My Inquiry
My Account
NXP Semiconductors MC33VR5500V0KS
- Part No.:
- MC33VR5500V0KS
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33VR5500V0KS.pdf
- Description:
- 1 BUCK, QM, INFOTAINMENT
- Quantity:
- Payment:
- Shipping:
Inventory:2,767
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC33VR5500V0KS from NXP Semiconductors is an AEC-Q100 Grade 1 automotive high-voltage PMIC for radio, V2X, and infotainment systems. It integrates a 60 V input VPRE synchronous buck controller (up to 10 A peak), three low-voltage synchronous buck converters (BUCK1–BUCK3, each up to 3.6 A peak), a boost converter (1.5 A peak), and two LDOs (400 mA DC). It supports I²C configuration, power sequencing via OTP, and EMC-optimized frequency synchronization.
For engineers reviewing the MC33VR5500V0KS datasheet, MC33VR5500V0KS pinout, MC33VR5500V0KS application, or MC33VR5500V0KS equivalent, this page delivers verified technical context, validated pin functions, confirmed automotive-grade operating parameters (−40 °C to 125 °C), and real-world substitution guidance for multi-rail power management in safety-critical embedded systems.
Technical Context
The MC33VR5500V0KS implements dual-state machine architecture: a main state machine managing power-up/down sequencing across seven configurable slots, and a fail-safe state machine handling voltage monitoring, PGOOD/RSTB assertion, and deep-fail-safe (DEEP-FS) recovery. Power sequencing starts with VPRE, followed by BOOST, then BUCK1/BUCK2/BUCK3/LDO1/LDO2 per OTP-defined slot timing (250 µs or 1 ms intervals).
It features external frequency synchronization (FIN/FOUT), spread-spectrum modulation, slew-rate control, and manual frequency tuning for EMC compliance. The device supports multi-phase operation between BUCK1 and BUCK2 (7.2 A peak on one rail), static voltage scaling (SVS) for MCU core supply, and debug-mode OTP emulation via DBG pin and I²C address 0x20/0x21.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | −0.3 V to 60 V on VSUP1/VSUP2; validated for 58 V load dump without external protection. |
| VPRE Output Capability | Configurable output; supports external MOSFETs; peak current up to 10 A; switching frequencies include 455 kHz (36 V max continuous) or 2.2 MHz (18 V max continuous). |
| BUCK1–BUCK3 Output | Each integrated synchronous buck delivers up to 3.6 A peak; BUCK1 includes SVS for MCU core; BUCK1+BUCK2 support multi-phase operation (7.2 A peak). |
| LDO Outputs | Two linear regulators: LDO1 and LDO2, each configurable up to 400 mA DC output; dedicated for MCU I/O and ADC supply. |
| Quiescent Current | 10 µA typical in OFF mode (TA < 85 °C); 15 µA max at 125 °C - enables ultra-low-power battery-off operation. |
| Operating Temperature | −40 °C to +125 °C ambient (AEC-Q100 Grade 1); junction temperature rated to 150 °C. |
| Package Thermal Resistance | RθJA = 23 °C/W on 2s6p PCB; RθJC_BOT = 1 °C/W - optimized for thermally demanding automotive under-hood environments. |
Pinout & Package
MC33VR5500V0KS is housed in a HPQFN56 (SOT684-23) thermally enhanced wettable-flank package with exposed thermal pad (EP). Pin count: 56 signal pins + 1 EP (pin 57). Package dimensions: 8 mm × 8 mm × 0.85 mm (max height).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP1 / VSUP2 | High-voltage input supply | Main 60 V-tolerant power inputs; require external reverse-battery diodes. |
| VPRE_SW / PRE_GHS / PRE_GLS / PRE_BOOT / PRE_FB | VPRE controller interface | Drive external high-side/low-side MOSFETs; feedback, bootstrap, and compensation nodes for programmable high-voltage buck stage. |
| BUCK1_SW / BUCK1_FB / BUCK1_IN | Integrated synchronous buck 1 | Switching node, feedback, and input for MCU core supply; supports SVS and soft-start. |
| BUCK2_SW / BUCK2_FB / BUCK2_IN | Integrated synchronous buck 2 | Switching node, feedback, and input; configurable for multi-phase operation with BUCK1. |
| BUCK3_SW / BUCK3_FB / BUCK3_IN | Integrated synchronous buck 3 | Switching node, feedback, and input; dedicated for peripherals or DDR termination rails. |
| BOOST_LS / VBOOST | Integrated boost converter | Internal low-side switch driver and feedback input for configurable boost output (e.g., USB PHY supply). |
| LDO1 / LDO2 / LDO1_IN | Linear regulator outputs & input | LDO1/LDO2 deliver up to 400 mA each; LDO1_IN accepts up to 6.5 V input for analog/IO rail conditioning. |
| SCL / SDA / PSYNC / FIN / FOUT | Digital control & sync interface | I²C bus (0x20/0x21 in debug mode); power synchronization I/O; frequency sync input/output for system-level EMC tuning. |
