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NXP Semiconductors MC34PF1510A5EP
- Part No.:
- MC34PF1510A5EP
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 40-VFQFN Exposed Pad
- Datasheet:
-
MC34PF1510A5EP.pdf
- Description:
- PF1510
- Quantity:
- Payment:
- Shipping:
Inventory:2,195
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Product details
Overview
MC34PF1510A5EP from NXP Semiconductors is a preprogrammed power management IC (PMIC) optimized for i.MX 6UL processors with DDR3 memory, delivering three 1.0 A buck converters (SW1–SW3), three LDOs (LDO1–LDO3), VSNVS RTC supply (3.0 V/2.0 mA), DDR reference (VREFDDR: 0.5–0.9 V/10 mA), and I²C programmability. It supports low-power IoT, smart wearables, and industrial embedded systems requiring tight voltage sequencing and ultra-low quiescent current.
For engineers reviewing the MC34PF1510A5EP datasheet, MC34PF1510A5EP pinout, MC34PF1510A5EP application, or MC34PF1510A5EP equivalent, key selection criteria include its OTP-configured startup sequence for i.MX 6UL + DDR3, −40 °C to 105 °C industrial temperature rating, 40-pin QFN 5.0 mm × 5.0 mm package with exposed pad, and dynamic voltage scaling on SW1/SW2 for ARM core power optimization.
Technical Context
The MC34PF1510A5EP integrates a front-end LDO (1500 mA input limit, 22 V transient withstand), three synchronous buck regulators with internal soft-start and programmable current limits, and three LDOs-including LDO2P7 (2.7 V/5.0 mA always-on) and USBPHY (3.3 V or 4.9 V/60 mA). Its OTP memory stores device-specific configuration including regulator voltages, power-up/down timing, and DVS profiles.
It implements dual operating modes: forced PWM quasi-fixed frequency and adaptive variable-frequency switching, enabling >90% peak efficiency across load ranges. The I²C interface (1.7–3.6 V VDDIO) enables real-time control of standby, sleep, and off states, while integrated watchdog (80 s period) and reset outputs support system-level reliability in battery-powered applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | VIN: 4.1–6.0 V; withstands DC/transient up to +22 V-enables robust operation from USB, AC adapter, or 5 V bus without external protection. |
| Buck Converters | SW1/SW2: 0.6–1.3875 V (12.5 mV steps) or 1.1–3.3 V (variable); SW3: 1.8–3.3 V (100 mV steps); all rated 1.0 A-supports core, I/O, and memory rails for i.MX 6UL. |
| LDO Outputs | LDO1/LDO3: 0.75–1.5 V or 1.8–3.3 V / 300 mA; LDO2: 1.8–3.3 V / 400 mA; LDO2P7: 2.7 V / 5.0 mA (always-on)-provides flexible analog/digital rail generation with load switch capability. |
| VREFDDR & VSNVS | VREFDDR: 0.5–0.9 V / 10 mA (DDR memory reference); VSNVS: 3.0 V / 2.0 mA (RTC backup)-ensures accurate DDR termination and persistent real-time clock operation. |
| Quiescent Current | 1.0 μA in ULP mode (buck), <1.5 μA in low-power mode (LDOs)-extends battery life in always-on sensor nodes and wearable devices. |
| Operating Temperature | −40 °C to +105 °C-qualified for industrial environments including factory automation and edge gateways. |
| Package | 40-pin QFN, 5.0 mm × 5.0 mm, exposed thermal pad-enables compact PCB layout with efficient heat dissipation via multi-via grounding. |
Pinout & Package
MC34PF1510A5EP uses a 40-pin QFN (5.0 mm × 5.0 mm) with exposed thermal pad (EPAD), designed for high-density portable applications. The EPAD must be connected to inner/external ground planes via multiple vias for thermal management and electrical stability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (Pin 37) | Main IC supply input | Accepts 5.0 V source (e.g., USB or adapter); bypassed with 2.2 µF capacitor-powers internal logic and front-end LDO. |
| VSYS (Pins 35, 36) | Main PMIC input voltage rail | Distributed 3.7 V supply to all bucks and LDOs; bypassed with 47 µF capacitor-serves as primary energy reservoir for regulation stages. |
| SW1FB–SW3FB (Pins 27, 16, 15) | Buck feedback inputs | Connect near load to close regulation loop; enable precise output voltage accuracy (±2.0% for SW3, ±2.0% for SW1/SW2 in DVS mode). |
| LDO1–LDO3 (Pins 29, 19, 12) | Regulated output terminals | Deliver stable 0.75–3.3 V at 300–400 mA; require local 4.7–10 µF ceramic bypassing-supply processor I/O, sensors, and peripherals. |
| VREFDDR (Pin 21) | DDR memory reference output | Provides 0.5–0.9 V reference for DDR3 termination; bypassed with 1.0 µF capacitor-critical for signal integrity in i.MX 6UL DDR3 interfaces. |
