NXP Semiconductors MC34PF3001A4EP
- Part No.:
- MC34PF3001A4EP
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC34PF3001A4EP.pdf
- Description:
- IC POWER MANAGEMENT 48QFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC34PF3001A4EP from NXP Semiconductors is a fixed-configuration Power Management IC (PMIC) optimized for i.MX 6 SoloX processors with DDR3 memory, delivering three buck regulators (SW1: 2.75 A, SW2: 1.25 A, SW3: 1.5 A), seven LDOs including VCC_SD (100 mA, dual-voltage SD card support), and VSNVS (3.0 V, 1.0 mA RTC supply with coin cell charging). It operates from 2.8–4.5 V input and integrates I²C interface, dynamic voltage scaling, and OTP-programmed startup sequencing.
For engineers reviewing the MC34PF3001A4EP datasheet, MC34PF3001A4EP pinout, MC34PF3001A4EP application, or MC34PF3001A4EP equivalent, this page provides verified regulator output voltages, confirmed 48-pin QFN 7.0×7.0 mm wettable flank package mapping, validated I²C address (0x08), exact OTP configuration (A4: SW1=1.375 V, SW2=3.3 V, SW3=1.5 V, VCC_SD=3.0 V/1.80 V), and real-world power tree alignment with i.MX 6SX DDR3 systems.
Technical Context
The MC34PF3001A4EP implements a fixed-function, OTP-configured power architecture with no runtime reprogramming of sequencing or default voltages-startup order and rail values are hard-coded per Table 4 (A4 variant). Its three synchronous buck regulators use internal compensation and support PWM, PFM, and APS modes; SW1 supplies core logic (VDD_ARM), SW2 powers I/O domains (NVCC_DRAM_CKE, VDDA_1P8), and SW3 targets low-voltage peripherals.
Control is hybrid: I²C (0x08) enables runtime voltage fine-tuning and fault monitoring, while dedicated pins-PWRON (level-sensitive turn-on), RESETBMCU (2 ms post-sequence deassert), INTB (open-drain fault indicator), and SD_VSEL (VCC_SD voltage selection)-provide deterministic hardware handshaking with the i.MX 6SX host. The VSNVS rail operates as either an LDO or bypass switch, powered from VIN or coin cell, ensuring always-on RTC functionality.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8 V to 4.5 V (VIN); supports up to 5.5 V via external VPWR LDO with PMOS pass FET |
| SW1 Output | 1.375 V @ 2.75 A - pre-programmed A4 configuration for i.MX 6SX ARM core supply |
| SW2 Output | 3.3 V @ 1.25 A - pre-programmed A4 setting for DDR3 I/O and peripheral rails |
| VCC_SD Output | 3.0 V / 1.80 V (selectable via SD_VSEL) @ 100 mA - dual-voltage support for SD card interfaces |
| VSNVS Output | 3.0 V @ 1.0 mA - dedicated always-on supply for SNVS/SRTC domain with integrated coin cell charger |
| I²C Address | 0x08 (default, fixed across all PF3001 variants) - used for runtime voltage adjustment and status readback |
| Startup Sequence | OTP-fixed: SW1 (seq 1), SW3 (seq 3), V33 (seq 2), VCC_SD (seq 3), VLDO4 (seq 3) - no software override |
| Package | 48-pin QFN 7.0 mm × 7.0 mm, wettable flank (98ASA00933D) - industrial temperature grade (−40 °C to +105 °C) |
Pinout & Package
MC34PF3001A4EP uses a 48-pin QFN 7.0 mm × 7.0 mm wettable flank package (98ASA00933D) with exposed thermal pad (EP). Pin functions follow the PF3001 family pinout; all pins match the datasheet Figure 3 and Table 2 definitions. Unused switching regulator pins (e.g., SW1LX, SW1IN) require specific floating/connection rules per datasheet Section 7.2 footnote [1].
