My Inquiry
My Account
NXP Semiconductors MC34PF3001A2EPR2
- Part No.:
- MC34PF3001A2EPR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC34PF3001A2EPR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX7 PRE-
- Quantity:
- Payment:
- Shipping:
Inventory:4,913
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC34PF3001A2EPR2 from NXP Semiconductors is a pre-programmed Power Management IC (PMIC) optimized for i.MX 7 processors with LPDDR3 memory, delivering three buck regulators (SW1: 2.75 A, SW2: 1.25 A, SW3: 1.5 A) and seven LDOs-including VCC_SD (100 mA, dual-voltage SD card support), V33 (350 mA), and VSNVS (1.0 mA RTC supply). It operates from 2.8–4.5 V input and integrates I²C programmability, dynamic voltage scaling, and coin-cell backup charging for industrial embedded systems.
For engineers reviewing the MC34PF3001A2EPR2 datasheet, MC34PF3001A2EPR2 pinout, MC34PF3001A2EPR2 application, or MC34PF3001A2EPR2 equivalent, this page provides verified regulator output voltages, OTP-configured startup sequencing (SW1=1.10 V, SW2=1.8 V, SW3=1.2 V), thermal-safe QFN-48 wettable flank package details, and validated alternatives for i.MX 7-based designs requiring DDR3L/LPDDR3 power tree compatibility.
Technical Context
The MC34PF3001A2EPR2 implements fixed OTP-based power sequencing (SEQ_CLK_SPEED = 2000 µs, SW1_SEQ=1, SW2_SEQ=2, SW3_SEQ=5) and uses a trimmed 16 MHz RC oscillator to derive switching frequencies (2.0 MHz for all bucks) and precise timing for startup and DVS ramp rates (12.5 mV/µs). Its internal architecture separates analog core bias (VCORE, VCOREDIG, VCOREREF) from high-current switch nodes (SW1LX/SW2LX/SW3LX) and isolates ground references (GNDREF1/GNDREF2/GNDREF) to minimize noise coupling in mixed-signal SoC applications.
It supports dual-input operation: VIN (≤4.5 V) directly powers all regulators, while VPWR + external PMOS enables operation up to 5.5 V via front-end LDO control (LDOG gate drive). The VSNVS rail functions as either an LDO (3.0 V) or bypass switch, powered by VIN or coin cell (LICELL), enabling secure non-volatile storage and real-time clock retention during main power loss.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8 V to 4.5 V (VIN); supports up to 5.5 V via VPWR + external PMOS |
| SW1 Output | 0.7–1.425 V, 1.8 V, or 3.3 V at 2.75 A - configured to 1.10 V for i.MX 7 ARM core (A7) |
| SW2 Output | 1.50–1.85 V or 2.50–3.30 V at 1.25 A - configured to 1.8 V for i.MX 7 SOC logic and DDR IO |
| VCC_SD Output | 1.80–1.85 V or 2.85–3.30 V at 100 mA - selected by SD_VSEL pin for SD card interface compliance |
| VSNVS Output | 3.0 V at 1.0 mA - powers SNVS/SRTC domain with coin-cell backup and charger |
| I²C Address | 0x08 (default) - enables runtime reconfiguration of voltages, modes, and fault masks |
| Package | 48-pin QFN 7.0 mm × 7.0 mm, WF-type (wettable flank) - qualified for -40 °C to 105 °C industrial operation |
Pinout & Package
MC34PF3001A2EPR2 uses a 48-pin QFN (98ASA00933D) with exposed thermal pad (EP), designed for industrial temperature range (-40 °C to 105 °C). Wettable flank geometry ensures solder joint inspection capability and robust thermal dissipation in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 INTB | Open-drain interrupt output | Asserts low on fault (overvoltage, thermal, short-circuit); requires external pull-up to VDDIO |
| 2 SD_VSEL | Digital input | Selects VCC_SD output: HIGH → 1.80–1.85 V; LOW → 2.85–3.30 V for SD card voltage mode |
| 3 RESETBMCU | Open-drain reset output | Deasserts 2.0 ms after final regulator enable; signals processor ready state, not real-time regulation monitoring |
| 6–7, 10 SW1FB/SW1IN | Analog feedback/input | SW1FB routes separately from high-current path to output cap; SW1IN bypassed with 4.7 μF + 0.1 μF ceramics |
| 8–9 SW1LX | Switch node (dual pins) | Connects to SW1 inductor; dual pins reduce trace inductance and improve EMI performance |
| 12 GNDREF1 | Ground reference | Isolated return for SW1; must be routed away from high-current ground paths to avoid noise injection |
| 13–14 VLDO1IN/VLDO1 | LDO input/output | VLDO1IN bypassed with 1.0 μF; VLDO1 output (1.8–3.3 V, 100 mA) bypassed with 2.2 μF ceramic |
| 34 VSNVS | RTC supply output | 3.0 V at 1.0 mA; bypassed with 0.47 μF capacitor; powered from VIN or coin cell via internal MUX/charger |
| 36 LICELL | Coin-cell interface | Bidirectional analog I/O; charges 1.2–3.6 V coin cells; bypassed with 0.1 μF capacitor |
