, and peripherals in infotainment and ADAS systems.
For engineers reviewing the MC33PF8200ESESR2 datasheet, MC33PF8200ESESR2 pinout, MC33PF8200ESESR2 application, or MC33PF8200ESESR2 equivalent, key selection criteria include its 56-pin HVQFN package with wettable flanks, 3.4 MHz I²C interface, dual/triple/quad-phase buck configuration capability, VTT termination on SW6, and functional safety features including ABIST, watchdog monitoring, and fail-safe output (FSOB).
Technical Context
The MC33PF8200ESESR2 implements a deterministic state machine for fault-aware power sequencing, supporting hard WD reset, fail-safe shutdown, and programmable power-up/down sequences. Its architecture includes independent voltage monitors per regulator, 24-channel analog multiplexer for system diagnostics, and OTP-based configuration storage that eliminates external resistor networks for voltage and sequencing setup.
It supports dynamic voltage scaling on six buck channels (SW1–SW6), configurable multi-phase operation (dual up to quad phase), and flexible LDO control with hardware/software enable and load-switch modes. The FSOB pin provides ASIL B-compliant fail-safe signaling, while XFAILB enables external clock synchronization and SYNCIN/SYNCOUT support inter-PMIC timing coordination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 7 buck converters + 4 LDOs + VSNVS RTC supply - delivers complete power tree for i.MX 8/S32x SoCs without auxiliary PMICs |
| Buck Output Range | SW1–SW6: 0.4 V–1.8 V (6.25 mV step); SW7: 1.0 V–4.1 V - covers core, I/O, GPU, and peripheral rails |
| Current Rating | 2.5 A per buck channel; 400 mA per LDO - sufficient for LPDDR4 I/O, DDR4 VDDQ/VTT, and MCU core domains |
| I²C Interface | Up to 3.4 MHz - enables fast post-boot reconfiguration of voltage, sequencing, and safety parameters |
| Safety Compliance | ASIL B monitoring circuit with ABIST, programmable fault counters, thermal shutdown, and FSOB fail-safe output |
| Package | HVQFN56, 8 mm × 8 mm × 0.9 mm, 0.5 mm pitch, dimple wettable flanks - supports automated optical inspection and high-reliability solder joints |
| Operating Temp | −40 °C to +105 °C ambient - qualified for automotive cabin and engine bay-adjacent applications |
Pinout & Package
HVQFN56 package with exposed thermal pad (EPAD), 0.5 mm pitch, 8 mm × 8 mm footprint, and dimple wettable flanks for enhanced solder joint reliability in automotive reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable precise closed-loop regulation; support remote sensing for high-current rails |
| SW1IN–SW7IN | Buck input supplies | Accept 2.7 V–5.5 V input; require local bulk capacitance and low-ESR ceramic decoupling |
| SW1LX–SW7LX | Buck switching nodes | Connect to external high-frequency inductors; require tight layout to minimize EMI and voltage spikes |
| LDO1OUT–LDO4OUT | LDO outputs | Provide low-noise, low-dropout bias for analog PHYs, SerDes, and sensor interfaces |
| VSNVS | RTC supply output | Delivers 1.8 V/3.0 V/3.3 V at 10 mA from VIN or coin cell - maintains real-time clock during main power loss |
| FSOB | Fail-safe output | Open-drain ASIL B-compliant signal asserting LOW on critical faults - triggers system-level safe state entry |
| SCL/SDA | I²C interface | 3.4 MHz high-speed bus for runtime configuration, monitoring, and safety register access |
| PGOOD/INTB/RESETBMCU | Status and control signals | Enable coordinated power-good handshaking, interrupt-driven fault reporting, and processor reset assertion |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable startup sequence | Eliminates external resistors and timing components; reduces BOM count and improves boot repeatability |
| Dual/triple/quad-phase buck configuration | Enables scalable current delivery: up to 7.5 A (triple-phase) or 10 A (quad-phase) on CPU core rails |
| VTT termination mode on SW6 | Directly supplies DDR4/LPDDR4 VTT rail with active termination - no external VTT generator required |
| 24-channel analog multiplexer (AMUX) | Supports real-time monitoring of internal voltages, temperatures, and external system nodes for predictive diagnostics |
| ABIST and CRC-protected registers | Ensures functional integrity before and during operation; meets ASIL B diagnostic coverage requirements |
| Coin cell charger with programmable current/voltage | Maintains RTC backup during vehicle off-state; configurable charge profile prevents battery overvoltage |
Applications
| Automotive Infotainment Head Unit | ADAS Domain Controller |
|---|---|
|
Use Scenario: Powering i.MX 8QM processor, LPDDR4 memory, display interface, and audio codecs in a vehicle head unit. IC Role / Device Role / Timing Role: Primary PMIC delivering all regulated rails including CPU core (SW1–SW3), GPU (SW4), memory I/O (SW5), VTT (SW6), and RTC (VSNVS). Use Value: OTP-programmed sequencing ensures deterministic boot; ASIL B monitoring enables fail-safe shutdown during thermal or voltage faults. |
Use Scenario: Supplying S32V234 vision processor, MIPI camera interfaces, and radar pre-processing modules in a front-camera ADAS ECU. IC Role / Device Role / Timing Role: Central power hub managing DDR3L memory rails, SerDes analog supplies, and safety-critical domain controller logic. Use Value: FSOB output directly drives system-level safe state; ABIST and watchdog ensure compliance with ISO 26262 ASIL B requirements. |
| Industrial Edge Gateway | Connected Vehicle Telematics Unit |
|
Use Scenario: Powering LS1043A processor, eMMC, Ethernet PHYs, and cellular modem in an industrial IoT gateway operating at −40 °C to +85 °C. IC Role / Device Role / Timing Role: Single-chip solution for multi-rail power delivery with programmable soft-start to prevent inrush current on cold start. Use Value: 3.4 MHz I²C allows rapid runtime adjustment of LDO voltages during modem transmit bursts; wide VIN range (2.7 V–5.5 V) accommodates varied input sources. |
