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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Power Management - Specialized

NXP Semiconductors MC33VR5500V0KSR2

Name: MC33VR5500V0KSR2
Brand: NXP Semiconductors
SKU: MC33VR5500V0KSR2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MC33VR5500V0KSR2

Manufacturer:: NXP Semiconductors

Category:: Power Management - Specialized

Package:: 56-VFQFN Exposed Pad

Datasheet:: MC33VR5500V0KSR2.pdf

Description:: 1 BUCK, QM, INFOTAINMENT

Quantity:: RFQ Add To RFQ list

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Product details

Overview

MC33VR5500V0KSR2 from NXP Semiconductors is an AEC-Q100 Grade 1 automotive high-voltage PMIC with six regulated outputs: one external VPRE buck controller (60 V max input), three integrated synchronous buck converters (BUCK1–BUCK3, up to 3.6 A each), one boost converter (1.5 A peak), and two LDOs (400 mA each). It supports I²C configuration, power sequencing via OTP, and EMC-optimized frequency synchronization - deployed in radio, V2X, and infotainment head units.

For engineers reviewing the MC33VR5500V0KSR2 datasheet, MC33VR5500V0KSR2 pinout, MC33VR5500V0KSR2 application, or MC33VR5500V0KSR2 equivalent, key selection criteria include its 60 V input tolerance, multi-phase BUCK1+BUCK2 capability (7.2 A peak), OFF-mode sleep current (10 µA typ), AEC-Q100 qualification, and HPQFN56 thermal performance (RθJA = 23 °C/W on 2s6p board).

Technical Context

The MC33VR5500V0KSR2 integrates dual state machines: a main power management engine handling startup sequencing, regulator enable/disable, and I²C control; and a fail-safe state machine independently monitoring VBOS, VPRE, and voltage rails to assert RSTB/PGOOD on fault. Power-up begins with VPRE (external buck controller), followed by BOOST, then seven configurable OTP slots for BUCK1–BUCK3, LDO1, and LDO2 - with slot delays set to 250 µs or 1 ms.

It implements hardware-level safety features including three dedicated voltage monitors (VMON1, VCOREMON, VBOS), thermal shutdown per regulator (configurable via OTP), and deep fail-safe (DEEP-FS) mode triggered by VPRE feedback overvoltage or regulator overtemperature. Debug mode entry requires DBG = 4.5–5.5 V with synchronized WAKE1/WAKE2 assertion after VSUP > VSUP_UVH.

Key Specifications

Parameter	Value and Actual Design Meaning
Input Voltage Range	−0.3 V to 60 V on VSUP1/VSUP2 - supports 12 V/24 V automotive systems including 48 V jump-start and 58 V load dump without external protection.
VPRE Controller Output	Configurable output; drives external high-side/low-side MOSFETs; supports up to 10 A peak current - enables flexible high-power pre-regulation before downstream SMPS.
Integrated Buck Outputs	BUCK1 (MCU core, SVS-capable, 3.6 A), BUCK2 (multi-phase with BUCK1, 7.2 A combined), BUCK3 (3.6 A) - all synchronous, with soft-start and current limiting.
Boost & LDO Outputs	BOOST: 1.5 A peak, configurable output; LDO1/LDO2: 400 mA each, programmable voltage - supplies MCU I/Os, ADC reference, and physical layer interfaces.
Quiescent Current	10 µA typical in OFF mode (TA < 85 °C) - enables ultra-low-power battery keep-alive for infotainment systems during vehicle sleep.
Thermal Resistance	RθJA = 23 °C/W (2s6p PCB); RθJC_BOT = 1 °C/W - ensures reliable operation at TJ ≤ 150 °C in under-hood environments.
AEC-Q100 Qualification	Grade 1 (−40 °C to +125 °C ambient), MSL3 - validated for automotive front-end electronics requiring long-term reliability and thermal robustness.

Pinout & Package

MC33VR5500V0KSR2 is housed in a thermally enhanced HPQFN56 package (SOT684-23) with wettable flanks and exposed thermal pad (EP) connected to internal GND planes of BUCK1/BUCK2/BUCK3 low-side switches.

