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NXP Semiconductors MC34905CS3EKR2
- Part No.:
- MC34905CS3EKR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MC34905CS3EKR2.pdf
- Description:
- IC SBC HIGH SPD CAN 3.3V 32SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:3,286
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Product details
Overview
MC34905CS3EKR2 from NXP Semiconductors (formerly Freescale) is a System Basis Chip (SBC) integrating a 3.3 V MCU power regulator, ISO 11898-2/5 high-speed CAN transceiver, one LIN 2.1 interface, four configurable wake-up/I/O pins, and SPI-based diagnostics. It operates across -40 °C to +125 °C and supports automotive-grade fault detection, fail-safe state management, and ultra-low-power LP modes for ECU power management in harsh environments.
For engineers reviewing the MC34905CS3EKR2 datasheet, MC34905CS3EKR2 pinout, MC34905CS3EKR2 application, or MC34905CS3EKR2 equivalent, this page delivers verified technical context, real-world design meanings for key specs, validated pin functions, confirmed alternative parts with functional distinctions, and supply-ready availability details - all grounded in Freescale's MC34903_4_5 Rev. 4.0 documentation.
Technical Context
The MC34905CS3EKR2 implements a SMARTMOS-based power management architecture with dual battery-supply inputs (VSUP1/VSUP2), enabling independent regulation of VDD (3.3 V), 5V-CAN, and VAUX outputs. Its integrated CAN physical layer complies with ISO 11898-2 and -5, supporting baud rates from 40 kb/s to 1.0 Mb/s with bus-fault diagnostics, local failure detection, and fail-safe operation modes.
It features a programmable state machine for Low-Power (LP) mode control, including cyclic sense, automatic timer wake-up, and multi-source wake-up (CAN, LIN, I/O transition, SPI message, VDD overcurrent). The device includes SPI-configurable regulators, MUX-OUT analog monitoring, and dedicated SAFE (active-low) fault signaling - all coordinated via an internal fail-safe state machine.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD Output | 3.3 V ±3%, 150 mA continuous (200 mA with external PNP ballast) |
| CAN Interface | ISO 11898-2 & -5 compliant, 40 kb/s–1.0 Mb/s baud rate, integrated bus fault diagnostics |
| LIN Interface | Single LIN 2.1 master/slave interface with RXD-L/TXD-L pins and LIN-T termination support |
| Wake-up Inputs | Four configurable pins (I/O-0 to I/O-3), three usable as wake-up sources in LP mode plus LIN-T |
| Quiescent Current | ≤35 μA at 125 °C in LP mode with VDD OFF; ≤85 μA with VDD ON and active monitoring |
| Operating Temp | -40 °C to +125 °C ambient, junction limited to 125 °C for 10-year reliability |
| Package | 32-pin SOIC with exposed pad, footprint-compatible across MC34903/4/5 family |
Pinout & Package
MC34905CS3EKR2 uses a 32-pin SOIC package with exposed thermal pad (Pb-free EK suffix), pin-compatible with MC34903S/P and MC34904 variants. Pin functions are validated per Freescale MC34903_4_5 Rev. 4.0, Table 4 and Figure 8.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP1 / VSUP2 | Battery supply inputs | VSUP1 powers VDD regulator and reset circuitry; VSUP2 powers 5V-CAN, VAUX, and I/O/LIN drivers - internally connected on select variants but separate here |
| VDD | Main MCU supply output | 3.3 V regulated output, ±3% tolerance, supports up to 150 mA (200 mA with external PNP) |
| CANH / CANL | CAN differential bus interface | Integrated high-speed CAN transceiver outputs compliant with ISO 11898-2/-5; include SPLIT pin for common-mode termination |
| RXD / TXD | CAN logic-level interface | MCU-side CAN data interface: RXD is open-drain output; TXD is input with internal pull-up to VDD |
| LIN / RXD-L / TXD-L / LIN-T | LIN 2.1 bus interface | LIN bidirectional bus pin; RXD-L (output), TXD-L (input w/ pull-up), LIN-T (configurable HS output for termination or I/O) |
| I/O-0 to I/O-3 | Configurable wake-up/I/O | Four pins support programmable wake-up in LP mode; I/O-0/I/O-1 support cyclic sense; I/O-2 = LIN-T; I/O-3 is fully flexible |
| SAFE | Fault indicator output | Open-drain active-low signal asserting on watchdog timeout, VDD undervoltage, RST fault, or critical internal error |