Use Scenario: Supporting i.MX 8QXP in a telematics control unit requiring GNSS, LTE, and CAN FD connectivity with always-on RTC functionality. IC Role / Device Role / Timing Role: Provides VSNVS from coin cell during ignition-off; manages separate power domains for modem, MCU, and secure element. Use Value: Coin cell charger with programmable settings extends backup runtime; PGOOD and INTB signals coordinate wake-up and sleep transitions across subsystems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8100ESES | Lacks ASIL B safety features (no ABIST, FSOB, fail-safe state machine); QM grade only | Suitable for non-safety-critical industrial or consumer i.MX 8 designs without ISO 26262 requirements | Select when functional safety certification is not required and cost optimization is prioritized |
| MPQ4436-AEC1 | Single 3 A buck converter; no integrated LDOs, OTP, or safety monitoring - requires companion ICs | Used in simpler automotive subsystems (e.g., display backlight, sensor hubs) where full PMIC integration is unnecessary | Choose only for discrete rail replacement; not a system-level PMIC alternative for i.MX/S32x platforms |
Compared with MC33PF8200ESESR2, MC33PF8100ESES omits safety-critical functions needed for ASIL B compliance, while MPQ4436-AEC1 lacks multi-rail integration and system-level intelligence - making MC33PF8200ESESR2 the only single-package solution meeting full automotive infotainment and ADAS power architecture requirements.
Availability
MC33PF8200ESESR2 is available at Aetrix Electronics and suitable for automotive infotainment, ADAS domain controllers, and industrial edge gateways requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified performance.
Supply support for MC33PF8200ESESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and power management.
The PF8200 product line was engineered specifically to deliver ASIL B-compliant, highly integrated power solutions for NXP's i.MX 8 and S32x automotive processors - reducing system complexity while meeting stringent functional safety and thermal requirements.
FAQ
What is the primary application target for the MC33PF8200ESESR2?
The MC33PF8200ESESR2 is purpose-built for automotive applications requiring ASIL B compliance, especially infotainment head units and ADAS domain controllers based on NXP i.MX 8 or S32x processors. It delivers all necessary power rails - including CPU core, GPU, memory (LPDDR4/DDR4), I/O, and RTC - with integrated safety monitoring, OTP configuration, and fail-safe signaling via the FSOB pin. Its design eliminates need for secondary PMICs or discrete safety circuitry.
Does the MC33PF8200ESESR2 support dynamic voltage scaling (DVS)?
Yes, the MC33PF8200ESESR2 supports DVS on SW1 through SW6 buck converters. Each of these channels can be programmed via I²C to adjust output voltage in 6.25 mV steps across their full range (0.4 V–1.8 V), enabling real-time adaptation to processor performance states. This capability is essential for optimizing power efficiency in variable-workload automotive applications such as video decoding or AI inference acceleration.
How does the MC33PF8200ESESR2 implement functional safety per ASIL B?
The MC33PF8200ESESR2 achieves ASIL B compliance through multiple hardware-enforced mechanisms: independent voltage/thermal monitors per regulator, ABIST (analog built-in self-test), CRC-protected safety registers, programmable fault counters, watchdog timer with external input (WDI), and a dedicated fail-safe output (FSOB) that asserts LOW on critical failures. These features are enabled by OTP configuration and validated during power-up self-test - distinguishing it from QM-grade variants like the PF8100.
What package type and mounting features does the MC33PF8200ESESR2 use?
The MC33PF8200ESESR2 uses the HVQFN56 package (SOT684-29(D)), measuring 8 mm × 8 mm × 0.9 mm with 0.5 mm pitch and dimple wettable flanks. This package supports automated optical inspection (AOI) of solder joints and enhances thermal dissipation via the exposed EPAD, which must be connected to a solid ground plane. The wettable flank design ensures reliable solder fillet formation - critical for automotive manufacturing and field reliability.
Can the MC33PF8200ESESR2 power both LPDDR4 and DDR4 memory interfaces?
Yes, the MC33PF8200ESESR2 is explicitly configured in multiple reference designs to power both LPDDR4 and DDR4 memory. SW5 and SW6 supply memory I/O rails, with SW6 supporting VTT termination mode for DDR4. Specific OTP configurations (e.g., MC33PF8200DBES for LPDDR4 PMIC2 or MC33PF8200DHES for DDR4 PMIC2) validate its use in dual-memory architectures - enabling flexible platform reuse across memory generations without PMIC redesign.
MC33PF8200ESESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200ESESR2 FAQ
1.How can I place an order for MC33PF8200ESESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200ESESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200ESESR2 reliable?
The price and inventory of MC33PF8200ESESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200ESESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF8200ESESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200ESESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200ESESR2?
MC33PF8200ESESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200ESESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200ESESR2?
For technical support, including MC33PF8200ESESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200ESESR2 requirements.
6.How does Aetrix verify that MC33PF8200ESESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF8200ESESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200ESESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF8200ESESR2?
All MC33PF8200ESESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200ESESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200ESESR2 part is unused and in its original packaging.
Return procedure for MC33PF8200ESESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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