NXP Semiconductors MC34910BACR2

Overview

MC34910BACR2 from NXP Semiconductors is a LIN System Basis Chip (SBC) integrating a LIN 2.0/2.1 transceiver, dual 50 mA/60 mA high-side drivers, 5.0 V low-dropout regulator (60 mA), configurable window watchdog, and high-voltage analog/logic input (L1) with selectable divider ratio. It operates across -40 °C to +85 °C and supports automotive body electronics such as window lift and door lock control.

For engineers reviewing the MC34910BACR2 datasheet, MC34910BACR2 pinout, MC34910BACR2 application, or MC34910BACR2 equivalent, key selection criteria include LIN conformance (SAE J2602-2), HSx current limiting (60 mA), VDD regulation accuracy (±2.5% at 50 mA), thermal shutdown thresholds (140–180 °C), and SPI timing compliance up to 4.0 MHz.

Technical Context

The MC34910BACR2 implements a multi-mode power management architecture with Normal, Sleep, and Stop operating states-enabling ultra-low quiescent current (33 µA typical in Sleep mode at 13.5 V). Its LIN physical layer supports programmable slew rate (10.4–20 kbps) and includes J2602-compliant wake-up detection (5.3–5.8 V threshold) and undervoltage hysteresis (400 mV).

Internally, the device integrates an analog multiplexer routing L1, VSENSE, and internal temperature sensor to ADOUT0, with calibrated gain (10.5 mV/K) and offset-compensated outputs. The two high-side switches feature real-time diagnostics including open-load (5–7.5 mA detection), short-circuit (VSUP − 2.0 V threshold), and overtemperature shutdown (140–180 °C) with 10 °C hysteresis.

Key Specifications

Pinout & Package

MC34910BACR2 is housed in a 32-pin LQFP package (7 mm × 7 mm, 0.8 mm pitch) with exposed thermal pad. Pin assignments follow the MC33910 family layout, with dedicated ground domains (AGND, LGND, PGND), dual VSx supply inputs, and functional isolation between analog, digital, and power sections.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LIN SBC applications.

Compared with MC33910BACR2, MC34910BACR2 trades extended temperature capability for lower cost and qualification effort in cabin applications; versus TLIN1022DSWR, it consolidates six discrete functions into one IC-reducing PCB area by 45% and eliminating 12 passive components.

Availability

MC34910BACR2 is available at Aetrix Electronics and suitable for window lift, mirror adjustment, door lock, and sunroof control systems requiring stable component supply across automotive production lifecycles.

Supply support for MC34910BACR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The MC34910BACR2 belongs to NXP's System Basis Chip portfolio, designed specifically for automotive body electronics to integrate LIN communication, power regulation, and load driving in a single AEC-Q100 qualified device.

FAQ

What is the maximum LIN data rate supported by the MC34910BACR2?

The MC34910BACR2 supports LIN data rates up to 20.0 kbps with normal slew rate and 10.4 kbps with slow slew rate, fully compliant with LIN Physical Layer Specification 2.0/2.1 and SAE J2602-2. The transceiver includes waveshaping circuitry that can be disabled via configuration bit DIS_J2602 to achieve higher effective throughput in noise-controlled environments. This flexibility allows the MC34910BACR2 to serve both legacy and next-generation LIN networks without hardware change.

Does the MC34910BACR2 support PWM control of its high-side drivers?

Yes, the MC34910BACR2 supports PWM control of HS1 and HS2 via the dedicated PWMIN pin, enabling precise duty-cycle modulation for dimming, speed control, or current limiting. The PWM input accepts standard logic-level signals (VIH ≥ 0.7×VDD), and internal circuitry synchronizes switching with SPI command execution to avoid transient spikes. This capability is confirmed in the MC33910 family datasheet section "Two 50 mA/60 mA high-side switches with optional pulse-width modulated (PWM)" and validated in electrical characteristics Table 4 for PWMIN pin thresholds and pull-up current.

How does the MC34910BACR2 handle battery voltage monitoring?

The MC34910BACR2 monitors battery voltage via the VSENSE pin, which connects directly to the vehicle battery rail and feeds an internal 5.25× voltage divider. The resulting signal appears at ADOUT0 alongside L1 and temperature readings, allowing MCU ADC sampling without external components. Electrical specifications confirm VSENSE input range (-27 to 40 V), self-protection against reverse battery, and ±30 mV offset tolerance. This integrated sensing eliminates need for external resistive dividers and improves measurement accuracy over discrete solutions.

What thermal protection features are built into the MC34910BACR2?

The MC34910BACR2 includes three-tier thermal protection: prewarning interrupt at 90–140 °C (TPRE), overtemperature shutdown of high-side drivers at 140–180 °C (THSSD), and full-system shutdown at 150–190 °C (TSD). Each threshold has defined hysteresis (13 °C for TPRE/TSD, 10 °C for THSSD) to prevent oscillation. These values are production-tested per Table 4 and apply to both HSx outputs and LIN transceiver. Thermal events generate SPI-accessible flags (HSSR.HSxOT, LINSR.LINOT) enabling fail-safe system response.

Can the MC34910BACR2 operate in Sleep mode while maintaining LIN bus wake-up capability?

Yes, the MC34910BACR2 supports full LIN bus wake-up from Sleep mode, where VDD is powered down and quiescent current drops to 33 µA typical. In this state, the LIN transceiver remains active and detects dominant bus pulses exceeding 5.3–5.8 V (VBUSWU), triggering IRQ assertion and automatic transition to Normal Request mode. This behavior is explicitly defined in the "Three main operating modes" section and verified in Table 4's dynamic characteristics for VBUSWU parameter, ensuring reliable entry from vehicle-off state without external circuitry.