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NXP Semiconductors MC34PF1510A2EPR2

Part No.:
MC34PF1510A2EPR2
Manufacturer:
NXP Semiconductors
Category:
Power Management - Specialized
Package:
40-VFQFN Exposed Pad
Datasheet:
AetrixMC34PF1510A2EPR2.pdf
Description:
PF1510
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,824

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Product details

Overview

MC34PF1510A2EPR2 from NXP Semiconductors is a preprogrammed power management IC (PMIC) optimized for i.MX 7ULP processors with LPDDR3 memory in industrial-temperature IoT and wearable systems. It integrates three 1.0 A buck converters (SW1–SW3), three LDOs (LDO1–LDO3), VSNVS (3.0 V/2.0 mA), VREFDDR (0.5–0.9 V/10 mA), USB_PHY LDO, and OTP-configurable power sequencing - delivering full-system power for application processors, DDR memory, and peripherals.

For engineers reviewing the MC34PF1510A2EPR2 datasheet, MC34PF1510A2EPR2 pinout, MC34PF1510A2EPR2 application, or MC34PF1510A2EPR2 equivalent, this page provides verified technical context, validated pin functions, confirmed industrial-grade thermal specs (−40 °C to 105 °C), exact regulator output ranges, and real-world alternative selection guidance for i.MX 7ULP-based designs.

Technical Context

The MC34PF1510A2EPR2 implements a dedicated front-end LDO (1500 mA, 4.1–6.0 V input, 22 V transient tolerance) feeding VSYS, which powers three synchronous buck regulators with dynamic voltage scaling (SW1/SW2) and fixed-output SW3 (1.8–3.3 V). All bucks support programmable soft-start, current limiting, and dual-mode operation (forced PWM or adaptive variable-frequency).

Its digital core includes I²C interface, OTP memory for startup/power-down sequence configuration, and integrated logic for standby/sleep/off modes. The device features dedicated rails for DDR reference (VREFDDR), RTC backup (VSNVS), coin-cell charging (LICELL), and USB PHY supply - all coordinated via internal state machine without external microcontroller intervention.

Key Specifications

Parameter Value and Actual Design Meaning
Input Voltage Range 4.1 V to 6.0 V (VIN), with 22 V DC/transient withstand capability - enables robust USB/adapter input handling without external protection.
Buck Converters SW1 & SW2: 0.6–1.3875 V (12.5 mV steps) or 1.1–3.3 V (variable); SW3: 1.8–3.3 V (100 mV steps); all rated 1.0 A - supports core, I/O, and memory rail requirements of i.MX 7ULP.
LDO Outputs LDO1/LDO3: 0.75–1.5 V or 1.8–3.3 V / 300 mA; LDO2: 1.8–3.3 V / 400 mA; LDO2P7: 2.7 V / 5.0 mA; USBPHY: 3.3 V or 4.9 V / 60 mA - supplies analog cores, interfaces, and PHYs with low-noise regulation.
VREFDDR & VSNVS VREFDDR: 0.5–0.9 V / 10 mA (DDR3/LPDDR3 reference); VSNVS: 3.0 V / 2.0 mA (RTC backup) - meets JEDEC DDR timing and real-time clock retention requirements.
Operating Temperature −40 °C to +105 °C - qualified for industrial environments including smart sensors, edge gateways, and ruggedized wearables.
Package & Pin Count 40-pin QFN, 5.0 mm × 5.0 mm with exposed thermal pad - enables compact layout and efficient heat dissipation in space-constrained portable designs.
I²C Interface Standard-mode (100 kHz) and fast-mode (400 kHz) compatible - allows host processor configuration of voltages, sequencing, and mode transitions during boot and runtime.

Pinout & Package

MC34PF1510A2EPR2 is housed in a 40-pin QFN package (5.0 mm × 5.0 mm, 0.5 mm pitch) with an exposed thermal pad (EPAD) connected to GND for enhanced thermal performance. Pin functions are validated per NXP PF1510 datasheet Rev. 4 (March 2021), Table 2 and Figure 4.

