My Inquiry
My Account
NXP Semiconductors MC34PF1510A6EPR2
- Part No.:
- MC34PF1510A6EPR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 40-VFQFN Exposed Pad
- Datasheet:
-
MC34PF1510A6EPR2.pdf
- Description:
- PF1510
- Quantity:
- Payment:
- Shipping:
Inventory:15,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC34PF1510A6EPR2 from NXP Semiconductors is a power management IC (PMIC) engineered for i.MX 6ULL processors with DDR3L memory in industrial-temperature embedded systems. It integrates three 1.0 A buck converters, three LDOs (including 400 mA LDO2), VREFDDR (0.5–0.9 V), RTC supply (3.0 V/2.0 mA), and I²C programmability. It operates across −40 °C to +105 °C and supports dynamic voltage scaling on SW1/SW2 for low-power IoT edge nodes.
For engineers reviewing the MC34PF1510A6EPR2 datasheet, MC34PF1510A6EPR2 pinout, MC34PF1510A6EPR2 application, or MC34PF1510A6EPR2 equivalent, key selection criteria include its preprogrammed i.MX 6ULL + DDR3L configuration, 40-pin QFN package with exposed pad, industrial temperature rating, OTP-configurable startup sequence, and support for USB PHY (4.9 V/60 mA) and coin-cell backup charging.
Technical Context
The MC34PF1510A6EPR2 implements a front-end LDO (1500 mA, up to 6.5 V input) feeding VSYS, which powers three synchronous buck regulators (SW1–SW3) and five linear regulators (LDO1–LDO3, LDO2P7, USBPHY). Its digital core includes OTP memory for user-defined power-up/down sequencing, DVS control, and regulator voltage programming via I²C interface.
It features dedicated analog blocks: VREFDDR reference generator (10 mA, 0.5–0.9 V), VSNVS RTC rail (3.0 V, always-on), and integrated coin-cell charger (LICELL). Thermal protection, watchdog timer (80 s), and multiple low-power modes (ULP quiescent current ≤1.0 µA per buck) are implemented in hardware with no external firmware dependency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | VIN: 4.1–6.0 V; withstands DC/transient up to +22 V - enables robust USB/adapter input without external surge protection |
| Buck Converters | SW1/SW2: 1.0 A, 0.6–1.3875 V (12.5 mV steps) or 1.1–3.3 V; SW3: 1.0 A, 1.8–3.3 V (100 mV steps) - covers core, I/O, and memory rails for i.MX 6ULL |
| LDO Outputs | LDO2: 400 mA, 1.8–3.3 V; LDO2P7: 2.7 V/5.0 mA (always-on); USBPHY: 4.9 V/60 mA - supplies processor I/O, SNVS domain, and USB physical layer |
| VREFDDR | 0.5–0.9 V, 10 mA - precision DDR3L reference compliant with JEDEC JESD79-3F |
| Operating Temperature | −40 °C to +105 °C - qualified for industrial-grade embedded applications including smart gateways and remote sensors |
| Package | 40-pin QFN, 5.0 mm × 5.0 mm with exposed thermal pad - supports high-density PCB layouts and efficient heat dissipation |
| I²C Interface | Standard-mode (100 kHz) and fast-mode (400 kHz) compatible - enables real-time voltage margining and mode control during system runtime |
Pinout & Package
MC34PF1510A6EPR2 uses a 40-pin QFN (5.0 mm × 5.0 mm) with exposed thermal pad (EPAD), optimized for thermal performance in space-constrained industrial designs. Pin functions align with i.MX 6ULL power sequencing requirements, including dedicated VSYS, VCORE, VDIG, and DDR interface signals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | Main IC supply input | Accepts 5.0 V adapter/USB source; bypassed with 2.2 µF capacitor - feeds front-end LDO |
| VSYS | Main PMIC output rail | Regulated output from front-end LDO; powers all internal regulators - requires dual 22 µF bulk capacitance |
| SW1FB / SW2FB / SW3FB | Voltage feedback inputs | Connect near load to minimize trace inductance - enables precise regulation under dynamic load transients |
| LDO2 | 400 mA I/O supply output | Programmable 1.8–3.3 V; bypassed with 10 µF capacitor - powers i.MX 6ULL VDDIO and peripheral interfaces |
| VREFDDR | DDR memory reference output | 0.5–0.9 V, 10 mA; bypassed with 1.0 µF capacitor - meets DDR3L VREF accuracy and noise requirements |