| WAKE1 / WAKE2 / INTB / PGOOD / RSTB | System control & status | Wake-up detection (with external resistor), interrupt output, active-low power-good and reset signals - all pulled to VDDIO. |
| VMON1 / VCOREMON / AMUX | Analog monitoring | Voltage monitoring input; dedicated VCORE feedback path; multiplexed analog output for MCU ADC sampling of internal rails. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-programmable power sequencing | Seven configurable startup slots with 250 µs or 1 ms inter-slot delay; supports custom ramp-up order for BUCK/LDO combinations. |
| Multi-phase BUCK1+BUCK2 operation | Extends single-rail current capability to 7.2 A peak - eliminates need for external current-sharing circuitry in high-core-power MCU designs. |
| EMC optimization suite | Includes frequency synchronization (FIN/FOUT), spread spectrum, slew-rate control, and manual frequency tuning - reduces conducted/radiated emissions in dense RF environments. |
| Fail-safe state machine | Dedicated hardware monitor for VSUP, VBOS, VPRE, and regulator overtemperature; asserts PGOOD/RSTB independently of main logic for ASIL-B readiness. |
| Debug-mode OTP emulation | Enables engineering-stage configuration changes via I²C (0x20/0x21) and DBG pin; supports full register read/write and soft-start parameter adjustment before final OTP programming. |
| Ultra-low OFF-mode current | 10 µA typical sleep current enables >10-year battery standby life in always-on automotive modules - critical for telematics and V2X gateways. |
Applications
| Automotive Radio Head Unit | V2X Communication Module |
|---|---|
|
Use Scenario: Power management for AM/FM/DAB tuner, DSP, audio codec, and display interface in head unit. IC Role / Device Role / Timing Role: Primary PMIC supplying VPRE (12 V rail), BUCK1 (1.2 V MCU core), BUCK2 (3.3 V peripherals), BUCK3 (1.8 V DDR), LDO1 (1.8 V ADC), LDO2 (3.3 V I/O). Use Value: Single-chip solution replaces 6 discrete regulators; OTP sequencing ensures correct power-up order; 60 V tolerance handles jump-start and load-dump transients. |
Use Scenario: Power delivery for DSRC/WAVE or C-V2X modem, GNSS receiver, and secure element in roadside or vehicle-mounted units. IC Role / Device Role / Timing Role: High-reliability power source with fail-safe monitoring; VPRE powers external PA; BUCK1 supplies application processor; LDO2 feeds crypto IC. Use Value: AEC-Q100 Grade 1 qualification and DEEP-FS mode ensure functional safety during voltage faults; PSYNC enables synchronized startup with companion baseband PMIC. |
| Infotainment Application Processor | Automotive Display Cluster |
|
Use Scenario: Core power for quad-core ARM SoC (e.g., i.MX8), GPU, video encoder, and MIPI-CSI/DSI interfaces. IC Role / Device Role / Timing Role: Configurable BUCK1 (SVS-enabled 0.8–1.4 V core), BUCK2 (multi-phase 3.3 V), BUCK3 (1.1 V memory), BOOST (5 V USB), LDO1 (1.8 V SerDes). Use Value: SVS dynamically scales MCU voltage/frequency; multi-phase BUCK1+BUCK2 delivers 7.2 A peak for burst workloads; AMUX enables real-time rail health monitoring. |
Use Scenario: Power system for TFT-LCD driver, touch controller, HUD illumination, and CAN gateway in digital instrument clusters. IC Role / Device Role / Timing Role: VPRE (5 V backlight), BUCK1 (1.1 V GPU), BUCK2 (3.3 V CAN transceiver), LDO1 (2.5 V sensor interface), LDO2 (5 V display bias). Use Value: 125 °C ambient rating ensures reliability behind dashboard; OFF-mode 10 µA current prevents battery drain during vehicle sleep; PGOOD/RSTB enable safe boot sequence. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-rail automotive PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPQ4333-AEC1 | Single 3.5 A buck (no VPRE controller, no LDOs, no I²C); 40 V max input; no OTP sequencing. | Limited to low-complexity MCU cores; lacks fail-safe monitoring, multi-phase, or boost capability. | Select only for cost-sensitive, single-rail applications where full VR5500 feature set is unnecessary. |
| TPS659413-Q1 | 6-buck + 3-LDO PMIC; 5.5 V max input; no high-voltage VPRE stage; supports ASIL-D diagnostics. | Requires external HV pre-regulator for 12/24 V systems; better suited for domain controllers than front-end radio/V2X power. | Prefer when ASIL-D compliance is mandatory and system input is regulated ≤5.5 V; not drop-in for direct battery connection. |
Compared with MPQ4333-AEC1 and TPS659413-Q1, MC33VR5500V0KS uniquely integrates a 60 V VPRE controller, multi-phase BUCK capability, and fail-safe state machine - enabling single-chip power for unregulated automotive battery inputs while meeting ASIL-B requirements for radio and V2X subsystems.
