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NXP Semiconductors MC33PF8200ETES
- Part No.:
- MC33PF8200ETES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200ETES.pdf
- Description:
- IC POWER MANAGEMENT I.MX8QM
- Quantity:
- Payment:
- Shipping:
Inventory:1,934
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Product details
Overview
MC33PF8200ETES from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for i.MX8QM-based DDR4 memory PMIC1 applications. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B safety monitoring circuitry. Input voltage range is 2.7 V to 5.5 V, output accuracy up to ±1.5 % on core bucks, and it supports dynamic voltage scaling for processor power domains.
For engineers reviewing the MC33PF8200ETES datasheet, MC33PF8200ETES pinout, MC33PF8200ETES application, or MC33PF8200ETES equivalent, this page delivers verified technical context, validated pin functions, confirmed automotive safety compliance (ASIL B), exact regulator specifications per channel, and real-world use cases in i.MX8QM DDR4 memory subsystems - all derived from NXP's official PF8100/PF8200 Rev. 13 product data sheet.
Technical Context
The MC33PF8200ETES implements a dual-phase capable architecture: SW1/SW2, SW3/SW4, and SW5/SW6 can be paired for higher current delivery, while SW1–SW4 support quad-phase configuration up to 10 A. Its integrated state machine handles autonomous power-up sequencing, fault detection (UV/OV, thermal, watchdog timeout), and fail-safe transitions including FSOB assertion and hard reset generation via RESETBMCU.
It features OTP-programmable startup configuration, 3.4 MHz I²C interface with CRC protection, 24-channel analog multiplexer for system diagnostics, and ABIST-enabled functional safety self-test per ISO 26262 ASIL B requirements. The device includes dedicated VTT termination mode on SW6 and programmable soft-start/soft-shutdown timing for DDR4 memory rail control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 7 buck converters + 4 LDOs + VSNVS RTC supply = 12 independent regulated outputs |
| Buck Output Range | SW1–SW6: 0.4 V to 1.8 V (6.25 mV step); SW7: 1.0 V to 4.1 V - covers CPU core, GPU, DDR I/O, and peripheral rails |
| Current Rating | All bucks rated at 2500 mA; LDOs at 400 mA - sufficient for i.MX8QM DDR4 memory subsystem (VDDQ, VTT) |
| Safety Certification | ASIL B compliant monitoring: independent voltage/thermal fault detection, ABIST, FSOB fail-safe output, and watchdog counter |
| I²C Interface | High-speed 3.4 MHz I²C with CRC write protection - enables fast runtime reconfiguration of DVS, sequencing, and fault thresholds |
| Package | HVQFN56, 8 mm × 8 mm × 0.9 mm, wettable flank - optimized for automotive thermal performance and solder joint inspection |
| Operating Temp | −40 °C to +105 °C ambient - qualified for automotive cabin and infotainment module environments |
Pinout & Package
HVQFN56 package, 8 mm × 8 mm × 0.9 mm body, 0.5 mm pitch, thermally enhanced with dimple wettable flanks (SOT684-29(D)). Exposed pad (EPAD) must be connected to ground for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable precise closed-loop regulation; each connects to respective output divider network for ±1.5 % accuracy |
| SW1IN–SW7IN | Buck input supplies | VIN-derived inputs; SW1–SW6 accept 2.7–5.5 V; SW7 supports up to 4.1 V output - decoupling critical for EMI control |
| SW1LX–SW7LX | Switching node outputs | High-frequency switching nodes requiring low-inductance layout; tolerate −3.0 V transient spikes during dead time |
| LDO1OUT–LDO4OUT | LDO regulated outputs | 1.5–5.0 V, 400 mA each; support load switch mode for power gating peripherals and memory I/O |
| VSNVS | RTC supply output | 1.8 V / 3.0 V / 3.3 V selectable; powers SNVS domain and retains memory during main power loss |
| FSOB | Fail-safe output | Open-drain ASIL B safety signal asserting LOW on critical fault - triggers system-level shutdown or safe state entry |
| SCL/SDA | I²C interface | 3.4 MHz high-speed bus for runtime configuration, monitoring, and safety register access with CRC validation |
| RESETBMCU | MCU reset output | Open-drain active-low reset signal generated on startup failure, watchdog timeout, or thermal shutdown |
