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NXP Semiconductors MC34PF3000A3EP
- Part No.:
- MC34PF3000A3EP
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC34PF3000A3EP.pdf
- Description:
- IC POWER MANAGEMENT 48QFN
- Quantity:
- Payment:
- Shipping:
Inventory:520
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Product details
Overview
MC34PF3000A3EP from NXP Semiconductors is a programmable power management IC (PMIC) engineered for the i.MX 6SX application processor with DDR3L memory interface. It integrates four buck regulators (SW1A: 1.0 A, SW1B: 1.75 A, SW2: 1.25 A, SW3: 1.5 A), six LDOs, a 5.0–5.15 V/600 mA boost regulator for USB OTG, and a dedicated DDR reference (VREFDDR: 0.5×SW3_OUT, 10 mA). It powers full-system rails including VCORE, VDD_SOC, VCC_SD, V33, and VSNVS in industrial-grade embedded applications.
For engineers reviewing the MC34PF3000A3EP datasheet, MC34PF3000A3EP pinout, MC34PF3000A3EP application, or MC34PF3000A3EP equivalent, this page delivers verified technical context, OTP-programmable startup sequencing, dynamic voltage scaling support for i.MX 6SX cores, I²C-configurable regulation, and validated industrial-temperature operation (−40 °C to +105 °C).
Technical Context
The MC34PF3000A3EP implements a fixed-function, OTP-configured power tree optimized for i.MX 6SX with DDR3L: SW1A/B supply core logic (0.7–1.475 V), SW2 supplies SOC I/O (1.5–1.85 V or 2.5–3.3 V), SW3 sets DDR VDDQ (0.9–1.65 V), and VREFDDR derives from SW3 output. Startup sequence, voltage levels, and DVS timing are stored in one-time-programmable memory, eliminating external configuration components.
It supports dual-input operation: VIN (2.8–4.5 V) or VPWR (3.7–5.5 V via external PFET front-end LDO), includes coin-cell backup for VSNVS (3.0 V, 1.0 mA), and features open-drain logic interfaces (PWRON, STANDBY, RESETBMCU, INTB) for direct coupling to i.MX 6SX control signals. All regulators are I²C-controllable post-boot for runtime adaptation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input voltage range | 2.8 V–4.5 V (VIN) or 3.7 V–5.5 V (VPWR with external PFET); enables flexible system-level power architecture |
| SW1A output current / voltage | 1.0 A, 0.7–1.425 V / 1.8 V / 3.3 V; powers i.MX 6SX ARM Cortex-A9 core domain with DVS support |
| SW1B output current / voltage | 1.75 A, 0.7–1.475 V; configurable as independent rail or combined with SW1A for 2.75 A single-phase core supply |
| VREFDDR output | 0.5 × SW3_OUT, 10 mA; precision DDR3L reference derived directly from SW3 output, eliminating external divider |
| VSNVS output | 3.0 V, 1.0 mA; always-on RTC supply with coin-cell backup capability for secure non-volatile state retention |
| I²C address range | 0x08–0x0F (OTP-programmable LSBs); avoids bus conflicts in multi-PMIC or mixed-peripheral designs |
| Operating temperature | −40 °C to +105 °C; qualified for industrial environments per ordering code A3EP |
Pinout & Package
The MC34PF3000A3EP is housed in a 48-pin QFN package (7.0 mm × 7.0 mm, wettable flank, 98ASA00933D), with exposed thermal pad (EP) tied to ground for enhanced thermal dissipation in high-power industrial applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| INTB (Pin 1) | Open-drain interrupt output | Signals fault conditions (OCP, UVLO, thermal) to i.MX 6SX; requires external pull-up to VDDIO |
| SW1AFB (Pin 6) | SW1A feedback input | Closes regulation loop for SW1A; must be routed away from high-current paths to avoid noise coupling |
| SW1ALX (Pin 8) | SW1A switch node | Connects to SW1A inductor; critical for EMI control and efficiency-requires short, low-inductance layout |
| VCC_SD (Pin 33) | SD card I/O regulator output | Programmable 1.8 V/1.85 V or 2.85–3.3 V output; SD_VSEL pin selects voltage mode for compatibility with UHS-I cards |
| VREFDDR (Pin 25) | DDR memory reference output | 0.5 × SW3_OUT, 10 mA; provides accurate, matched reference for DDR3L termination without external resistors |
| EP (Exposed Pad) | Thermal & ground return | Must be soldered to inner/external GND planes via multiple vias; primary path for buck/boost regulator heat dissipation |
Key Features
| Feature | Design Value |
|---|---|