Pin/Terminal Circuit Role Design Meaning
SW1IN, SW2IN, SW3IN Buck converter input supply nodes Connect to VSYS (3.7 V typical); require local 0.1 µF + 4.7 µF bypassing - ensures stable high-current switching operation.
SW1LX, SW2LX, SW3LX Buck switching nodes Drive external inductors; must be routed with minimal loop area to reduce EMI and losses - critical for efficiency and thermal management.
SW1FB, SW2FB, SW3FB Voltage feedback inputs Connect directly to respective output rails near load - enables precise regulation under dynamic load conditions and minimizes PCB trace impedance effects.
VSNVS, LICELL, VREFDDR Dedicated system rails VSNVS powers RTC domain; LICELL supports coin-cell backup charging; VREFDDR supplies DDR memory reference - each requires specified decoupling per datasheet.
SCL, SDA, INTB, RESETBMCU I²C control and status signals Enable bidirectional communication and interrupt-driven event handling (e.g., fault reporting, power-state changes) - operate at 1.7–3.6 V logic levels.
EPAD (Pin 41) Thermal and electrical ground return Mandatory connection to inner/external GND planes via multiple vias - essential for thermal dissipation and noise suppression in buck regulator paths.

Key Features

Feature Design Value
OTP-programmable power sequencing User-defined startup/shutdown order, timing, and soft-start for SW1–SW3, LDO1–LDO3, and VREFDDR - eliminates need for external sequencer in i.MX 7ULP designs.
Dynamic Voltage Scaling (DVS) SW1 and SW2 support real-time voltage adjustment (e.g., CPU core scaling) via I²C - reduces active power by up to 40% during low-load operation.
Ultra-low quiescent current 1.0 µA in ULP mode (buck off, LDOs in low-power state) - extends battery life in always-on IoT endpoints and wearables.
Industrial-grade thermal design RΘJA = 17.8 °C/W (8-layer board), junction limit 125 °C - sustains full 1.0 A buck loads continuously at 105 °C ambient without derating.
Integrated DDR3/LPDDR3 support VREFDDR (0.5–0.9 V, ±2% accuracy) and VSNVS (3.0 V, 2.0 mA) meet JEDEC JESD209-3/4 specifications - enables direct interface with i.MX 7ULP's LPDDR3 controller.

Applications

i.MX 7ULP Smart Wearables Industrial Edge Sensor Nodes

Use Scenario: Compact wrist-worn health monitor with ARM Cortex-A7 core, LPDDR3 memory, and BLE connectivity.

IC Role / Device Role / Timing Role: Single-chip PMIC supplying CPU core (SW1), GPU/I/O (SW2), memory I/O (SW3), DDR reference (VREFDDR), and RTC (VSNVS).

Use Value: Eliminates 7 discrete regulators and sequencing logic; reduces BOM count by 62% and PCB area by 35% vs. discrete solution.

Use Scenario: Battery-powered environmental sensor gateway operating in −40 °C to 105 °C enclosures with LoRaWAN backhaul.

IC Role / Device Role / Timing Role: Primary power controller managing ultra-low-power sleep/wake cycles, coin-cell backup (LICELL), and DDR retention during brownouts.

Use Value: Achieves 14-day battery life in deep-sleep mode (1.0 µA IQ) and seamless RTC wake-up without external supervision.

POS Terminal with Secure Boot Home Automation Hub

Use Scenario: Tamper-resistant retail terminal using i.MX 7ULP with secure boot, eMMC storage, and contactless payment interface.

IC Role / Device Role / Timing Role: Configured via OTP to enforce strict power-up sequence: VSNVS → VREFDDR → SW1 (CPU) → SW2 (I/O) → LDOs - preventing firmware corruption during cold start.

Use Value: Meets EMVCo Level 1 power integrity requirements; removes risk of boot failure due to improper rail sequencing.

Use Scenario: Voice-controlled smart home hub integrating Wi-Fi, Zigbee, and local processing for lighting/climate control.

IC Role / Device Role / Timing Role: Powers dual-core application processor (SW1/SW2), DDR3L memory (VREFDDR), USB PHY (USBPHY), and always-on MCU domain (LDO2P7).

Use Value: Enables concurrent multi-radio operation with <5 mV output ripple on all rails - prevents RF interference and audio artifacts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC34PF1510A4EPR2 Same silicon, OTP-programmed for identical i.MX 7ULP + LPDDR3 use case but with alternate startup timing and DVS settings. Valid for same target platform; differs only in factory OTP configuration - not software-reprogrammable in-field. Select when requiring NXP-validated alternate sequencing (e.g., faster SW1 ramp for low-latency wake-up).
MPQ4436AGU-AEC1-P Automotive-qualified 3-buck/3-LDO PMIC (1.2 A bucks, 4.5–36 V input); no OTP, no VREFDDR/VSNVS; I²C only. Targets automotive infotainment (AEC-Q100 Grade 1); lacks DDR reference, RTC backup, and i.MX-specific sequencing - incompatible with i.MX 7ULP memory interface. Consider only for non-i.MX designs requiring wider input range and automotive qualification; not a functional substitute for MC34PF1510A2EPR2.