Pin/Terminal	Circuit Role	Design Meaning
VSUP1 / VSUP2	Main high-voltage supply inputs	Accept 60 V DC max; require external reverse-battery diodes; power all internal regulators and bias circuits.
VPRE_SW / PRE_GHS / PRE_GLS	VPRE gate drive and switching node	Drive external high-side/low-side MOSFETs; PRE_SW connects to external inductor; PRE_GHS/PRE_GLS are gate outputs referenced to PRE_BOOT.
BUCK1_SW / BUCK2_SW / BUCK3_SW	Integrated buck switching nodes	Connect directly to external inductors; each has internal synchronous rectification and current-sense capability.
PGOOD / RSTB	Power-good and reset outputs	Active-low open-drain outputs; require external pull-up to VDDIO; signal system readiness and initiate MCU reset on rail fault.
SCL / SDA	I²C interface	Standard bidirectional bus (100 kHz / 400 kHz); CRC-protected writes; address 0x20 (main), 0x21 (fail-safe) in debug mode.
WAKE1 / WAKE2	Wake-up inputs	Analog/digital inputs with internal 2 MΩ pull-down; trigger exit from STANDBY/OFF modes; require external series resistor if used as global wake pins.
PSYNC	Power synchronization I/O	Enables coordinated startup/shutdown with second VR5500 or external PMIC; pulled up to VBOS to enable sync handshake.
EP (exposed pad)	Thermal and electrical ground	Must be soldered to PCB GND plane; provides primary thermal path and low-inductance return for BUCK1/BUCK2/BUCK3 low-side switches.

Key Features

Feature	Design Value
Multi-phase BUCK1+BUCK2 operation	Extends single-rail current capability to 7.2 A peak - supports high-performance MCU cores requiring dynamic voltage scaling and burst-mode loads.
OTP-programmable power sequencing	Seven configurable startup slots with 250 µs or 1 ms inter-slot delay - enables precise timing alignment across DDR, peripherals, and analog subsystems.
EMC optimization suite	Includes frequency synchronization (FIN/FOUT), spread-spectrum modulation, slew-rate control, and manual tuning - reduces conducted/radiated emissions in dense RF environments.
Dual-state-machine safety architecture	Independent fail-safe logic monitors critical rails (VBOS, VPRE, VCOREMON) and asserts PGOOD/RSTB without software intervention - meets ASIL-B functional safety requirements.
Debug-mode OTP emulation	Allows real-time register override and OTP configuration testing via I²C (address 0x20/0x21) during engineering development - eliminates mask respins for sequencing tuning.
Low-noise LDO pair with SVS	LDO1/LDO2 deliver 400 mA with <10 µV RMS noise; BUCK1 includes static voltage scaling (SVS) for adaptive core voltage control - essential for automotive SoCs.

Applications

Automotive Radio Head Unit	V2X Communication Module
Use Scenario: Compact AM/FM/DAB receiver with digital audio processing and Bluetooth connectivity in 12 V vehicle architecture. IC Role / Device Role: Primary power manager supplying VPRE (12 V → 5 V), BUCK1 (1.2 V @ 3.6 A for DSP core), BUCK2 (3.3 V @ 3.6 A for RF transceiver), LDO1 (1.8 V for ADC), and LDO2 (3.3 V for PHY). Use Value: Single-chip solution replaces discrete buck controllers and LDOs; 60 V input withstands load dump; OFF-mode 10 µA enables always-on wake detection.	Use Scenario: DSRC or C-V2X roadside unit requiring dual-band RF operation, GNSS timing, and CAN/Ethernet interface in 24 V commercial vehicle. IC Role / Device Role: Central PMIC delivering sequenced 1.1 V (BUCK1), 1.8 V (BUCK2), 3.3 V (BUCK3), 5 V (BOOST), and 1.2 V (LDO1) to SoC, RF front-end, and interface ICs. Use Value: PSYNC pin synchronizes with companion PMIC for deterministic multi-rail startup; FIN/FOUT reduces EMI coupling between RF and digital sections.
Infotainment Display Control	ADAS Domain Controller Auxiliary Supply
Use Scenario: 10.25″ LCD cluster with touch controller, GPU acceleration, and audio amplifier - powered from vehicle battery with thermal constraints. IC Role / Device Role: Supplies BUCK1 (1.0 V @ 3.6 A for GPU), BUCK2 (1.8 V @ 3.6 A for DDR), BUCK3 (3.3 V @ 3.6 A for display interface), and LDO2 (5.0 V for backlight driver). Use Value: Multi-phase BUCK1+BUCK2 delivers 7.2 A for GPU burst loads; thermal resistance (RθJA = 23 °C/W) sustains 125 °C ambient operation.	Use Scenario: Secondary power domain for sensor fusion processor, camera ISP, and Ethernet switch in zonal architecture - co-located with main ADAS SoC. IC Role / Device Role: Provides isolated 1.8 V (LDO1), 3.3 V (LDO2), and 5.0 V (BOOST) to peripheral ICs while BUCK1–BUCK3 power primary compute rails. Use Value: Fail-safe state machine independently supervises auxiliary rails; VMON1/VCOREMON inputs enable custom voltage margining for sensor signal chains.

