NXP Semiconductors MC34PF1550A8EP
- Part No.:
- MC34PF1550A8EP
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 40-VFQFN Exposed Pad
- Datasheet:
-
MC34PF1550A8EP.pdf
- Description:
- POWER MANAGEMENT IC 3 BUCK REGS
- Quantity:
- Payment:

- Shipping:

Inventory:1,918
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC34PF1550A8EP from NXP Semiconductors is a preprogrammed power management IC (PMIC) optimized for i.MX 6UL processors with DDR3L memory in industrial-temperature embedded systems. It integrates three 1.0 A buck converters, three LDOs (300 mA/400 mA/300 mA), a linear battery charger (100–1000 mA), RTC supply (3.0 V/2.0 mA), DDR reference voltage (0.5–0.9 V/10 mA), and I²C-configurable OTP programming - enabling full power sequencing for battery-powered IoT gateways and edge controllers.
For engineers reviewing the MC34PF1550A8EP datasheet, MC34PF1550A8EP pinout, MC34PF1550A8EP application, or MC34PF1550A8EP equivalent, key selection criteria include its industrial −40 °C to 105 °C operation, edge-sensitive startup sequence for i.MX 6UL+DDR3L, VSYS transient tolerance up to +22 V, and JEITA-compliant thermistor-based battery charge control.
Technical Context
The MC34PF1550A8EP implements a tightly integrated analog/digital PMIC architecture with dedicated regulators for core (VCORE), digital (VDIG), memory (VREFDDR), and system (VSYS) rails. Its programmable OTP defines the boot-up sequence, dynamic voltage scaling on SW1/SW2, and DDR3L-specific timing parameters - all validated for i.MX 6UL SoC power domains.
Battery management includes a 50 mΩ integrated isolation MOSFET, programmable charge termination (5–50 mA), thermal regulation at 80/95/110 °C, and supplement mode activation when VSYS drops 10–75 mV below VBATT. The I²C interface supports real-time monitoring of charger status, thermal events, and regulator faults via INTB and INT2P7 signals.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range (VBUSIN) | 4.1 V to 6.0 V - supports USB 2.0/5 V adapter input with 22 V transient withstand capability |
| Buck Converters (SW1/SW2) | 0.6–1.3875 V @ 1.0 A with 12.5 mV steps - enables dynamic voltage scaling for ARM Cortex-A7 cores |
| Buck Converter (SW3) | 1.8–3.3 V @ 1.0 A in 100 mV steps - supplies DDR3L I/O and peripheral rails |
| LDO Regulators | LDO1/LDO3: 0.75–3.3 V/300 mA; LDO2: 1.8–3.3 V/400 mA - powers sensors, audio codecs, and GPIOs |
| Battery Charger | Linear Li-ion/Li-Po support; 100–1000 mA programmable CC current; 3.5–4.44 V CV range - meets JEITA standards with thermistor feedback |
| Operating Temperature | −40 °C to 105 °C - qualified for industrial ambient environments without derating |
| Package | 40-pin QFN 5.0 mm × 5.0 mm with exposed pad - optimized for thermal dissipation in compact PCB layouts |
Pinout & Package
The MC34PF1550A8EP uses a 40-pin QFN package (98ASA00913D) with an exposed thermal pad (Pin 41) requiring solder connection to PCB ground plane for optimal thermal performance and EMI suppression.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB (Pin 27) | Buck 1 feedback input | Connects to resistor divider for precise VCORE output regulation (0.6–1.3875 V) |
| SW2FB (Pin 16) | Buck 2 feedback input | Configures VDIG rail voltage; supports DVS during processor frequency scaling |
| VREFDDR (Pin 21) | DDR memory reference output | Provides stable 0.5–0.9 V reference for DDR3L termination, sourced from VINREFDDR/2 |
| CHGB (Pin 40) | Charger LED driver sink | Drives status LED between VSYS and CHGB; supports 0.5–256 Hz blinking with ramp control |
| THM (Pin 32) | Thermistor bias node | Connects NTC thermistor to ground; enables JEITA-compliant charge current throttling |
| INTB (Pin 9) | Open-drain interrupt output | Asserts on critical events: thermal fault, battery OCP, charger timeout, or regulator UVLO |
Key Features
| Feature | Design Value |
|---|---|
| OTP-programmable startup sequence | User-defined power-on timing and soft-start delays ensure safe i.MX 6UL core/memory initialization |
| Edge-sensitive configuration (A8EP) | Preprogrammed for i.MX 6UL with DDR3L and hardware-triggered power-state transitions |
