My Inquiry
My Account
NXP Semiconductors MC33PF8200ETESR2
- Part No.:
- MC33PF8200ETESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8200ETESR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX8 PRE-PR
- Quantity:
- Payment:
- Shipping:
Inventory:3,104
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC33PF8200ETESR2 from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for i.MX8QM-based DDR4 memory PMIC1 applications. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B safety monitoring circuitry. Its OTP-configurable startup sequence and 3.4 MHz I²C interface enable precise system-level power control in infotainment and ADAS platforms.
For engineers reviewing the MC33PF8200ETESR2 datasheet, MC33PF8200ETESR2 pinout, MC33PF8200ETESR2 application, or MC33PF8200ETESR2 equivalent, this page delivers verified technical context, validated pin functions, confirmed automotive safety compliance (ASIL B), exact regulator output ranges and current ratings, and real-world use cases in i.MX8QM DDR4 memory subsystems - all derived from NXP's official PF8100/PF8200 Rev. 13 product data sheet.
Technical Context
The MC33PF8200ETESR2 implements a dual-domain architecture: a high-precision analog regulation core with seven synchronous buck converters (SW1–SW7) and four P-type LDOs, plus a safety-critical digital state machine supporting ASIL B compliance. Its 24-channel analog multiplexer enables real-time voltage/temperature diagnostics across all regulated outputs.
It features programmable dynamic voltage scaling on SW1–SW6, triple-phase (7.5 A) and quad-phase (10 A) configurations for CPU cores, VTT termination mode on SW6, and fail-safe operation via FSOB assertion during critical faults. Startup is governed by OTP-stored sequencing, while runtime reconfiguration uses 3.4 MHz I²C with CRC protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 12 total: 7 buck (SW1–SW7) + 4 LDO (LDO1–LDO4) + VSNVS RTC supply |
| Buck Output Range | SW1–SW6: 0.4 V to 1.8 V (6.25 mV steps); SW7: 1.0 V to 4.1 V |
| Max Output Current | 2.5 A per buck; 400 mA per LDO; 10 mA VSNVS |
| I²C Interface Speed | Up to 3.4 MHz - enables fast runtime voltage tuning and fault reporting |
| Safety Certification | Automotive ASIL B compliant with independent voltage/thermal monitoring, ABIST, and fail-safe FSOB output |
| Input Voltage Range | VIN: 2.7 V to 5.5 V; LICELL: up to 4.2 V; supports coin-cell backup for RTC |
| Operating Temperature | −40 °C to +105 °C ambient - qualified for automotive under-hood and infotainment environments |
Pinout & Package
HVQFN56 package: 8 mm × 8 mm × 0.9 mm body, 0.5 mm pitch, thermal-enhanced wettable flank design (SOT684-29(D)), EPAD connected to ground for thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable closed-loop regulation of each buck output; support ±1.5 % (SW1–SW6) or ±2 % (SW7) accuracy |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Deliver 1.5–5.0 V at 400 mA each; configurable as load switches for peripheral power gating |
| VSNVS | RTC supply output | Provides 1.8 V / 3.0 V / 3.3 V at 10 mA from VIN or coin cell (LICELL), ensuring persistent memory retention |
| FSOB | Fail-Safe Output | Open-drain signal asserted LOW during critical faults (e.g., overtemperature, UV/OV, self-test failure) per ASIL B requirements |
| SCL/SDA | I²C interface | Support 3.4 MHz high-speed communication for runtime configuration, monitoring, and safety register access |
| RESETBMCU | MCU reset output | Open-drain active-low reset signal triggered by internal watchdog timeout or power-on reset conditions |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable startup | Eliminates external resistor networks for voltage setpoints and sequencing - reduces BOM count and layout complexity |
| Dual-phase & triple-phase capability | SW1/SW2, SW3/SW4, SW5/SW6 can pair for higher current; SW1–SW3 support 7.5 A triple-phase for CPU cores |
| VTT termination on SW6 | Enables direct DDR4 memory VTT supply without external components - simplifies high-speed memory interface design |
| 24-channel analog multiplexer | Allows system-level diagnostic sampling of all regulator outputs, die temperature, and external nodes via single ADC input |
| ABIST and CRC-protected registers | Ensures functional safety integrity through built-in self-test and error-detecting I²C writes per ISO 26262 requirements |
Applications
| Automotive Infotainment Head Unit | i.MX8QM DDR4 Memory Subsystem |
|---|---|
Use Scenario: Central display unit with multi-core CPU, GPU, and LPDDR4/DDR4 memory running Android Automotive OS. IC Role / Device Role / Timing Role: Primary PMIC supplying CPU cores (SW1–SW3), GPU (SW4), DDR4 VDD/VDDQ (SW5/SW6), and RTC (VSNVS). Use Value: OTP-programmed power-up sequence ensures deterministic boot timing; ASIL B monitoring prevents silent failures during navigation or voice command execution. |
Use Scenario: High-bandwidth DDR4 memory interface requiring precise VDD (1.2 V), VDDQ (1.2 V), and VTT (0.6 V) rails with tight transient response. IC Role / Device Role / Timing Role: Dedicated DDR4 PMIC1 delivering SW5 (VDD), SW6 (VDDQ + VTT), and LDOs for memory I/O buffers. Use Value: Integrated VTT termination and 2.5 A per rail support full-speed DDR4-3200 operation without external termination resistors or discrete regulators. |
| Advanced Driver Assistance Systems (ADAS) | Automotive Digital Cockpit |
Use Scenario: S32V234-based vision processing module with multiple camera inputs and neural network acceleration. IC Role / Device Role / Timing Role: Power manager for S32V234 SoC, providing core, memory, and peripheral rails with safety-critical monitoring. Use Value: Fail-safe FSOB output triggers system shutdown upon thermal runaway or voltage fault - meets ASIL B hardware fault tolerance requirements. |