Automotive Radio Head Unit

V2X Communication Module

Use Scenario: Compact AM/FM/DAB receiver with digital audio processing and Bluetooth connectivity in 12 V vehicle architecture.

IC Role / Device Role: Primary power manager supplying VPRE (12 V → 5 V), BUCK1 (1.2 V @ 3.6 A for DSP core), BUCK2 (3.3 V @ 3.6 A for RF transceiver), LDO1 (1.8 V for ADC), and LDO2 (3.3 V for PHY).

Use Value: Single-chip solution replaces discrete buck controllers and LDOs; 60 V input withstands load dump; OFF-mode 10 µA enables always-on wake detection.

Use Scenario: DSRC or C-V2X roadside unit requiring dual-band RF operation, GNSS timing, and CAN/Ethernet interface in 24 V commercial vehicle.

IC Role / Device Role: Central PMIC delivering sequenced 1.1 V (BUCK1), 1.8 V (BUCK2), 3.3 V (BUCK3), 5 V (BOOST), and 1.2 V (LDO1) to SoC, RF front-end, and interface ICs.

Use Value: PSYNC pin synchronizes with companion PMIC for deterministic multi-rail startup; FIN/FOUT reduces EMI coupling between RF and digital sections.

Infotainment Display Control

ADAS Domain Controller Auxiliary Supply

Use Scenario: 10.25″ LCD cluster with touch controller, GPU acceleration, and audio amplifier - powered from vehicle battery with thermal constraints.

IC Role / Device Role: Supplies BUCK1 (1.0 V @ 3.6 A for GPU), BUCK2 (1.8 V @ 3.6 A for DDR), BUCK3 (3.3 V @ 3.6 A for display interface), and LDO2 (5.0 V for backlight driver).

Use Value: Multi-phase BUCK1+BUCK2 delivers 7.2 A for GPU burst loads; thermal resistance (RθJA = 23 °C/W) sustains 125 °C ambient operation.

Use Scenario: Secondary power domain for sensor fusion processor, camera ISP, and Ethernet switch in zonal architecture - co-located with main ADAS SoC.

IC Role / Device Role: Provides isolated 1.8 V (LDO1), 3.3 V (LDO2), and 5.0 V (BOOST) to peripheral ICs while BUCK1–BUCK3 power primary compute rails.

Use Value: Fail-safe state machine independently supervises auxiliary rails; VMON1/VCOREMON inputs enable custom voltage margining for sensor signal chains.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multi-rail automotive PMIC applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MPQ4333-AEC1	Single 3.5 A buck (no VPRE controller, no boost, no LDOs); 40 V max input; no I²C or OTP sequencing.	Targeted at simpler MCU-only domains; lacks multi-output flexibility and fail-safe monitoring.	Select when only one high-current rail is needed and cost sensitivity outweighs configurability.
TPS659422-Q1	Four integrated bucks (up to 4 A), two LDOs, 3.6 V max input; requires external pre-regulator for 12 V/24 V; I²C + OTP support.	Requires external 60 V buck for front-end regulation; better suited for low-input-voltage domains like domain controllers with local 5 V supply.	Select when system already includes a high-voltage pre-regulator and prioritizes fine-grained rail control over input voltage range.

Compared with MPQ4333-AEC1 and TPS659422-Q1, MC33VR5500V0KSR2 uniquely integrates a 60 V VPRE controller, boost converter, and dual-state-machine safety - enabling complete front-end power management in radio/V2X without external pre-regulators or safety co-processors.

