NXP Semiconductors MC34911BAC
- Part No.:
- MC34911BAC
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- -
- Datasheet:
-
MC34911BAC.pdf
- Description:
- SYSTEM BASIS CHIP, LIN, 1X 5.0V/
- Quantity:
- Payment:

- Shipping:

Inventory:250
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC34911BAC from NXP Semiconductors (formerly Freescale) is a LIN System Basis Chip with integrated DC motor pre-driver, combining SPI-controlled SBC functionality, LIN 2.0/2.1 transceiver, 5.0 V/60 mA LDO regulator, one protected high-side switch (HS1), two protected low-side switches (LS1/LS2), and dual high-voltage wake-up/analog inputs (L1/L2). It operates across –40 °C to +85 °C and targets automotive body electronics such as window lift and mirror control.
For engineers reviewing the MC34911BAC datasheet, MC34911BAC pinout, MC34911BAC application, or MC34911BAC equivalent, key selection considerations include its LIN conformance (SAE J2602-2), configurable watchdog timing via WDCONF, PWM-controllable outputs, analog multiplexer support for battery sensing (VSENSE) and contact monitoring, and thermal shutdown protection at 140 °C junction temperature.
Technical Context
The MC34911BAC implements a multi-mode power management architecture with Normal, Sleep, and Stop operating states-each with distinct wake-up sources (LIN bus, L1/L2, cyclic sense, CS, RST) and current consumption profiles. Its LIN physical layer supports up to 100 kbps with programmable waveshaping and meets SAE J2602-2 immunity requirements.
SPI interface operates up to 4.0 MHz with full-duplex communication and register-accessible diagnostics; all outputs (HS1, LS1, LS2) support PWM modulation with overcurrent, open-load, and short-circuit detection. The analog multiplexer routes L1/L2 and VSENSE signals to ADOUT0 with selectable divider ratios (1× or 3.6×) and calibrated offset compensation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| LIN Compliance | SAE J2602-2, LIN Protocol Specification 2.0 and 2.1 - ensures interoperability in automotive LIN networks without external level-shifting or protocol translation. |
| Operating Temperature | –40 °C to +85 °C - qualified for passenger compartment and non-engine-bay automotive applications including door modules and sunroof controllers. |
| VDD Regulator | 5.0 V ±2.5%, 60 mA max output - powers MCU and peripherals with built-in LVR, fault reporting, and dropout voltage ≤250 mV at 50 mA load. |
| HS1 Output | RDS(on) ≤7.0 Ω @ 25 °C, 60 mA current limit - drives small solenoids or relays with integrated short-circuit and overtemperature shutdown (140 °C). |
| LS1/LS2 Outputs | RDS(on) ≤2.5 Ω @ 25 °C, 160 mA current limit each - suitable for driving DC motors, LEDs, or actuators with active energy clamping (VCLAMP = VSUP +2.0 V). |
| SPI Interface | 4.0 MHz max clock, tVALID ≤75 ns - enables fast register read/write for real-time diagnostics and configuration updates in safety-critical sequences. |
| Analog Inputs | L1/L2 support digital wake-up and analog sensing (divider ratio 1× or 3.6×); VSENSE input with 5.25× internal divider - enables direct battery voltage monitoring with <±30 mV offset error. |
Pinout & Package
MC34911BAC uses a 32-pin LQFP package (Pb-free, AC suffix) with exposed thermal pad. Pin assignments are identical to MC33911BAC per Freescale documentation (MC33911BAC Product Specifications, pp. 53–100), and validated against Figure 3 and Table 2 of the MC33911 datasheet Rev. 10.0.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| RXD/TXD | LIN Bus Interface | Full-duplex LIN physical layer I/O; RXD reports bus state to MCU, TXD controls driver output - supports wake-up and communication in all operating modes. |
| MISO/MOSI/SCLK/CS | SPI Interface | 4-wire SPI bus for configuration, status readback, and diagnostic access; CS active-low enables device selection in multi-SBC systems. |
| HS1/LS1/LS2 | Protected Switch Outputs | HS1: high-side driver for grounded loads; LS1/LS2: low-side drivers for VSUP-referenced loads - all support PWM, current limiting, and fault flagging. |
| L1/L2 | Wake-up / Analog Inputs | Dual high-voltage inputs (–18 V to +40 V) usable as digital wake sources or analog-sensed contacts via internal multiplexer and resistor-divider network. |
| VSENSE | Battery Voltage Sense | Direct connection point for battery rail; internally divided 5.25× for accurate ADC measurement - self-protected against reverse battery and transient overvoltage. |
| VDD | 5.0 V Regulator Output | Stable 5 V supply for MCU and logic; requires external 2–100 µF capacitor with ESR 0.1–10 Ω - includes low-voltage reset and overtemperature flags. |