| VSNVS (Pin 30) | RTC backup supply | 3.0 V output for real-time clock; bypassed with 0.47 µF capacitor-maintains timekeeping during main power loss. |
| I²C Interface (Pins 2, 3, 4) | Serial communication | SCL/SDA/VDDIO support 1.7–3.6 V logic; pull-ups required to VDDIO-enables runtime reconfiguration and status monitoring. |
| INTB / RESETBMCU (Pins 9, 10) | Open-drain signals | Interrupt and reset outputs; pulled up to VSNVS or compatible rail ≤ VDDIO-interface directly with i.MX 6UL GPIOs for fault handling. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-programmed configuration | Factory-set startup sequence, DVS profiles, and regulator voltages specifically for i.MX 6UL with DDR3-eliminates external configuration EEPROM and reduces BOM count. |
| Dynamic voltage scaling (DVS) | SW1 and SW2 support real-time voltage adjustment in 12.5 mV steps-enables ARM core frequency scaling to match workload and minimize active power. |
| Ultra-low quiescent current | 1.0 μA in ULP buck mode and <1.5 μA in LDO low-power mode-extends battery runtime in always-listening IoT endpoints and wearables. |
| Integrated coin cell charger | LICELL pin (Pin 31) supports optional coin cell backup with charging circuitry-preserves RTC and SRAM state during extended main power outages. |
| Robust input protection | VIN withstands +22 V transients and includes overvoltage lockout (6.5 V threshold, 150 mV hysteresis)-reduces need for external TVS diodes in cost-sensitive designs. |
| Industrial temperature grade | Rated for −40 °C to +105 °C ambient operation-validates performance in uncontrolled environments such as industrial gateways and outdoor sensors. |
Applications
| Smart Wearable Devices | Industrial Edge Gateways |
|---|---|
Use Scenario: Compact fitness tracker with i.MX 6UL SoC, Bluetooth LE, and OLED display operating on single-cell Li-ion battery. IC Role / Device Role / Timing Role: MC34PF1510A5EP supplies core (SW1), I/O (SW2), memory (SW3), RTC (VSNVS), and sensor rails (LDO2/LDO3) while managing power states via I²C. Use Value: 1.0 μA ULP mode extends battery life to >7 days in sleep; OTP-locked DDR3 timing ensures reliable boot from cold start. | Use Scenario: DIN-rail mounted gateway aggregating Modbus RTU data from factory floor sensors and forwarding via Wi-Fi/Ethernet. IC Role / Device Role / Timing Role: MC34PF1510A5EP powers i.MX 6UL CPU, DDR3 SDRAM, and peripheral interfaces (USB, SD/MMC) with industrial-grade thermal margin. Use Value: −40 °C to 105 °C rating guarantees uninterrupted operation in hot control cabinets; VREFDDR precision maintains DDR3 signal integrity at 533 MHz. |
| POS Terminals | Home Automation Hubs |
Use Scenario: Battery-backed retail POS terminal with barcode scanner, thermal printer, and touchscreen, deployed in varying ambient conditions. IC Role / Device Role / Timing Role: MC34PF1510A5EP delivers regulated 1.1 V (core), 3.3 V (I/O), and 1.8 V (DDR3) while supporting fast wake-from-sleep via STANDBY pin. Use Value: Programmable power-down sequence prevents data corruption during brownout; LDO2P7 (2.7 V) maintains secure element operation during main rail collapse. | Use Scenario: Voice-controlled smart home hub integrating Zigbee, Z-Wave, and Matter-over-Thread radios with local AI inference on i.MX 6UL. IC Role / Device Role / Timing Role: MC34PF1510A5EP manages multi-rail power for SoC, memory, and RF subsystems, with VSNVS preserving time and session keys during AC dropout. Use Value: Coin cell charging (LICELL) enables >10-year RTC backup; I²C-based standby mode reduces system idle power to sub-100 µW. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF1510A3EP | OTP-programmed for i.MX 6UL with DDR3L (not DDR3); identical pinout and electrical specs. | Targets lower-voltage DDR3L memory; not validated for standard DDR3 timing margins. | Select only if DDR3L memory is used; verify VREFDDR and SW3 output compatibility with DDR3L VDDQ requirements. |
| MC34PF1510A6EP | OTP-programmed for i.MX 6ULL with DDR3L; same package and thermal rating. | Optimized for i.MX 6ULL's reduced power envelope and DDR3L interface-not compatible with i.MX 6UL DDR3 initialization. | Use for i.MX 6ULL-based designs only; requires full hardware validation due to different SoC power sequencing. |
Compared with MC34PF1510A3EP and MC34PF1510A6EP, the MC34PF1510A5EP uniquely supports i.MX 6UL + DDR3 with factory-verified startup timing, eliminating need for custom OTP programming or firmware adaptation during qualification.