Key Features
| Feature | Design Value |
|---|---|
| Dual/quad-phase buck configuration | SW1/SW2, SW3/SW4, SW5/SW6 configurable as dual-phase; SW1–SW4 as quad-phase up to 10 A - meets DDR4 VDDQ/VTT peak current demands |
| VTT termination mode | SW6 supports VTT tracking and termination for DDR4 memory - eliminates need for external VTT regulator |
| OTP-configurable startup | One-time programmable memory stores voltage setpoints, power-up sequence, and safety thresholds - reduces external components and boot-time latency |
| ASIL B functional safety | Independent voltage monitors, thermal shutdown, ABIST self-test, FSOB fail-safe output, and watchdog with programmable counter - certified for automotive safety-critical subsystems |
| 24-channel analog multiplexer | Enables real-time monitoring of internal voltages, temperatures, and external sensor inputs - supports predictive diagnostics and system health reporting |
| Coin cell backup & charging | LICELL input with programmable charge current/voltage - maintains RTC and SNVS domain during main power loss in infotainment head units |
Applications
| Automotive Infotainment Head Unit | i.MX8QM DDR4 Memory Subsystem |
|---|---|
Use Scenario: High-resolution display, multi-zone audio, and navigation processing in vehicle cockpit systems. IC Role / Device Role / Timing Role: Primary PMIC supplying CPU cores (SW1–SW3), GPU (SW4), DDR4 memory rails (SW5/VTT, SW6), and SNVS domain (VSNVS). Use Value: ASIL B monitoring ensures safe degradation during faults; OTP startup reduces boot time; VTT mode eliminates discrete termination IC. |
Use Scenario: Power delivery to LPDDR4/DDR4 memory interfaces in i.MX8QM-based ADAS and digital cluster platforms. IC Role / Device Role / Timing Role: Dedicated DDR4 PMIC1 delivering VDDQ (SW5), VTT (SW6), and auxiliary rails (LDO1–LDO4) with synchronized sequencing. Use Value: Quad-phase capability supports >6 A DDR4 peak currents; programmable soft-start prevents memory initialization failures; 3.4 MHz I²C enables real-time DVS during video playback. |
| Advanced Driver Assistance Systems (ADAS) | Industrial Edge Gateway |
Use Scenario: Sensor fusion and real-time image processing using S32V234 or i.MX8QM processors in camera radar modules. IC Role / Device Role / Timing Role: Safety-critical power manager providing isolated, monitored rails for vision processor, ISP, and memory with fail-safe FSOB signaling. Use Value: ABIST and watchdog ensure runtime integrity; thermal monitoring prevents throttling during sustained AI inference; wettable flank package supports automotive reflow standards. |
Use Scenario: Ruggedized industrial gateway running Linux on i.MX8QM with DDR4, eMMC, and multiple I/O interfaces. IC Role / Device Role / Timing Role: Centralized power controller managing processor core, DDR4, peripheral I/O (LDOs), and RTC backup (VSNVS/LICELL). Use Value: 105 °C operation sustains reliability in uncooled enclosures; 24-channel AMUX enables board-level health telemetry; OTP config simplifies BOM across SKUs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DBES | Same PF8200 family, configured for i.MX8QM LPDDR4 PMIC2 role; different OTP firmware and default rail assignments | Targets LPDDR4 memory (not DDR4); uses distinct power-up sequence and VDDIO/VDDQ mapping optimized for LPDDR4 timing | Select DBES only when implementing LPDDR4 memory interface; ETES is mandatory for DDR4 VTT and VDDQ compliance per i.MX8QM reference design |
| MC33PF8200DHES | Same PF8200 family, configured for i.MX8QM DDR4 PMIC2 role; differs in OTP safety settings and SWx phase assignment defaults | Designed as secondary PMIC in dual-PMIC DDR4 configurations; lacks full VTT termination on SW6 and reduced LDO flexibility vs. ETES | ETES serves as primary DDR4 PMIC1 with full feature set; DHES is supplementary - not drop-in replaceable due to OTP and pin-function differences |
Compared with MC33PF8200DBES and MC33PF8200DHES, the MC33PF8200ETES uniquely provides factory-programmed DDR4 VTT termination, full 7-buck + 4-LDO resource allocation, and OTP-locked PMIC1 sequencing - making it the sole qualified option for i.MX8QM DDR4 memory subsystems requiring ASIL B compliance and single-PMIC integration.