| VSNVS | RTC/always-on supply | 3.0 V, 2.0 mA; bypassed with 0.47 µF capacitor - maintains real-time clock and secure non-volatile state during deep sleep |
| SCL / SDA | I²C bus interface | Open-drain, 1.7–3.6 V tolerant; pulled up to VDDIO - enables configuration and monitoring without level shifters |
| INTB | Interrupt output | Open-drain signal to processor; pulled up to VSNVS - reports fault conditions (OV/UV, thermal, watchdog timeout) |
Key Features
| Feature | Design Value |
|---|---|
| OTP-programmable power sequencing | User-defined startup/shutdown timing and voltage ramp rates stored in one-time-programmable memory - eliminates external sequencer IC and reduces BOM count |
| Dynamic Voltage Scaling (DVS) on SW1/SW2 | Hardware-controlled voltage adjustment in 12.5 mV steps during CPU frequency scaling - reduces active power by up to 30% in burst-workload scenarios |
| Ultra-low quiescent current | 1.0 µA per buck in ULP mode with light load - extends battery life in always-on sensor nodes and wearable devices |
| Integrated coin-cell charger | LICELL pin supports trickle-charge of backup battery (0.1 µF bypass) - ensures RTC continuity during main power loss |
| Industrial temperature qualification | −40 °C to +105 °C operation with full electrical specs guaranteed - suitable for uncontrolled environments like factory floors and outdoor gateways |
Applications
| Smart Industrial Gateway | Low-Power Edge Sensor Node |
|---|---|
Use Scenario: Cellular-connected gateway aggregating Modbus RTU data from PLCs and relaying to cloud via MQTT. IC Role / Device Role / Timing Role: Central PMIC supplying i.MX 6ULL CPU core (SW1), DDR3L memory (VREFDDR + SW3), and cellular modem I/O (LDO2). Use Value: Preprogrammed i.MX 6ULL + DDR3L configuration ensures correct power-up order; VSNVS maintains time sync during network handover outages. | Use Scenario: Battery-powered vibration sensor with BLE telemetry deployed in HVAC ducts. IC Role / Device Role / Timing Role: Power controller delivering regulated 1.1 V to Cortex-M4 subsystem, 3.3 V to MEMS accelerometer, and 2.7 V to BLE radio. Use Value: ULP-mode quiescent current ≤1.0 µA per buck extends 10-year battery life; coin-cell backup preserves calibration data during battery replacement. |
| POS Terminal with Secure Boot | Smart Wearable Display |
Use Scenario: Retail point-of-sale terminal requiring secure boot, EMV transaction processing, and display backlight control. IC Role / Device Role / Timing Role: PMIC providing VCORE (SW1), VDDIO (LDO2), VREFDDR (for eMMC), and USBPHY (for secure element communication). Use Value: OTP-locked startup sequence prevents unauthorized firmware loading; USBPHY's 4.9 V output meets CCID smart-card reader compliance. | Use Scenario: Fitness tracker with OLED display, heart-rate sensor, and Bluetooth LE connectivity. IC Role / Device Role / Timing Role: Single-chip power solution for ARM Cortex-A7 application processor (SW1), LPDDR2 memory (VREFDDR), and display driver (SW3). Use Value: DVS on SW1 dynamically scales CPU voltage with activity level; LDO2P7's always-on 2.7 V rail powers RTC and wake-up logic during suspend. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF1510A6EP | Same silicon, tape-and-reel suffix omitted - identical electrical and thermal specs, but not supplied in reel format | No functional difference; used in manual assembly or low-volume prototyping | Select MC34PF1510A6EPR2 for automated SMT production requiring 1000-unit reels |
| PF8100A6EPR2 | Higher integration: adds 2x 3 A bucks, 2x 1.5 A LDOs, and PMIC-to-PMIC daisy-chain interface - larger 64-pin QFN (7×7 mm) | Targeted at i.MX 8M Mini/Plus platforms with higher power budgets and multi-rail sequencing needs | Choose PF8100A6EPR2 only when scaling beyond i.MX 6ULL capabilities or requiring inter-PMIC coordination |
Compared with MC34PF1510A6EP, the R2 suffix ensures compatibility with high-speed pick-and-place equipment; versus PF8100A6EPR2, MC34PF1510A6EPR2 offers optimal cost, size, and thermal efficiency for i.MX 6ULL-based designs without over-engineering.