Availability
MC34PF1510A5EP is available at Aetrix Electronics and suitable for industrial edge gateways, smart wearable devices, and POS terminals requiring stable component supply with guaranteed long-term availability and traceable sourcing.
Supply support for MC34PF1510A5EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based application processors and power management.
The PF1510 product line was designed to deliver highly integrated, OTP-configured PMICs for NXP's i.MX low-power application processors, reducing design complexity and accelerating time-to-market for battery-operated and thermally constrained embedded systems.
FAQ
What is the OTP configuration purpose of MC34PF1510A5EP?
The OTP (One-Time Programmable) memory in MC34PF1510A5EP stores factory-configured parameters specific to i.MX 6UL with DDR3, including power-up sequencing order, voltage ramp rates, DVS step sizes, and regulator output voltages. This eliminates the need for external configuration memory and ensures deterministic boot behavior without software intervention. MC34PF1510A5EP cannot be reprogrammed after shipment.
Does MC34PF1510A5EP support DDR3 memory interfaces?
Yes, MC34PF1510A5EP is explicitly programmed for i.MX 6UL with DDR3 memory, providing dedicated VREFDDR (0.5–0.9 V/10 mA) and SW3 (1.8–3.3 V/1.0 A) outputs meeting DDR3 VDDQ and termination requirements. Its OTP configuration validates timing margins for DDR3 initialization, distinguishing it from DDR3L-optimized variants like MC34PF1510A3EP.
What is the maximum input voltage MC34PF1510A5EP can withstand on the VIN pin?
MC34PF1510A5EP VIN pin (Pin 37) is rated to withstand transient and DC inputs up to +22 V, with overvoltage lockout triggered at 6.5 V (typical) and 150 mV hysteresis. This allows direct connection to unregulated 5 V sources without external protection circuitry, simplifying front-end design for USB-powered or adapter-fed systems.
How does MC34PF1510A5EP achieve ultra-low quiescent current in battery-powered applications?
MC34PF1510A5EP achieves 1.0 μA quiescent current in ULP mode by disabling switching activity in buck regulators while maintaining LDO biasing, and <1.5 μA in LDO low-power mode via optimized internal bias networks. These states are entered automatically during light-load conditions or via I²C command, extending battery life in always-on IoT sensors and wearables where MC34PF1510A5EP serves as the sole power controller.
Is MC34PF1510A5EP pin-compatible with other PF1510 variants?
Yes, all PF1510 variants-including MC34PF1510A5EP-share identical 40-pin QFN 5.0 mm × 5.0 mm packaging and pinout. However, OTP programming differs per variant (e.g., MC34PF1510A5EP for i.MX 6UL+DDR3 vs. MC34PF1510A6EP for i.MX 6ULL+DDR3L), so hardware replacement requires validation of power sequencing and voltage settings in the target application.
MC34PF1510A5EP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 40-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
- Current - Supply:
- -
- Voltage - Supply:
- 3.8V ~ 7V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 40-HVQFN (5x5)
MC34PF1510A5EP FAQ
1.How can I place an order for MC34PF1510A5EP through Aetrix?
Please submit a Request for Quotation (RFQ) for MC34PF1510A5EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC34PF1510A5EP reliable?
The price and inventory of MC34PF1510A5EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC34PF1510A5EP is usually 5 days.
3.What payment methods are accepted for MC34PF1510A5EP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC34PF1510A5EP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC34PF1510A5EP?
MC34PF1510A5EP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC34PF1510A5EP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC34PF1510A5EP?
For technical support, including MC34PF1510A5EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC34PF1510A5EP requirements.
6.How does Aetrix verify that MC34PF1510A5EP is sourced from the original manufacturer or authorized distributors?
All MC34PF1510A5EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC34PF1510A5EP meets industry standards.
7.What is the process for return or replacement of MC34PF1510A5EP?
All MC34PF1510A5EP units undergo pre-shipment inspection (PSI). If there is an issue with MC34PF1510A5EP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC34PF1510A5EP part is unused and in its original packaging.
Return procedure for MC34PF1510A5EP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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