| OTP-programmable startup sequence | Configurable slot timing (0.5 ms or 2.0 ms steps) and regulator enable order eliminates boot firmware dependency for power-rail sequencing |
| Dual-mode SW1A/SW1B configuration | Supports either independent 1.0 A / 1.75 A rails or combined 2.75 A single-phase operation-enables scalable core power delivery for varying i.MX 6SX workloads |
| VCC_SD dual-voltage support | Hardware-selectable 1.8 V/1.85 V or 2.85–3.3 V output via SD_VSEL pin-ensures compliance with both legacy and UHS-I SD card signaling standards |
| Integrated DDR reference generator | VREFDDR derived at 0.5× SW3_OUT with <±1% accuracy-removes need for external resistor divider and improves DDR3L signal integrity |
| Industrial temperature qualification | −40 °C to +105 °C operation (A3EP suffix) with full electrical specification guaranteed-suitable for factory automation and edge gateway deployments |
Applications
| Industrial HMI Panel | Edge Gateway Controller |
|---|---|
Use Scenario: Fanless, sealed enclosure running Linux on i.MX 6SX with DDR3L, dual Ethernet, and CAN interfaces. IC Role / Device Role / Timing Role: MC34PF3000A3EP supplies VCORE (1.1 V), VDD_SOC (1.0 V), VCC_SD (3.3 V), V33 (3.3 V), and VREFDDR (0.675 V) with synchronized startup and DVS during CPU load transitions. Use Value: Single-chip power solution reduces BOM count by 12+ discrete regulators and ensures DDR3L timing margin compliance across temperature. |
Use Scenario: DIN-rail mounted gateway aggregating Modbus, MQTT, and cellular data with local storage and real-time monitoring. IC Role / Device Role / Timing Role: MC34PF3000A3EP powers i.MX 6SX application processor, LPDDR2 (via SW3 + VREFDDR), eMMC (VCC_SD), and isolated I/O peripherals (VLDO2, VLDO4) under wide-input industrial supply (12–24 V DC-DC derived). Use Value: Coin-cell-backed VSNVS maintains RTC and secure boot state during main power loss; OTP sequencing guarantees deterministic boot recovery after brownout. |
| Medical Data Logger | Ruggedized POS Terminal |
Use Scenario: Battery-backed portable device logging ECG waveforms with Bluetooth LE and microSD storage. IC Role / Device Role / Timing Role: MC34PF3000A3EP manages battery-to-rail conversion: SWBST powers USB OTG for firmware updates; SW1A/B deliver regulated core voltage; VCC_SD switches between 1.8 V (microSD) and 3.3 V (Wi-Fi coexistence). Use Value: Integrated coin-cell charger and VSNVS preserve time/date and calibration data for >10 years; low-quiescent design extends battery life beyond 6 months. |
Use Scenario: Drop-tested retail terminal with barcode scanner, thermal printer, and contactless payment module operating in ambient temperatures up to 60 °C. IC Role / Device Role / Timing Role: MC34PF3000A3EP supplies i.MX 6SX (VCORE, VDD_SOC), VCC_SD (3.3 V for SDIO), V33 (3.3 V for GPIO), and VLDO2 (1.2 V for scanner ASIC) with thermal foldback protection. Use Value: −40 °C to +105 °C rating ensures reliability in unconditioned retail environments; wettable flank QFN enables automated optical inspection (AOI) for high-yield manufacturing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF3000A4EP | OTP preconfigured for i.MX 6SX with standard DDR3 (not DDR3L); VREFDDR derived from fixed internal reference, not SW3_OUT | Requires different DDR termination scheme; lacks DDR3L-specific VREF tracking; same package and pinout | Select only if targeting DDR3 (not DDR3L) memory; not drop-in for DDR3L-based i.MX 6SX designs |
| MC33PF3000A3ES | Automotive-grade (−40 °C to +105 °C), same OTP config (i.MX 6SX + DDR3L), but ES suffix indicates lead-free, RoHS-compliant packaging without wettable flank | No wettable flank-limits AOI capability; automotive qualification adds cost and test overhead not needed for industrial use | Choose MC34PF3000A3EP for industrial cost/performance balance; MC33PF3000A3ES only if AEC-Q100 compliance is mandatory |
Compared with MC34PF3000A4EP and MC33PF3000A3ES, the MC34PF3000A3EP uniquely combines DDR3L-optimized VREFDDR derivation, industrial wettable-flank QFN packaging, and cost-optimized qualification-making it the precise fit for i.MX 6SX-based industrial controllers requiring production-ready manufacturability and DDR3L timing compliance.