| 45–46 SDA/SCL | I²C interface | Open-drain bus; pulled up to VDDIO (1.7–3.6 V) with 4.7 kΩ resistors; supports runtime configuration |
| 48 PWRON | Power-on control input | Level-sensitive active-high signal; initiates startup sequence when VIN > UVDET threshold |
| EP | Exposed thermal pad | Functions as ground return for buck regulators; must be connected to inner/external ground planes via multiple vias |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configured startup sequence | Fixed SW1→SW2→SW3→VCC_SD→VLDOs timing (SEQ_CLK_SPEED = 2000 µs) eliminates external sequencing components |
| Dynamic voltage scaling (DVS) | 12.5 mV/µs ramp rate for SW1/SW2/SW3 enables controlled core voltage transitions during processor frequency changes |
| Dual-input power architecture | VIN (≤4.5 V) or VPWR + external PMOS (up to 5.5 V) with LDOG gate drive and VPWROV overvoltage detection (6.0 V threshold) |
| SD card dual-voltage support | VCC_SD output toggles between 1.8 V and 3.3 V ranges via SD_VSEL pin, meeting SD 3.0 specification requirements |
| Secure RTC power domain | VSNVS rail with integrated coin-cell charger, MUX, and 3.0 V LDO ensures continuous timekeeping and tamper-resilient memory retention |
| Thermally robust packaging | 48-pin QFN WF-type package with exposed pad enables >1.5 W power dissipation in industrial ambient (105 °C) |
Applications
| Industrial HMI Panels | Medical Point-of-Care Devices |
|---|---|
|
Use Scenario: Touchscreen-based human-machine interface with i.MX 7 processor, LPDDR3 memory, and isolated CAN/USB peripherals. IC Role / Device Role / Timing Role: MC34PF3001A2EPR2 supplies VDD_ARM (1.10 V), VDDA_1P8 (1.8 V), NVCC_DRAM_CKE (1.2 V), and VCC_SD (1.8 V) with synchronized startup and DVS for CPU load management. Use Value: Eliminates discrete DC-DC and LDO count by integrating 10 regulated rails; OTP sequencing ensures deterministic boot timing critical for safety-certified firmware loading. |
Use Scenario: Portable ultrasound or glucose monitor using i.MX 7 UltraLite with battery backup, real-time sensor acquisition, and wireless data upload. IC Role / Device Role / Timing Role: MC34PF3001A2EPR2 delivers core, memory, and peripheral rails while maintaining VSNVS (3.0 V) and coin-cell charging for persistent clock and secure non-volatile memory across power cycles. Use Value: Integrated RTC backup and low-quiescent current design extend battery life; wettable flank QFN ensures reliable reflow in medical-grade PCB assembly. |
| Smart Energy Gateways | POS Terminals with Secure Element |
|
Use Scenario: DIN-rail mounted home energy gateway with i.MX 7, Zigbee/Wi-Fi coexistence, and tamper-detection circuitry. IC Role / Device Role / Timing Role: MC34PF3001A2EPR2 powers i.MX 7 cores, LPDDR3, USB PHY (3.3 V), and isolated communication interfaces using V33, VLDO4, and SW2 outputs. Use Value: Single-chip solution reduces BOM cost and board area; I²C programmability allows field updates to voltage margins for aging battery compensation. |
Use Scenario: EMV-compliant payment terminal with i.MX 7, contactless reader, secure element, and encrypted display driver. IC Role / Device Role / Timing Role: MC34PF3001A2EPR2 generates VDD_LPSR (1.8 V), NVCC_GPIOx (3.3 V), and VCC_SD_IO (1.8 V) while asserting RESETBMCU only after all rails stabilize per PCI PTS timing requirements. Use Value: Fixed OTP startup meets PCI PTS power-on validation windows; INTB interrupt flags undervoltage/fault conditions for cryptographic key zeroization triggers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF3001A1EPR2 | OTP-configured for i.MX 7 with DDR3L (SW1=1.10 V, SW2=1.8 V, SW3=1.35 V, VCC_SD=3.3 V/1.85 V) | Targets DDR3L memory interface instead of LPDDR3; different VCC_SD default and SW3 voltage | Select when using DDR3L SDRAM and requiring identical sequencing but higher SW3 output (1.35 V vs. 1.2 V) |
| MC34PF3001A6EPR2 | OTP-configured for i.MX 6UL with LPDDR2 (SW1=1.4 V, SW2=3.3 V, SW3=1.2 V, VCC_SD=3.3 V/1.85 V) | Optimized for i.MX 6UL processor core and LPDDR2 memory; higher SW1/SW2 voltages reflect older SoC requirements | Choose for i.MX 6UL-based designs needing same package and footprint but different voltage tree and sequencing |
Compared with MC34PF3001A1EPR2 and MC34PF3001A6EPR2, the MC34PF3001A2EPR2 provides lower SW3 voltage (1.2 V) and distinct sequencing order (SW3_SEQ=5) specifically tuned for LPDDR3 timing margins and i.MX 7 dynamic power states, making it non-interchangeable without firmware and layout review.