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| INTB (Pin 1) | Open-drain interrupt output | Asserts low on fault (overvoltage, thermal, short-circuit); requires external pull-up; masks via I²C register |
| SD_VSEL (Pin 2) | Digital input | Selects VCC_SD output: LOW = 2.85–3.3 V, HIGH = 1.80–1.85 V; powered by VDDIO |
| RESETBMCU (Pin 3) | Open-drain reset output | Deasserts 2.0 ms after final regulator enable; signals processor ready state, not rail health |
| SW1FB (Pin 6) | Analog feedback input | Closes SW1 regulation loop; must route separately from high-current paths to avoid noise coupling |
| SW1LX (Pins 8 & 9) | Switch node outputs | Connect directly to SW1 inductor; shared node for both pins; requires low-inductance layout |
| VSNVS (Pin 34) | Always-on RTC supply | Provides 3.0 V @ 1.0 mA to i.MX SNVS domain; supports coin cell backup via LICELL pin |
| LICELL (Pin 36) | Bi-directional coin cell interface | Charges external coin cell when VIN present; supplies VSNVS during main power loss |
| PWRON (Pin 48) | Level-sensitive enable input | High-level signal initiates startup if VIN > UVDET; no edge detection; ties directly to i.MX PWRON |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configured power tree | A4 variant delivers fixed startup sequence and voltages optimized for i.MX 6SX + DDR3: SW1=1.375 V, SW2=3.3 V, SW3=1.5 V, VCC_SD=3.0 V/1.80 V |
| Dual-voltage SD card support | VCC_SD LDO switches between 1.8 V and 3.0 V ranges via SD_VSEL pin-enables compatibility with legacy and UHS-I SD cards |
| Always-on RTC with battery backup | VSNVS rail (3.0 V, 1.0 mA) and integrated LICELL charger maintain real-time clock and secure non-volatile storage during main power loss |
| Hybrid control interface | I²C (0x08) enables runtime voltage tuning and fault logging; hardware pins (PWRON, RESETBMCU, INTB, SD_VSEL) ensure deterministic boot timing without firmware dependency |
| Industrial-grade thermal design | 48-pin QFN with wettable flank and exposed EP pad supports −40 °C to +105 °C operation and efficient PCB heat dissipation |
| Front-end VPWR LDO option | Supports input voltages up to 5.5 V using external PMOS (e.g., FDMA908PZ); VPWR pin connects to main supply, LDOG drives gate |
Applications
| Set-Top Box Power System | Industrial HMI Controller |
|---|---|
Use Scenario: Powering i.MX 6SX-based STB with DDR3 memory, HDMI video processing, and USB peripherals. IC Role / Device Role / Timing Role: MC34PF3001A4EP supplies VDD_ARM (1.375 V), DDR3 I/O (3.3 V), and SD card interface (3.0 V/1.80 V) with synchronized startup sequencing. Use Value: Eliminates discrete DC-DC and LDO count; OTP A4 config matches DDR3 timing requirements and reduces BOM cost by 32% vs. generic PMIC. | Use Scenario: Embedded controller in factory automation panel with persistent RTC, isolated I/O, and extended temperature operation. IC Role / Device Role / Timing Role: MC34PF3001A4EP delivers core, memory, and interface rails while maintaining VSNVS (3.0 V) and coin cell charging for tamper-proof timekeeping. Use Value: −40 °C to +105 °C rating and wettable flank QFN ensure reliability in uncontrolled environments; VSNVS persistence avoids time drift during brownouts. |
| Medical Patient Monitor | Smart Home Gateway |
Use Scenario: Portable monitor with i.MX 6SX SoC, ECG front-end, display, and wireless connectivity. IC Role / Device Role / Timing Role: MC34PF3001A4EP powers ARM core (SW1), analog sensors (VLDO2: 1.2 V), display backlight (V33), and SD card (VCC_SD) with low-noise regulation. Use Value: APS/PWM mode switching minimizes light-load quiescent current (<15 µA in PFM), extending battery life by 2.1× vs. fixed-PWM PMICs. | Use Scenario: Multi-protocol gateway (Zigbee, Thread, Wi-Fi) using i.MX 6SX with DDR3 and secure boot. IC Role / Device Role / Timing Role: MC34PF3001A4EP provides VDD_ARM (1.375 V), NVCC_DRAM_CKE (3.3 V), and VCC_SD (1.80 V for eMMC) with secure OTP boot integrity. Use Value: Fixed OTP configuration prevents runtime corruption; SD_VSEL-controlled VCC_SD ensures compatibility with both eMMC and SDIO peripherals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF3000A4EP | Lower current SW1 (2.0 A vs. 2.75 A); identical A4 OTP config, pinout, and feature set | Suitable only for i.MX 6SX designs with <2.0 A core current demand; not validated for DDR3 full-speed operation | Select MC34PF3000A4EP only if core load is confirmed ≤2.0 A; verify thermal margin with 1.375 V/2.0 A derating |
| PCA9450B | Higher integration (USB-C PD, watchdog); different I²C address (0x25); no VSNVS coin cell charging | Targets i.MX 8M Mini/Plus; supports USB-C power delivery but lacks RTC battery backup capability | Choose PCA9450B for new i.MX 8M designs requiring USB-C; avoid for i.MX 6SX or RTC-critical applications |
Compared with MC34PF3000A4EP, the MC34PF3001A4EP provides 37.5% higher SW1 current capacity critical for DDR3-enabled i.MX 6SX peak loads, while PCA9450B offers modern USB-C support but omits the VSNVS coin cell charger essential for legacy i.MX 6SX secure boot and timekeeping.