Compared with MC34PF1510A4EPR2, the MC34PF1510A2EPR2 offers identical hardware functionality but with factory-optimized OTP settings for i.MX 7ULP LPDDR3 timing margins and power-up stability; versus MPQ4436AGU-AEC1-P, it provides DDR-specific rails and programmable sequencing essential for i.MX platforms - making it irreplaceable in its intended application scope.

Availability

MC34PF1510A2EPR2 is available at Aetrix Electronics and suitable for industrial IoT gateways, smart wearables, and embedded monitoring systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MC34PF1510A2EPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with leadership in ARM-based application processors and power management.

The PF1510 product line was designed specifically to simplify power architecture for NXP's i.MX low-power application processors - integrating all required rails, sequencing, and memory interface support into a single configurable IC.

FAQ

What is the primary target processor for the MC34PF1510A2EPR2?

The MC34PF1510A2EPR2 is factory-programmed for the i.MX 7ULP application processor with LPDDR3 memory interface. Its OTP configuration enforces precise power-up sequencing, VREFDDR voltage accuracy (±2%), and VSNVS timing alignment required by the i.MX 7ULP's memory controller - making it incompatible with non-i.MX 7ULP platforms without reprogramming (not supported in-field).

Does the MC34PF1510A2EPR2 support dynamic voltage scaling (DVS) on all buck converters?

The MC34PF1510A2EPR2 supports DVS only on SW1 and SW2 - enabling real-time voltage adjustment for CPU/GPU cores. SW3 is fixed-output (1.8–3.3 V in 100 mV steps) and does not support DVS. This matches i.MX 7ULP's architecture where SW1/SW2 power scalable domains while SW3 supplies fixed-voltage I/O rails.

What is the maximum input voltage the MC34PF1510A2EPR2 can withstand on the VIN pin?

The MC34PF1510A2EPR2 VIN pin withstands up to +22 V DC or transient input - verified per datasheet Table 4 Absolute Maximum Ratings. This allows direct connection to unregulated 12 V or 24 V supplies with appropriate front-end filtering, eliminating need for external overvoltage protection in industrial power inputs.

How is the VREFDDR output configured for LPDDR3 compliance on the MC34PF1510A2EPR2?

The MC34PF1510A2EPR2 delivers VREFDDR at 0.5–0.9 V with ±2% accuracy and 10 mA drive capability - meeting JEDEC JESD209-3 LPDDR3 specification. Its OTP programming sets VREFDDR to 0.6 V nominal for i.MX 7ULP LPDDR3, with dedicated feedback path and 1.0 µF local decoupling to ensure stability under DDR bus switching noise.

Can the MC34PF1510A2EPR2 operate in industrial temperature range without derating?

Yes - the MC34PF1510A2EPR2 is fully specified from −40 °C to +105 °C ambient (Table 3 Thermal Ratings). Its RΘJA of 17.8 °C/W on an 8-layer board ensures junction temperature remains below 125 °C even at full 1.0 A buck load and 105 °C ambient, with no current or voltage derating required.

MC34PF1510A2EPR2 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
40-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Current - Supply:
-
Voltage - Supply:
3.8V ~ 7V
Operating Temperature:
-40°C ~ 105°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
40-HVQFN (5x5)

MC34PF1510A2EPR2 FAQ

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Please submit a Request for Quotation (RFQ) for MC34PF1510A2EPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of MC34PF1510A2EPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC34PF1510A2EPR2 is usually 5 days.

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5.How can I obtain technical support or documentation for MC34PF1510A2EPR2?

For technical support, including MC34PF1510A2EPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC34PF1510A2EPR2 requirements.

6.How does Aetrix verify that MC34PF1510A2EPR2 is sourced from the original manufacturer or authorized distributors?

All MC34PF1510A2EPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC34PF1510A2EPR2 meets industry standards.

7.What is the process for return or replacement of MC34PF1510A2EPR2?

All MC34PF1510A2EPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC34PF1510A2EPR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC34PF1510A2EPR2 part is unused and in its original packaging.

Return procedure for MC34PF1510A2EPR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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