Availability
MC33PF8200ETES is available at Aetrix Electronics and suitable for automotive infotainment, ADAS vision processing, and industrial edge gateways requiring stable component supply, long-term lifecycle support, and ASIL B-certified power management.
Supply support for MC33PF8200ETES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and associated power architectures.
The PF8200 product line was engineered specifically to deliver ASIL B-compliant, highly integrated power management for NXP's i.MX 8 and S32x processor families - enabling simplified, robust, and safety-certifiable power subsystems in automotive and mission-critical embedded systems.
FAQ
What is the primary application target for the MC33PF8200ETES?
The MC33PF8200ETES is factory-configured as the DDR4 memory PMIC1 for NXP i.MX8QM processors. It delivers VDDQ, VTT, and auxiliary rails with ASIL B safety monitoring, OTP-locked sequencing, and quad-phase capability - directly supporting the i.MX8QM DDR4 memory subsystem per NXP reference designs and application notes.
Does the MC33PF8200ETES support VTT termination for DDR4 memory?
Yes, the MC33PF8200ETES supports VTT termination mode on SW6, enabling direct DDR4 VTT tracking without external components. This function is enabled and calibrated in OTP and is a defining feature distinguishing ETES from other PF8200 variants like DBES (LPDDR4) or DHES (DDR4 PMIC2).
What safety certifications apply to the MC33PF8200ETES?
The MC33PF8200ETES is designed and qualified to meet ASIL B requirements per ISO 26262. It includes independent voltage/thermal monitors, ABIST self-test, fail-safe output (FSOB), watchdog with programmable counter, and CRC-protected I²C writes - all documented in the PF8100/PF8200 Rev. 13 datasheet.
Can the MC33PF8200ETES be used with processors other than i.MX8QM?
While the MC33PF8200ETES OTP is optimized for i.MX8QM DDR4, the underlying PF8200 silicon supports other NXP processors (e.g., S32V234, LS1043A) and select non-NXP SoCs. However, custom OTP programming and validation would be required - the ETES variant itself is intended exclusively for i.MX8QM DDR4 PMIC1 use.
What is the significance of the "ETES" suffix in MC33PF8200ETES?
The "ETES" suffix denotes an automotive-grade, dimple wettable flank HVQFN56 package (SOT684-29(D)) with OTP pre-programmed for i.MX8QM DDR4 memory PMIC1 functionality. It indicates ASIL B qualification, factory-set VDDQ/VTT parameters, and compatibility with NXP's MC33PF8200ET.zip configuration files and reference designs.
MC33PF8200ETES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200ETES FAQ
1.How can I place an order for MC33PF8200ETES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200ETES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200ETES reliable?
The price and inventory of MC33PF8200ETES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200ETES is usually 5 days.
3.What payment methods are accepted for MC33PF8200ETES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200ETES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200ETES?
MC33PF8200ETES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200ETES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200ETES?
For technical support, including MC33PF8200ETES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200ETES requirements.
6.How does Aetrix verify that MC33PF8200ETES is sourced from the original manufacturer or authorized distributors?
All MC33PF8200ETES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200ETES meets industry standards.
7.What is the process for return or replacement of MC33PF8200ETES?
All MC33PF8200ETES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200ETES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200ETES part is unused and in its original packaging.
Return procedure for MC33PF8200ETES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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