| VSYS transient protection | Withstands DC and transient inputs up to +22 V - eliminates need for external TVS on main input rail |
| Integrated coin cell charger | Charges backup battery via LICELL pin; maintains RTC and SRAM during main power loss |
| Low-power modes | ULP mode draws 1.0 μA (buck quiescent); standby/sleep/off states reduce system idle power |
Applications
| Smart Wearable Hub | Industrial IoT Gateway |
|---|---|
Use Scenario: Compact wearable device with i.MX 6UL, BLE radio, IMU, and OLED display operating on single-cell Li-Po. IC Role / Device Role / Timing Role: MC34PF1550A8EP delivers VCORE (1.1 V), VDIG (1.25 V), VREFDDR (0.75 V), and USB_PHY (3.3 V) while managing battery charge/discharge cycles. Use Value: Edge-sensitive startup ensures deterministic boot timing for real-time sensor fusion firmware; 1.0 μA ULP mode extends battery life beyond 7 days in sleep. | Use Scenario: DIN-rail mounted gateway aggregating Modbus RTU, LoRaWAN, and Ethernet traffic in factory automation. IC Role / Device Role / Timing Role: MC34PF1550A8EP powers i.MX 6UL CPU, DDR3L memory, and dual PHY interfaces while surviving 22 V transients on 24 VDC field bus input. Use Value: Industrial temperature rating (−40 °C to 105 °C) and VSYS overvoltage tolerance eliminate external protection components, reducing BOM count by 3 parts. |
| POS Terminal with Backup Battery | Edge AI Camera Node |
Use Scenario: Battery-backed retail terminal using i.MX 6UL, eMMC, and thermal printer - must retain transaction logs during AC failure. IC Role / Device Role / Timing Role: MC34PF1550A8EP provides regulated power to SoC and peripherals while charging Li-Po and maintaining VSNVS (3.0 V) for RTC and coin-cell-backed SRAM. Use Value: Integrated 50 mΩ BATFET and ship-mode self-discharge resistance (600 Ω) extend shelf life to >12 months without maintenance. | Use Scenario: Low-power vision sensor running YOLO-tiny inference on i.MX 6UL with MIPI-CSI camera and Wi-Fi module. IC Role / Device Role / Timing Role: MC34PF1550A8EP supplies VCORE (0.95 V), VDIG (1.1 V), and VREFDDR (0.675 V) with DVS synchronized to inference workload; LDO2 powers image sensor bias. Use Value: Programmable DVS on SW1/SW2 reduces active power by 22% during low-FPS inference vs. fixed-voltage operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF1550A8EP | Consumer-grade variant; −40 °C to 85 °C ambient rating; identical pinout and OTP programming | Suitable only for non-industrial environments; lacks extended thermal qualification | Select MC33PF1550A8EP only if operating ambient stays ≤85 °C and cost sensitivity outweighs reliability requirements |
| PF8100A0000000 | Higher-current buck (2.5 A per channel); no integrated battery charger; supports i.MX 8M Mini | Targets higher-performance applications without battery backup; requires external charger IC | Choose PF8100A0000000 when upgrading to i.MX 8M Mini and needing >1 A core rail current, but accept added complexity of discrete charging circuit |
Compared with MC33PF1550A8EP, the MC34PF1550A8EP adds industrial thermal margin and robustness against voltage transients; versus PF8100A0000000, it trades higher buck current for integrated battery management and DDR3L-optimized sequencing - making it optimal for cost-constrained, battery-backed i.MX 6UL edge nodes.
Availability
MC34PF1550A8EP is available at Aetrix Electronics and suitable for smart wearables, industrial IoT gateways, and battery-backed POS terminals requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MC34PF1550A8EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based application processors and associated power management.
The PF1550 product line was designed specifically to deliver complete, prevalidated power solutions for NXP's i.MX low-power application processors - minimizing design risk and accelerating time-to-market for battery-operated edge devices.
FAQ
What distinguishes MC34PF1550A8EP from other PF1550 variants?