Availability
MC34PF3001A2EPR2 is available at Aetrix Electronics and suitable for industrial HMI panels, medical point-of-care devices, and smart energy gateways requiring stable component supply, long-term lifecycle support, and automotive-grade reliability under extended temperature operation.
Supply support for MC34PF3001A2EPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in application processor power management.
The PF3001 product line delivers highly integrated, OTP-configured PMICs for NXP's i.MX 6 and i.MX 7 families, designed to simplify power architecture, reduce external component count, and ensure deterministic startup for safety- and time-critical embedded systems.
FAQ
What is the default I²C address for MC34PF3001A2EPR2?
The default I²C address for MC34PF3001A2EPR2 is 0x08, as specified in Table 4 of the datasheet. This address is factory-trimmed and cannot be altered by OTP programming. The MC34PF3001A2EPR2 supports standard-mode (100 kHz) and fast-mode (400 kHz) I²C communication for runtime register access, voltage adjustment, and fault status polling without requiring hardware address pins.
How does MC34PF3001A2EPR2 support LPDDR3 memory on i.MX 7?
MC34PF3001A2EPR2 supports LPDDR3 memory through its OTP-configured SW3 regulator set to 1.2 V output (per Table 4), which matches the LPDDR3 I/O voltage requirement. Its fixed startup sequence (SW3_SEQ=5) ensures SW3 enables after core and SOC rails, aligning with i.MX 7 LPDDR3 initialization timing. The device also provides dedicated VCC_SD (1.8 V mode) and V33 rails required for LPDDR3 controller interfaces.
Can MC34PF3001A2EPR2 operate with a 5.0 V input supply?
Yes, MC34PF3001A2EPR2 can operate with a 5.0 V input supply by using the VPWR pin with an external PMOS pass FET (e.g., Fairchild FDMA908PZ) and connecting LDOG to the FET gate. The internal front-end LDO control block regulates VIN to ≤4.5 V. Direct connection to VIN is limited to ≤4.5 V; exceeding this without VPWR configuration risks overvoltage damage to internal regulators.
What is the purpose of the SD_VSEL pin on MC34PF3001A2EPR2?
The SD_VSEL pin on MC34PF3001A2EPR2 selects the output voltage range of the VCC_SD regulator: logic HIGH configures 1.80–1.85 V for UHS-I SD card operation, while logic LOW configures 2.85–3.30 V for legacy SD/SDHC modes. The buffer is powered by VDDIO, and absence of VDDIO defaults SD_VSEL to HIGH, ensuring safe low-voltage SD initialization during power-up.
Does MC34PF3001A2EPR2 include thermal protection?
Yes, MC34PF3001A2EPR2 includes thermal protection that triggers shutdown when die temperature exceeds the safe operating limit. Upon thermal fault, the INTB pin asserts low and the corresponding bit is set in the INTSTAT1 register. The device remains latched off until PWRON is cycled or I²C issues a soft reset. Thermal recovery is automatic after cooldown, but no hysteresis value is published in the datasheet.
MC34PF3001A2EPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Processor
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-HVQFN (7x7)
MC34PF3001A2EPR2 FAQ
1.How can I place an order for MC34PF3001A2EPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC34PF3001A2EPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC34PF3001A2EPR2 reliable?
The price and inventory of MC34PF3001A2EPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC34PF3001A2EPR2 is usually 5 days.
3.What payment methods are accepted for MC34PF3001A2EPR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC34PF3001A2EPR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC34PF3001A2EPR2?
MC34PF3001A2EPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC34PF3001A2EPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC34PF3001A2EPR2?
For technical support, including MC34PF3001A2EPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC34PF3001A2EPR2 requirements.
6.How does Aetrix verify that MC34PF3001A2EPR2 is sourced from the original manufacturer or authorized distributors?
All MC34PF3001A2EPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC34PF3001A2EPR2 meets industry standards.
7.What is the process for return or replacement of MC34PF3001A2EPR2?
All MC34PF3001A2EPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC34PF3001A2EPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC34PF3001A2EPR2 part is unused and in its original packaging.
Return procedure for MC34PF3001A2EPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC34PF3001A2EPR2 Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