Availability
MC33VR5500V0KS is available at Aetrix Electronics and suitable for automotive radio, V2X communication, and infotainment applications requiring stable component supply, AEC-Q100 Grade 1 qualification, and long-term lifecycle support.
Supply support for MC33VR5500V0KS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, with deep expertise in power management, security, and connectivity solutions.
The VR5500 product line was designed specifically for high-voltage automotive infotainment and telematics systems, integrating robust power conversion, fail-safe monitoring, and flexible configuration to simplify design of ASIL-B compliant modules.
FAQ
What is the maximum input voltage rating for MC33VR5500V0KS?
The MC33VR5500V0KS supports a maximum DC input voltage of 60 V on VSUP1 and VSUP2 pins. It has been validated to sustain 58 V load dump events without external protection and operates continuously at 36 V (with VPRE at 455 kHz) or 18 V (with VPRE at 2.2 MHz), meeting stringent automotive transient requirements.
Does MC33VR5500V0KS support multi-phase operation between its buck converters?
Yes, MC33VR5500V0KS supports multi-phase operation between BUCK1 and BUCK2, extending the combined current capability to 7.2 A peak on a single output rail. This is enabled via OTP configuration and synchronized switching, eliminating the need for external current-sharing components in high-power MCU core supply designs.
How does the fail-safe state machine in MC33VR5500V0KS operate independently?
The MC33VR5500V0KS incorporates a dedicated fail-safe state machine that monitors VSUP, VBOS, VPRE, and regulator overtemperature conditions. It asserts PGOOD and RSTB independently of the main state machine - ensuring reliable fault response even if the primary logic is compromised, fulfilling ASIL-B functional safety requirements.
Can MC33VR5500V0KS be configured without OTP programming?
Yes, MC33VR5500V0KS (V0 suffix) ships unprogrammed, allowing full configuration via I²C during development. Debug mode (enabled by DBG pin at 4.5–5.5 V) provides access to registers at fixed addresses 0x20/0x21 for OTP emulation, soft-start tuning, and sequencing validation before final one-time programming.
What thermal performance can be expected from MC33VR5500V0KS in a production layout?
In a 2s6p PCB layout, MC33VR5500V0KS achieves RθJA = 23 °C/W and RθJC_BOT = 1 °C/W. With proper thermal pad soldering to a 4-layer board's internal ground plane, it sustains full 125 °C ambient operation while delivering >5 W total output power - validated per JEDEC JESD51-2/8 standards.
MC33VR5500V0KS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- SMPS Start-Up
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33VR5500V0KS FAQ
1.How can I place an order for MC33VR5500V0KS through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33VR5500V0KS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33VR5500V0KS reliable?
The price and inventory of MC33VR5500V0KS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33VR5500V0KS is usually 5 days.
3.What payment methods are accepted for MC33VR5500V0KS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33VR5500V0KS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33VR5500V0KS?
MC33VR5500V0KS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33VR5500V0KS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33VR5500V0KS?
For technical support, including MC33VR5500V0KS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33VR5500V0KS requirements.
6.How does Aetrix verify that MC33VR5500V0KS is sourced from the original manufacturer or authorized distributors?
All MC33VR5500V0KS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33VR5500V0KS meets industry standards.
7.What is the process for return or replacement of MC33VR5500V0KS?
All MC33VR5500V0KS units undergo pre-shipment inspection (PSI). If there is an issue with MC33VR5500V0KS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33VR5500V0KS part is unused and in its original packaging.
Return procedure for MC33VR5500V0KS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC33VR5500V0KS Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