| WDCONF | Watchdog Configuration | Analog pin setting watchdog timeout period (8.5–205 ms) using external resistor (20–200 kΩ); also allows watchdog disable - critical for fail-safe system recovery. |
| IRQ/RST | Interrupt & Reset Control | IRQ asserts low on wake events or faults; RST is bidirectional - driven low during internal resets and used as external reset input with deglitch filtering (480 ns typical). |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Window Watchdog | Timeout programmable from 8.5 ms to 205 ms via external resistor on WDCONF - enables precise system-level fault detection without MCU intervention. |
| LIN Transceiver with J2602 Support | Fully compliant with SAE J2602-2 including undervoltage threshold (5.0–6.0 V), hysteresis (400 mV), and deglitching (50 µs) - eliminates need for external LIN compliance circuitry. |
| Integrated Analog Multiplexer | Routes L1, L2, and VSENSE to single ADOUT0 pin with selectable divider ratios (1× or 3.6×) and calibrated offset - reduces BOM count and PCB area for multi-sensor monitoring. |
| Thermal Protection Architecture | Independent overtemperature shutdown thresholds for HS1 (140 °C), LS1/LS2 (140 °C), and LIN (140 °C), each with 10 °C hysteresis - prevents latch-up and enables safe recovery after thermal stress. |
| High-Voltage Input Protection | L1/L2 pins withstand ±100 V transients per ISO 7637-2 Pulse 3b; VSENSE survives –27 V to +40 V - enables direct connection to battery and chassis without external TVS diodes. |
Applications
| Window Lift Control | Mirror Adjustment Module |
|---|---|
|
Use Scenario: Bidirectional DC motor control for automotive power window actuation with soft-start, stall detection, and anti-pinch logic. IC Role / Device Role / Timing Role: MC34911BAC provides regulated 5 V power, LIN communication, HS1/LS1 PWM-driven H-bridge control, and VSENSE-based current estimation. Use Value: Integrated diagnostics (open-load, overcurrent, thermal flags) reduce MCU firmware complexity and eliminate discrete protection components. |
Use Scenario: Compact side-view mirror positioning with motor direction reversal, position feedback, and wake-on-LIN command. IC Role / Device Role / Timing Role: MC34911BAC acts as LIN node controller with LS1/LS2 driving mirror motors, L1/L2 sensing switch inputs, and IRQ signaling status changes. Use Value: Single-chip integration replaces discrete LDO, transceiver, and driver ICs - cuts board space by >40% versus discrete solutions. |
| Door Lock Actuator | Sunroof Motor Controller |
|
Use Scenario: Electromechanical door lock solenoid drive with LIN command response, tamper detection, and low-power sleep mode. IC Role / Device Role / Timing Role: MC34911BAC supplies 5 V to microcontroller, receives LIN commands, drives HS1 solenoid output, and monitors L1 for door ajar switch. Use Value: Sleep mode current ≤35 µA at 13.5 V enables always-on LIN wake capability without battery drain concerns. |
Use Scenario: Sunroof glass/sliding panel motor control with smooth ramp-up/down, obstruction detection, and LIN-based position synchronization. IC Role / Device Role / Timing Role: MC34911BAC delivers PWM-modulated LS1/LS2 outputs for H-bridge drive, uses VSENSE for real-time current profiling, and reports faults via SPI. Use Value: On-chip analog multiplexer and current-limiting switches enable closed-loop control without external op-amps or shunt amplifiers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LIN system basis chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33911BAC/R2 | Identical pinout and feature set, but rated for –40 °C to +125 °C junction temperature and higher ESD robustness (±6.0 kV on LIN pin). | Required for engine bay or under-hood placement where ambient exceeds 85 °C; supports stricter EMC emission targets per updated generation spec. | Select MC33911BAC/R2 when extended temperature range or enhanced LIN-pin ESD immunity is mandatory; otherwise MC34911BAC suffices for cabin applications. |
| TLF35584ESV33 | Infineon device with 3.3 V VDD output, CAN+LIN dual interface, and ASIL-B functional safety support - no analog multiplexer or VSENSE input. | Targets safety-critical domains requiring ISO 26262 compliance; lacks integrated battery sensing and contact monitoring features of MC34911BAC. | Choose TLF35584ESV33 only if CAN bus integration or ASIL-B certification is required; MC34911BAC remains optimal for cost-sensitive, LIN-only body electronics. |
Compared with MC33911BAC/R2, MC34911BAC trades extended temperature rating and LIN-pin ESD margin for lower cost and sufficient performance in passenger compartment modules; versus TLF35584ESV33, it offers superior analog sensing integration but no functional safety certification or CAN capability.
