NXP Semiconductors MC34PF1550A1EPR2

Overview

MC34PF1550A1EPR2 from NXP Semiconductors is a preprogrammed power management IC (PMIC) optimized for i.MX 6UL/6ULL/7ULP application processors in battery-powered IoT and wearable systems. It integrates three 1.0 A buck converters (SW1–SW3), three LDOs (LDO1–LDO3), RTC supply (VSNVS), DDR reference (VREFDDR), and a linear Li-ion charger with JEITA-compliant thermal monitoring and programmable charge parameters.

For engineers reviewing the MC34PF1550A1EPR2 datasheet, MC34PF1550A1EPR2 pinout, MC34PF1550A1EPR2 application, or MC34PF1550A1EPR2 equivalent, key selection criteria include its industrial-grade −40 °C to 105 °C operation, OTP-configurable startup sequence, dynamic voltage scaling on SW1/SW2, 100 mΩ BATFET R_DS(on), and I²C-controlled power-state management for low-power embedded designs.

Technical Context

The MC34PF1550A1EPR2 implements a tightly integrated analog-digital PMIC architecture with dedicated regulators per processor domain: SW1/SW2 support DVS for ARM core and GPU voltage scaling, while SW3 supplies fixed 1.8–3.3 V for peripherals. Its digital core manages I²C register access, OTP configuration storage, watchdog timer (80 s), and state-machine-driven power sequencing.

Power-path management includes VSYS regulation from either VBUSIN (4.1–6.0 V) or VBATT, with 22 V transient withstand capability on VBUSIN and integrated 50 mΩ isolation MOSFET. Battery charging supports 100–1000 mA CC, 3.5–4.44 V CV, and 5–50 mA termination current, all configurable via OTP or runtime I²C writes.

Key Specifications

Pinout & Package

MC34PF1550A1EPR2 uses a 40-pin QFN package (5.0 mm × 5.0 mm, 0.5 mm pitch) with exposed thermal pad (EPAD) requiring PCB ground connection for thermal performance and EMI control.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Compared with MP2662GQ-Z and TPS65192RHBR, the MC34PF1550A1EPR2 uniquely combines i.MX-specific OTP programming, triple-buck + triple-LDO + charger + VREFDDR + VSNVS in one industrial-grade package, eliminating discrete support components and reducing BOM count by ≥7 parts in i.MX-based designs.

Availability

MC34PF1550A1EPR2 is available at Aetrix Electronics and suitable for smart wearables, industrial IoT gateways, and wireless game controllers requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for MC34PF1550A1EPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in application processor power management.

The PF1550 product line was designed specifically to simplify power architecture for NXP's i.MX family of low-power application processors, delivering pre-validated, OTP-configurable PMICs that reduce design risk and accelerate time-to-market for battery-operated edge devices.

FAQ

What is the primary application processor compatibility of the MC34PF1550A1EPR2?

The MC34PF1550A1EPR2 is preprogrammed for use with NXP i.MX 6UL, 6ULL, and 7ULP application processors. Its OTP configuration (A1 variant) matches default power sequencing and voltage requirements for these SoCs, including core (SW1), memory (SW2), and I/O (SW3/LDO2) rail definitions. It is not compatible with non-i.MX platforms without significant firmware and hardware adaptation.

Does the MC34PF1550A1EPR2 support dynamic voltage scaling (DVS)?

Yes, the MC34PF1550A1EPR2 supports DVS on buck converters SW1 and SW2 via I²C register writes or OTP configuration. This enables real-time adjustment of output voltages (0.6–1.3875 V in 12.5 mV steps) to match i.MX processor performance states, reducing dynamic power consumption during low-load operation without requiring external DACs or control logic.

What battery charging parameters are user-programmable on the MC34PF1550A1EPR2?

The MC34PF1550A1EPR2 allows runtime or OTP programming of charge voltage (3.5–4.44 V), charge current (100–1000 mA), termination current (5–50 mA), precharge threshold (2.7–2.9 V), and thermal regulation points (80/95/110 °C). These settings are stored in OTP for boot-time execution or modified dynamically via I²C for adaptive charging profiles.

How does the MC34PF1550A1EPR2 handle power-source transitions between USB and battery?

The MC34PF1550A1EPR2 uses an integrated power-path architecture with automatic switchover: when VBUSIN is present, it powers VSYS and charges the battery through a 50 mΩ internal FET; when VBUSIN is removed, VSYS is seamlessly supplied from VBATT. The 22 V VBUSIN withstand rating and 100 mΩ BATFET R_DS(on) ensure robust operation during hot-plug events and load transients.

What is the function of the VREFDDR output on the MC34PF1550A1EPR2?

The VREFDDR output on the MC34PF1550A1EPR2 provides a precision 0.5–0.9 V reference voltage (±1% accuracy) at up to 10 mA for DDR memory interfaces. It is derived from VINREFDDR and internally divided by two, eliminating the need for an external resistor divider or dedicated DDR reference IC in i.MX 6UL/6ULL/7ULP designs with LPDDR2/LPDDR3 memory.