| MUX-OUT | Analog multiplexed monitor | SPI-selectable analog output (VDD, VSENSE, VAUX, temperature, etc.) for MCU ADC monitoring |
Key Features
| Feature | Design Value |
|---|---|
| Fail-safe state machine | Hardware-enforced safe state transitions with diagnostic coverage for watchdog, voltage, and reset faults |
| Multi-threshold undervoltage detection | Separate VSUP1/VSUP2 UVLO thresholds (6.0 V/6.5 V) with hysteresis - supports cranking and cold-crank scenarios |
| Embedded 5V-CAN regulator | Dedicated 5 V output for CAN transceiver with overcurrent and short-circuit protection |
| Flexible wake-up architecture | Four I/O pins usable as wake-up sources in LP mode, plus CAN/LIN bus activity, SPI message, and timer events |
| Diagnostic SPI interface | Full register access for real-time monitoring of VDD, VSENSE, VAUX, temperature, CAN/LIN status, and fault flags |
Applications
| Body Control Module (BCM) | Engine Control Unit (ECU) |
|---|---|
Use Scenario: Centralized power management and communication hub in vehicle body electronics, managing door modules, lighting, and HVAC actuators. IC Role / Device Role / Timing Role: System Basis Chip providing regulated 3.3 V MCU supply, LIN-controlled peripheral interfacing, and CAN gateway functionality with fail-safe shutdown. Use Value: Reduces BOM count by integrating CAN transceiver, LIN interface, and multi-rail regulators - enables single-chip ECU power + comms architecture. | Use Scenario: Power and communication interface for engine management systems requiring robust diagnostics under wide voltage transients (e.g., load dump, cranking). IC Role / Device Role / Timing Role: Primary power manager delivering stable 3.3 V to MCU, monitoring battery voltage (VSENSE), and enabling CAN-based sensor/actuator communication with bus fault reporting. Use Value: Supports AEC-Q100 Grade 1 operation with ±8 kV HBM ESD on CANH/CANL and extended 4.0–28 V VSUP range - ensures runtime continuity during engine start-stop cycles. |
| Industrial Motor Drive | Robotics Control Node |
Use Scenario: Power and bus interface for distributed motor controllers in factory automation, communicating via CANopen and receiving local I/O commands via LIN. IC Role / Device Role / Timing Role: SBC supplying isolated 3.3 V logic power, hosting CAN physical layer for motion coordination, and using I/O-0/I/O-1 for cyclic sense feedback from motor current sensors. Use Value: Enables deterministic low-power sleep/wake cycles with <35 μA quiescent current - extends uptime in battery-backed or energy-constrained deployments. | Use Scenario: Compact node controller in collaborative robots, managing joint actuator CAN traffic while monitoring safety-critical supply rails and thermal conditions. IC Role / Device Role / Timing Role: Fault-aware system basis chip asserting SAFE pin on VDD undervoltage or thermal pre-warning (140 °C), triggering controlled shutdown before thermal shutdown (160 °C). Use Value: Integrates MUX-OUT analog monitoring of VDD, VSENSE, and die temperature - eliminates need for external ADC and discrete supervision ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar System Basis Chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34904C3EK/R2 | No LIN interface; identical 3.3 V VDD, CAN, and I/O architecture; same 32-pin SOIC package | Suitable where LIN is not required - reduces cost and simplifies firmware by removing LIN stack dependency | Select when CAN-only communication suffices and LIN bus integration is unnecessary |
| MC33905CDLR2 | NXP successor part with enhanced CAN FD support, lower quiescent current (15 μA), and updated SPI register map; same pinout and 3.3 V VDD capability | Supports next-gen CAN FD networks and offers improved thermal performance (TJ max 150 °C vs. 125 °C sustained) | Choose for new designs targeting CAN FD migration or stricter low-power requirements |
Compared with MC34904C3EK/R2 and MC33905CDLR2, MC34905CS3EKR2 uniquely provides LIN 2.1 interface capability within the same footprint - making it the only option among the three for mixed CAN+LIN ECU architectures without adding discrete LIN transceivers.