Use Scenario: Multi-display cluster with instrument panel, HUD, and rear-seat entertainment, all driven by i.MX8QM. IC Role / Device Role / Timing Role: Centralized power controller managing 12 independent rails across three domains: CPU, GPU, and display interfaces. Use Value: 3.4 MHz I²C allows dynamic voltage scaling during display brightness transitions, reducing power consumption without compromising responsiveness. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DBES | Same PF8200 family, configured for i.MX8QM LPDDR4 PMIC2; differs in OTP firmware, default rail assignments, and memory interface optimization | Targeted at LPDDR4 memory subsystems rather than DDR4; lacks VTT support on SW6 | Select when designing LPDDR4-based i.MX8QM systems where VTT termination is not required |
| MC33PF8200DHES | Same PF8200 family, configured for i.MX8QM DDR4 PMIC2; shares identical buck/LDO specs but uses different OTP mapping for rail sequencing and safety thresholds | Designed as secondary PMIC in dual-PMIC DDR4 architectures; requires coordination with primary PMIC (e.g., MC33PF8200ETESR2) via SYNCIN/SYNCOUT | Choose for split-rail DDR4 designs needing distributed power control and synchronized switching |
Compared with MC33PF8200DBES and MC33PF8200DHES, the MC33PF8200ETESR2 is uniquely optimized as the primary DDR4 PMIC1 for i.MX8QM - offering factory-programmed VTT termination on SW6, dedicated DDR4 rail sequencing, and integrated safety logic calibrated for main memory domain monitoring.
Availability
MC33PF8200ETESR2 is available at Aetrix Electronics and suitable for automotive infotainment head units, i.MX8QM-based digital cockpits, and ADAS vision processing modules requiring stable component supply, ASIL B compliance, and long-term lifecycle support.
Supply support for MC33PF8200ETESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in processor-optimized power management.
The PF8200 product line was engineered specifically to deliver ASIL B-compliant, OTP-configurable power sequencing for NXP's i.MX 8 and S32x application processors - enabling robust, low-BOM, safety-certified power architectures in demanding automotive environments.
FAQ
What is the primary application target for MC33PF8200ETESR2?
The MC33PF8200ETESR2 is specifically configured as the DDR4 memory PMIC1 for i.MX8QM processors, delivering VDD, VDDQ, and VTT rails with factory-programmed sequencing and ASIL B safety monitoring. Its OTP image matches the MC33PF8200ET.zip reference design, making it ideal for automotive infotainment and digital cockpit systems requiring DDR4-3200 support.
Does MC33PF8200ETESR2 support VTT termination for DDR4 memory?
Yes, MC33PF8200ETESR2 supports VTT termination on SW6, enabling direct DDR4 memory bus termination without external components. This capability is confirmed in the PF8100/PF8200 datasheet Section 12.1 and Table 9, where SW6 is explicitly defined as "VTT/0.4 V to 1.8 V, 2.5 A" - a key differentiator for DDR4-optimized variants like MC33PF8200ETESR2.
What safety certifications does MC33PF8200ETESR2 meet?
MC33PF8200ETESR2 is certified to ASIL B per ISO 26262, with integrated safety features including independent voltage/thermal monitors, analog built-in self-test (ABIST), CRC-protected I²C registers, fail-safe FSOB output, and programmable fault counters. These capabilities are documented in Sections 2, 12.1, and Table 10 of the official datasheet.
How is the MC33PF8200ETESR2 configured at startup?
MC33PF8200ETESR2 uses one-time programmable (OTP) memory to store startup configuration - including output voltages, power-up/down sequencing, safety thresholds, and default I²C register states. This eliminates external configuration components and ensures repeatable, deterministic boot behavior. The OTP image for MC33PF8200ETESR2 is provided in the MC33PF8200ET.zip support package.
What package type and thermal characteristics apply to MC33PF8200ETESR2?
MC33PF8200ETESR2 uses the HVQFN56 package (SOT684-29(D)) - 8 mm × 8 mm × 0.9 mm with dimple wettable flanks. Its thermal resistance is RθJA = 22 °C/W on a 4-layer board (JEDEC 2s2p), RθJC = 0.6 °C/W to the bottom case, and RθJB = 11 °C/W to the PCB - enabling reliable operation up to +105 °C ambient with proper layout and copper pour.
MC33PF8200ETESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8200ETESR2 FAQ
1.How can I place an order for MC33PF8200ETESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8200ETESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8200ETESR2 reliable?
The price and inventory of MC33PF8200ETESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8200ETESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF8200ETESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8200ETESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8200ETESR2?
MC33PF8200ETESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8200ETESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8200ETESR2?
For technical support, including MC33PF8200ETESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8200ETESR2 requirements.
6.How does Aetrix verify that MC33PF8200ETESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF8200ETESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8200ETESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF8200ETESR2?
All MC33PF8200ETESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8200ETESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8200ETESR2 part is unused and in its original packaging.
Return procedure for MC33PF8200ETESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC33PF8200ETESR2 Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