The MC34PF1550A8EP is preprogrammed for i.MX 6UL with DDR3L memory and features edge-sensitive power sequencing - meaning its startup behavior responds to hardware trigger edges rather than level-based signals. It is rated for industrial temperature (−40 °C to 105 °C) and shares the same 40-pin QFN package and I²C register map as other PF1550 family members, but its OTP configuration is fixed and not user-modifiable in-circuit.
Does MC34PF1550A8EP support dynamic voltage scaling (DVS) for i.MX 6UL core voltage?
Yes, MC34PF1550A8EP supports DVS on SW1 and SW2 buck converters, enabling real-time adjustment of VCORE and VDIG voltages in response to i.MX 6UL workload changes. The DVS function operates within the 0.6–1.3875 V range in 12.5 mV steps and is controlled via I²C writes to dedicated OTP registers - allowing firmware to optimize power efficiency during variable processing loads.
Can MC34PF1550A8EP operate without a battery connected?
Yes, MC34PF1550A8EP supports battery-less operation using only VBUSIN (USB/adapter input). Its integrated 50 mΩ battery isolation MOSFET remains open when VBATT is absent or below 2.8 V, allowing VSYS to be powered directly from VBUSIN. The VSNVS rail continues to function via internal regulation, preserving RTC and backup memory even with no battery installed.
What thermal protection mechanisms does MC34PF1550A8EP implement?
MC34PF1550A8EP includes three configurable thermal regulation thresholds (80 °C, 95 °C, or 110 °C) that progressively reduce battery charge current to prevent overheating. It also monitors die temperature via internal sensors and triggers thermal shutdown if junction temperature exceeds 125 °C. These protections are implemented in analog hardware and remain active independent of I²C communication or firmware state.
Is the DDR reference voltage (VREFDDR) on MC34PF1550A8EP adjustable for DDR3L compliance?
Yes, MC34PF1550A8EP provides VREFDDR at 0.5–0.9 V in 25 mV steps, fully covering the DDR3L specification requirement of VDDQ/2 ± 2%. The output is derived from VINREFDDR/2 and is internally buffered to drive termination networks with minimal noise coupling - ensuring signal integrity for high-speed DDR3L interfaces on i.MX 6UL designs.
MC34PF1550A8EP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 40-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
- Current - Supply:
- -
- Voltage - Supply:
- 4.1V ~ 6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 40-HVQFN (5x5)
MC34PF1550A8EP FAQ
1.How can I place an order for MC34PF1550A8EP through Aetrix?
Please submit a Request for Quotation (RFQ) for MC34PF1550A8EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC34PF1550A8EP reliable?
The price and inventory of MC34PF1550A8EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC34PF1550A8EP is usually 5 days.
3.What payment methods are accepted for MC34PF1550A8EP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC34PF1550A8EP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC34PF1550A8EP?
MC34PF1550A8EP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC34PF1550A8EP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC34PF1550A8EP?
For technical support, including MC34PF1550A8EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC34PF1550A8EP requirements.
6.How does Aetrix verify that MC34PF1550A8EP is sourced from the original manufacturer or authorized distributors?
All MC34PF1550A8EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC34PF1550A8EP meets industry standards.
7.What is the process for return or replacement of MC34PF1550A8EP?
All MC34PF1550A8EP units undergo pre-shipment inspection (PSI). If there is an issue with MC34PF1550A8EP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC34PF1550A8EP part is unused and in its original packaging.
Return procedure for MC34PF1550A8EP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC34PF1550A8EP Tags

-
TPS2511DGNR
Texas Instruments

-
UTC2000/MG
Microchip Technology

-
TUSB320HAIRWBR
Texas Instruments

-
TPS61252DSGR
Texas Instruments

-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments

-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments

-
STUSB1600AQTR
STMicroelectronics

-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments

-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