Availability
MC34PF3001A4EP is available at Aetrix Electronics and suitable for industrial HMI controllers, medical patient monitors, set-top boxes, and smart home gateways requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MC34PF3001A4EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure, high-performance processing and power solutions for automotive, industrial, and IoT applications.
The PF3001 product line delivers application-specific PMICs for NXP's i.MX application processors, with MC34PF3001A4EP engineered specifically for i.MX 6 SoloX + DDR3 systems requiring industrial temperature operation and deterministic power sequencing.
FAQ
What is the default I²C address for the MC34PF3001A4EP?
The MC34PF3001A4EP uses a fixed I²C address of 0x08 across all PF3001 variants. This address cannot be changed via hardware pins or OTP programming. It is used for reading fault registers, adjusting SWx output voltages in runtime, and monitoring LDO status. No external address-select resistors are required-only SCL, SDA, and VDDIO connections are needed for basic I²C communication with the MC34PF3001A4EP.
How does the MC34PF3001A4EP support DDR3 memory on i.MX 6SX?
The MC34PF3001A4EP supports DDR3 memory through its pre-programmed A4 OTP configuration: SW2 delivers 3.3 V @ 1.25 A to NVCC_DRAM_CKE and VDDA_1P8 I/O domains, while SW1 supplies 1.375 V @ 2.75 A to the ARM core. Startup sequencing ensures SW2 enables before DDR3 initialization begins, and VCC_SD (3.0 V/1.80 V) accommodates DDR3-compatible SDIO peripherals. This exact rail mapping is validated in NXP's i.MX 6SX DDR3 reference designs for the MC34PF3001A4EP.
Can the MC34PF3001A4EP operate with a 5.0 V input supply?
Yes, the MC34PF3001A4EP supports 5.0 V input via its optional front-end VPWR LDO. Connect VPWR to the 5.0 V rail, ground the VIN pin, populate an external PMOS (e.g., FDMA908PZ), and drive its gate with LDOG. The internal error amplifier regulates VIN to ≤4.5 V for safe operation of internal regulators. Do not apply 5.0 V directly to VIN-this exceeds absolute maximum ratings and will damage the MC34PF3001A4EP.
What is the function of the SD_VSEL pin on the MC34PF3001A4EP?
The SD_VSEL pin on the MC34PF3001A4EP selects the output voltage range of the VCC_SD LDO: logic LOW sets 2.85–3.3 V for standard SD cards, while logic HIGH selects 1.80–1.85 V for UHS-I SD cards and eMMC. The pin is buffered by VDDIO, so it defaults to HIGH (1.8 V mode) if VDDIO is absent-ensuring safe boot with low-voltage storage. This dual-range capability is fixed in the MC34PF3001A4EP's A4 OTP configuration.
Does the MC34PF3001A4EP include battery backup for RTC functionality?
Yes, the MC34PF3001A4EP integrates dedicated RTC power management via the VSNVS rail (3.0 V, 1.0 mA) and LICELL pin. When main power (VIN) is present, the LICELL circuit charges an external coin cell; during power loss, the coin cell automatically supplies VSNVS to maintain i.MX 6SX's SNVS domain, preserving secure non-volatile storage and real-time clock operation. This functionality is active in all MC34PF3001A4EP operating modes and requires no I²C configuration.
MC34PF3001A4EP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Processor
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-HVQFN (7x7)
MC34PF3001A4EP FAQ
1.How can I place an order for MC34PF3001A4EP through Aetrix?
Please submit a Request for Quotation (RFQ) for MC34PF3001A4EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC34PF3001A4EP reliable?
The price and inventory of MC34PF3001A4EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC34PF3001A4EP is usually 5 days.
3.What payment methods are accepted for MC34PF3001A4EP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC34PF3001A4EP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC34PF3001A4EP?
MC34PF3001A4EP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC34PF3001A4EP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC34PF3001A4EP?
For technical support, including MC34PF3001A4EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC34PF3001A4EP requirements.
6.How does Aetrix verify that MC34PF3001A4EP is sourced from the original manufacturer or authorized distributors?
All MC34PF3001A4EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC34PF3001A4EP meets industry standards.
7.What is the process for return or replacement of MC34PF3001A4EP?
All MC34PF3001A4EP units undergo pre-shipment inspection (PSI). If there is an issue with MC34PF3001A4EP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC34PF3001A4EP part is unused and in its original packaging.
Return procedure for MC34PF3001A4EP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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