Availability
MC34911BAC is available at Aetrix Electronics and suitable for window lift, mirror adjustment, door lock, and sunroof motor control applications requiring stable component supply, automotive-grade reliability, and long-term production continuity.
Supply support for MC34911BAC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in automotive analog and mixed-signal ICs.
The MC34911BAC belongs to NXP's System Basis Chip (SBC) product line, designed specifically to consolidate power regulation, communication interfaces, and protected switching into single-package solutions for automotive body electronics.
FAQ
What is the maximum LIN data rate supported by the MC34911BAC?
The MC34911BAC LIN transceiver supports up to 100 kbps with waveshaping enabled, and higher rates are achievable with waveshaping disabled per LIN Physical Layer Specification. Its timing parameters (e.g., VBUSDOM ≤0.4×VSUP, VBUSREC ≥0.6×VSUP) ensure reliable operation across the full 8–18 V supply range and meet SAE J2602-2 conformance requirements.
Does the MC34911BAC support PWM control of its high-side and low-side outputs?
Yes, the MC34911BAC supports PWM control of HS1, LS1, and LS2 via the dedicated PWMIN pin. All three outputs can be modulated simultaneously or independently, enabling precise speed/torque control for DC motors and dimming for LED loads while maintaining full diagnostic coverage (overcurrent, open-load, thermal).
How does the MC34911BAC handle battery voltage monitoring?
The MC34911BAC uses the VSENSE pin for direct battery rail connection, with an internal 5.25× voltage divider feeding the analog multiplexer. When selected via SPI, VSENSE appears at ADOUT0 with ±30 mV offset error and <±35% cyclic sense accuracy - enabling MCU ADC-based battery health monitoring without external resistive dividers.
What wake-up sources are available in Sleep and Stop modes for the MC34911BAC?
In Sleep mode (VDD off), wake-up is possible via LIN bus activity, L1/L2 digital transitions, cyclic sense pulses, or forced wake command. In Stop mode (VDD on, low-current), additional sources include CS edge, external reset (RST), and LIN bus - all triggering IRQ assertion and mode transition within ≤15 µs per datasheet timing specs.
Is the MC34911BAC pin-compatible with other devices in the MC33911 family?
Yes, the MC34911BAC shares identical 32-pin LQFP pinout and register map with MC33911BAC/R2 and MC33911G5AC/R2. Differences are limited to temperature grade (–40 °C to +85 °C vs. +125 °C), ESD performance, and minor electrical parameter tolerances - enabling drop-in replacement in most cabin applications.
MC34911BAC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Applications:
- -
- Current - Supply:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
MC34911BAC FAQ
1.How can I place an order for MC34911BAC through Aetrix?
Please submit a Request for Quotation (RFQ) for MC34911BAC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC34911BAC reliable?
The price and inventory of MC34911BAC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC34911BAC is usually 5 days.
3.What payment methods are accepted for MC34911BAC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC34911BAC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC34911BAC?
MC34911BAC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC34911BAC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC34911BAC?
For technical support, including MC34911BAC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC34911BAC requirements.
6.How does Aetrix verify that MC34911BAC is sourced from the original manufacturer or authorized distributors?
All MC34911BAC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC34911BAC meets industry standards.
7.What is the process for return or replacement of MC34911BAC?
All MC34911BAC units undergo pre-shipment inspection (PSI). If there is an issue with MC34911BAC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC34911BAC part is unused and in its original packaging.
Return procedure for MC34911BAC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC34911BAC Tags

-
TPS2511DGNR
Texas Instruments

-
UTC2000/MG
Microchip Technology

-
TUSB320HAIRWBR
Texas Instruments

-
TPS61252DSGR
Texas Instruments

-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments

-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments

-
STUSB1600AQTR
STMicroelectronics

-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments

-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