Availability
MC34PF1510A6EPR2 is available at Aetrix Electronics and suitable for industrial gateways, battery-powered edge sensors, POS terminals, and smart wearables requiring stable component supply across extended product lifecycles.
Supply support for MC34PF1510A6EPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure, energy-efficient embedded solutions for automotive, industrial, and IoT markets.
The PF1510 product line delivers highly integrated, application-specific PMICs for NXP's i.MX application processors, with preprogrammed variants optimized for DDR3L, LPDDR3, and LPDDR2 memory interfaces in resource-constrained portable systems.
FAQ
What is the primary target processor for MC34PF1510A6EPR2?
The MC34PF1510A6EPR2 is specifically preprogrammed for the i.MX 6ULL processor with DDR3L memory interface. Its OTP configuration enforces correct power-up sequencing, voltage levels, and timing for this exact SoC variant - it is not field-reconfigurable to support other i.MX families without hardware redesign.
Does MC34PF1510A6EPR2 support dynamic voltage scaling (DVS)?
Yes, MC34PF1510A6EPR2 supports hardware-based DVS on SW1 and SW2 buck converters, enabling voltage adjustment in 12.5 mV steps during CPU frequency transitions. This feature is enabled by default in its i.MX 6ULL configuration and requires no external control logic - the DVS command is issued via I²C from the host processor.
What is the function of the LICELL pin on MC34PF1510A6EPR2?
The LICELL pin on MC34PF1510A6EPR2 provides bidirectional coin-cell interface functionality: it charges an external backup battery (e.g., CR1220) during main power availability and supplies the VSNVS rail during main power loss. A 0.1 µF bypass capacitor is mandatory, and charging current is internally limited to prevent overcharging.
Can MC34PF1510A6EPR2 operate without an external crystal or oscillator?
Yes, MC34PF1510A6EPR2 contains fully integrated oscillator circuitry and requires no external crystal. It generates internal 16 kHz and 32 kHz clocks for RTC and watchdog functions, and its buck converters operate at fixed 2.0 MHz switching frequency - eliminating BOM cost and board area for timing components.
What thermal performance can be expected from MC34PF1510A6EPR2 in a six-layer PCB?
In a six-layer PCB (2s4p stackup), MC34PF1510A6EPR2 achieves a junction-to-ambient thermal resistance (RΘJA) of 20.6 °C/W under natural convection. With proper thermal vias to inner ground planes and ≥200 mm² copper pour under the EPAD, it sustains full 1.0 A load on all three bucks continuously at +105 °C ambient without thermal shutdown.
MC34PF1510A6EPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 40-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
- Current - Supply:
- -
- Voltage - Supply:
- 3.8V ~ 7V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 40-HVQFN (5x5)
MC34PF1510A6EPR2 FAQ
1.How can I place an order for MC34PF1510A6EPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC34PF1510A6EPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC34PF1510A6EPR2 reliable?
The price and inventory of MC34PF1510A6EPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC34PF1510A6EPR2 is usually 5 days.
3.What payment methods are accepted for MC34PF1510A6EPR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC34PF1510A6EPR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC34PF1510A6EPR2?
MC34PF1510A6EPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC34PF1510A6EPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC34PF1510A6EPR2?
For technical support, including MC34PF1510A6EPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC34PF1510A6EPR2 requirements.
6.How does Aetrix verify that MC34PF1510A6EPR2 is sourced from the original manufacturer or authorized distributors?
All MC34PF1510A6EPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC34PF1510A6EPR2 meets industry standards.
7.What is the process for return or replacement of MC34PF1510A6EPR2?
All MC34PF1510A6EPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC34PF1510A6EPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC34PF1510A6EPR2 part is unused and in its original packaging.
Return procedure for MC34PF1510A6EPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC34PF1510A6EPR2 Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