Availability
MC34905CS3EKR2 is available at Aetrix Electronics and suitable for automotive body control modules, industrial motor drives, robotics control nodes, and engine management units requiring stable component supply across extended temperature and voltage ranges.
Supply support for MC34905CS3EKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in automotive power management and communication ICs.
The MC34905CS3EKR2 belongs to NXP's System Basis Chip product line, designed specifically for automotive electronic control units requiring integrated power regulation, high-speed CAN, LIN, and comprehensive diagnostics in a single package.
FAQ
What is the primary function of the MC34905CS3EKR2 in an automotive ECU?
The MC34905CS3EKR2 serves as a System Basis Chip that integrates MCU power regulation (3.3 V), high-speed CAN transceiver (ISO 11898-2/5), LIN 2.1 interface, wake-up I/O, and diagnostics into a single 32-pin SOIC package. It enables compact, fault-aware ECU designs by replacing discrete regulators, CAN transceivers, and supervision ICs - reducing board space and improving system-level reliability through hardware-enforced fail-safe states.
Does the MC34905CS3EKR2 support both 3.3 V and 5.0 V VDD output configurations?
No - the MC34905CS3EKR2 is specifically configured for 3.3 V VDD output, as indicated by the "CS3" in its part number (C = version, S = single LIN, 3 = 3.3 V). The 5.0 V variant is MC34905CS5EK/R2. Both share identical pinout and feature set except for VDD voltage and associated regulator parameters.
How does the MC34905CS3EKR2 handle battery voltage transients such as load dump?
The MC34905CS3EKR2 withstands load dump transients up to 40 V on VSUP1/VSUP2, CANH/CANL, and LIN pins per its maximum ratings table. It includes dedicated overvoltage detection (VS_HIGH = 17 V typical) and undervoltage lockout (VS1_LOW = 6.0 V typical) to maintain safe operation during cranking and alternator surge events - critical for automotive-grade reliability.
Can the MC34905CS3EKR2 operate without an external PNP transistor for VDD current boosting?
Yes - the MC34905CS3EKR2 delivers up to 150 mA continuously from its internal VDD regulator. An external PNP transistor is optional and used only when higher current (up to 200 mA total) or thermal sharing is required. The device supports ballast current ratio K = 2.0 (external : internal), with drop voltage reduced to 350 mV at 200 mA when implemented.
What diagnostic capabilities does the MC34905CS3EKR2 provide via its SPI interface?
The MC34905CS3EKR2 provides real-time SPI-accessible diagnostics including VDD, VSENSE, VAUX, and die temperature monitoring via MUX-OUT selection; CAN bus fault status (dominant/recessive errors, bus-off); LIN bus activity; I/O pin states; watchdog timer status; and fault flags for undervoltage, overcurrent, and thermal pre-warning - all mapped to dedicated status registers per the MC34903_4_5 Rev. 4.0 functional description.
MC34905CS3EKR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- System Basis Chip
- Current - Supply:
- 2mA
- Voltage - Supply:
- 5.5V ~ 28V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-SOIC-EP
MC34905CS3EKR2 FAQ
1.How can I place an order for MC34905CS3EKR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC34905CS3EKR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC34905CS3EKR2 reliable?
The price and inventory of MC34905CS3EKR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC34905CS3EKR2 is usually 5 days.
3.What payment methods are accepted for MC34905CS3EKR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC34905CS3EKR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC34905CS3EKR2?
MC34905CS3EKR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC34905CS3EKR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC34905CS3EKR2?
For technical support, including MC34905CS3EKR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC34905CS3EKR2 requirements.
6.How does Aetrix verify that MC34905CS3EKR2 is sourced from the original manufacturer or authorized distributors?
All MC34905CS3EKR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC34905CS3EKR2 meets industry standards.
7.What is the process for return or replacement of MC34905CS3EKR2?
All MC34905CS3EKR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC34905CS3EKR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC34905CS3EKR2 part is unused and in its original packaging.
Return procedure for MC34905CS3EKR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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