Availability

MC33VR5500V0KSR2 is available at Aetrix Electronics and suitable for automotive radio, V2X communication, and infotainment display applications requiring stable component supply, AEC-Q100 compliance, and long-term production continuity.

Supply support for MC33VR5500V0KSR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in automotive power management and functional safety.

The VR5500 product line was designed specifically for high-reliability automotive infotainment and telematics systems - integrating high-voltage resilience, multi-rail sequencing, and hardware-enforced fail-safe monitoring into a single HPQFN56 package.

FAQ

What is the maximum input voltage rating for MC33VR5500V0KSR2, and how does it handle load dump conditions?

MC33VR5500V0KSR2 supports up to 60 V DC on VSUP1/VSUP2 pins. It is validated to sustain 58 V load dump without external protection at room temperature and 48 V continuous operation for 15 minutes - meeting ISO 16750-2 requirements for 24 V systems. The device uses internal clamping and robust gate drivers to prevent latch-up or damage during transient overvoltage events.

Does MC33VR5500V0KSR2 support multi-phase operation, and which rails can be combined?

Yes, MC33VR5500V0KSR2 supports multi-phase operation between BUCK1 and BUCK2 - extending combined current capability to 7.2 A peak on a single output rail. This is enabled via OTP configuration and requires synchronized inductor placement and shared feedback. BUCK3 operates independently and is not phase-compatible with BUCK1 or BUCK2.

How is power sequencing controlled on MC33VR5500V0KSR2, and can it be modified after manufacturing?

Power sequencing on MC33VR5500V0KSR2 is defined by OTP programming with seven configurable startup slots (SLOT_0 to SLOT_6), each assignable to BUCK1–BUCK3, LDO1, or LDO2. Slot delays are fixed at 250 µs or 1 ms. While OTP is one-time programmable in production, MC33VR5500V0KSR2 supports debug-mode I²C emulation of OTP settings during engineering - allowing full sequencing validation before final programming.

What safety features does MC33VR5500V0KSR2 implement for automotive ASIL compliance?

MC33VR5500V0KSR2 implements a dual-state-machine architecture: the main state machine handles power control, while the independent fail-safe state machine continuously monitors VBOS, VPRE, and VCOREMON. It asserts PGOOD and RSTB on undervoltage/overvoltage faults, supports deep fail-safe (DEEP-FS) mode, and includes configurable thermal shutdown per regulator - collectively supporting ASIL-B system-level compliance when integrated per ISO 26262 guidelines.

Is MC33VR5500V0KSR2 pin-compatible with other VR5500 variants such as MC33VR5500V1ES?

Yes, MC33VR5500V0KSR2 shares identical HPQFN56 pinout and mechanical footprint with all VR5500 family members including MC33VR5500V1ES. The 'V0' suffix denotes a non-programmed OTP configuration - meaning default register values apply until configured via I²C or programmed OTP. Electrical behavior and pin functions are fully consistent across variants.

MC33VR5500V0KSR2 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 56-VFQFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Applications:: SMPS Start-Up

Current - Supply:: 15mA

Voltage - Supply:: 60V

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount, Wettable Flank

Supplier Device Package:: 56-HVQFN (8x8)

MC33VR5500V0KSR2 FAQ

1.How can I place an order for MC33VR5500V0KSR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for MC33VR5500V0KSR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC33VR5500V0KSR2 reliable?

The price and inventory of MC33VR5500V0KSR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33VR5500V0KSR2 is usually 5 days.

3.What payment methods are accepted for MC33VR5500V0KSR2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33VR5500V0KSR2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC33VR5500V0KSR2?

MC33VR5500V0KSR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC33VR5500V0KSR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC33VR5500V0KSR2?

For technical support, including MC33VR5500V0KSR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33VR5500V0KSR2 requirements.

6.How does Aetrix verify that MC33VR5500V0KSR2 is sourced from the original manufacturer or authorized distributors?

All MC33VR5500V0KSR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33VR5500V0KSR2 meets industry standards.

7.What is the process for return or replacement of MC33VR5500V0KSR2?

All MC33VR5500V0KSR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33VR5500V0KSR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC33VR5500V0KSR2 part is unused and in its original packaging.

Return procedure for MC33VR5500V0KSR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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