Availability
MC34PF3000A3EP is available at Aetrix Electronics and suitable for industrial HMI panels, edge gateway controllers, medical data loggers, and ruggedized POS terminals requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for MC34PF3000A3EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and power management.
The PF3000 product line was designed specifically to simplify power architecture for NXP's i.MX 6 and i.MX 7 families-integrating OTP-configurable sequencing, DDR reference generation, and industrial/automotive qualification into a single compact PMIC.
FAQ
What is the key functional difference between MC34PF3000A3EP and MC34PF3000A4EP?
The MC34PF3000A3EP is OTP-programmed for i.MX 6SX with DDR3L memory and uses SW3 output to generate VREFDDR (0.5×SW3_OUT), ensuring tight tracking. The MC34PF3000A4EP targets standard DDR3 and derives VREFDDR from an internal fixed reference-making it incompatible with DDR3L timing requirements. Both share identical pinout and package.
Does MC34PF3000A3EP support dynamic voltage scaling (DVS) for the i.MX 6SX processor cores?
Yes, MC34PF3000A3EP supports DVS on SW1A and SW1B buck regulators. Its OTP memory stores programmable voltage tables and ramp rates (25 mV/2.0 μs or 25 mV/4.0 μs), enabling controlled core voltage adjustments during i.MX 6SX frequency scaling-critical for thermal and power optimization in industrial gateways.
How is the VCC_SD output voltage selected on MC34PF3000A3EP?
The VCC_SD output voltage on MC34PF3000A3EP is selected by the SD_VSEL pin: logic low (0) configures 2.85–3.30 V for standard SD cards; logic high (1) configures 1.80–1.85 V for UHS-I SDIO operation. The SD_VSEL buffer is powered by VDDIO, defaulting to high if VDDIO is absent-ensuring safe boot into low-voltage mode.
What thermal management provisions does MC34PF3000A3EP include for industrial applications?
MC34PF3000A3EP features a wettable flank 48-QFN package (7.0 mm × 7.0 mm) with an exposed thermal pad (EP) that must be soldered to internal/external GND planes via multiple vias. This design enables efficient heat transfer from buck/boost regulators-validated for continuous operation at −40 °C to +105 °C ambient with proper PCB copper area.
Can MC34PF3000A3EP operate with input voltages above 4.5 V?
Yes, MC34PF3000A3EP supports 3.7–5.5 V input via the VPWR pin when used with an external P-channel MOSFET as a front-end LDO. This configuration clamps internal regulator inputs to ≤4.5 V while allowing direct connection to higher-voltage industrial supplies (e.g., 5 V, 12 V DC-DC outputs), preserving reliability and efficiency.
MC34PF3000A3EP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- i.MX Processors
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-HVQFN (7x7)
MC34PF3000A3EP FAQ
1.How can I place an order for MC34PF3000A3EP through Aetrix?
Please submit a Request for Quotation (RFQ) for MC34PF3000A3EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC34PF3000A3EP reliable?
The price and inventory of MC34PF3000A3EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC34PF3000A3EP is usually 5 days.
3.What payment methods are accepted for MC34PF3000A3EP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC34PF3000A3EP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC34PF3000A3EP?
MC34PF3000A3EP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC34PF3000A3EP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC34PF3000A3EP?
For technical support, including MC34PF3000A3EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC34PF3000A3EP requirements.
6.How does Aetrix verify that MC34PF3000A3EP is sourced from the original manufacturer or authorized distributors?
All MC34PF3000A3EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC34PF3000A3EP meets industry standards.
7.What is the process for return or replacement of MC34PF3000A3EP?
All MC34PF3000A3EP units undergo pre-shipment inspection (PSI). If there is an issue with MC34PF3000A3EP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC34PF3000A3EP part is unused and in its original packaging.
Return procedure for MC34PF3000A3EP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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