My Inquiry
My Account
NXP Semiconductors MC34PF3001A6EPR2
- Part No.:
- MC34PF3001A6EPR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC34PF3001A6EPR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX7 PRE-
- Quantity:
- Payment:
- Shipping:
Inventory:3,994
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC34PF3001A6EPR2 from NXP Semiconductors is a fixed-configuration Power Management IC (PMIC) optimized for i.MX 6UL processors with LPDDR2 memory, delivering three buck regulators (SW1: 2.75 A, SW2: 1.25 A, SW3: 1.5 A), seven LDOs including VCC_SD and V33, and RTC backup power via VSNVS (3.0 V, 1.0 mA). It supports I²C programmability and dynamic voltage scaling in industrial temperature range (−40 °C to +105 °C).
For engineers reviewing the MC34PF3001A6EPR2 datasheet, MC34PF3001A6EPR2 pinout, MC34PF3001A6EPR2 application, or MC34PF3001A6EPR2 equivalent, this page provides verified regulator output ranges, OTP-programmed startup sequence (SW1=1.4 V, SW2=3.3 V, SW3=1.2 V), thermal-safe QFN-48 wettable flank package details, and validated alternatives for i.MX 6UL-based industrial control and medical monitoring designs.
Technical Context
The MC34PF3001A6EPR2 implements a fixed OTP-configured power tree with pre-defined sequencing: SW1 powers the core (VDD_ARM) at 1.4 V, SW2 supplies I/O rails (e.g., NVCC_DRAM_CKE) at 3.3 V, and SW3 delivers memory interface voltage (e.g., DDR3L) at 1.2 V. Startup timing is governed by a trimmed 32 kHz clock with SEQ_CLK_SPEED = 2000 µs and PWRON level-sensitive triggering.
All three buck regulators support APS (pulse-skipping), PWM, and PFM modes; SW1 features dynamic voltage scaling with 25 mV step resolution; VCC_SD output is selectable between 1.85 V (SD_VSEL=1) and 3.3 V (SD_VSEL=0); and the VSNVS rail maintains RTC/supply monitoring during main power loss using coin-cell backup.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input voltage range | 2.8 V–4.5 V (VIN) or 3.7 V–5.5 V (VPWR with external PMOS) |
| SW1 output | 1.4 V fixed (OTP A6), 2.75 A max, supports DVS for i.MX 6UL core |
| SW2 output | 3.3 V fixed (OTP A6), 1.25 A max, powers DDR3L I/O and peripherals |
| SW3 output | 1.2 V fixed (OTP A6), 1.5 A max, supplies LPDDR2 memory interface |
| VCC_SD output | Selectable 1.85 V / 3.3 V via SD_VSEL pin, 100 mA, for SD card interface |
| VSNVS output | 3.0 V, 1.0 mA, RTC/supply monitoring rail with coin-cell charging capability |
| Operating temperature | −40 °C to +105 °C, qualified for industrial applications |
| Package | 48-pin QFN 7.0 mm × 7.0 mm, wettable flank (98ASA00933D) |
Pinout & Package
MC34PF3001A6EPR2 uses a 48-pin QFN (7.0 mm × 7.0 mm, wettable flank, exposed pad) with GND-connected EP for thermal dissipation. Pin functions are defined per NXP PF3001 Rev. 5.1 datasheet Section 7.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1IN / SW1LX (Pins 7,8,9,10) | Buck 1 power path | SW1IN accepts input (VIN or VPWR-derived); SW1LX connects to external inductor; dual pins provide current sharing and layout robustness |
| SW2FB / SW2LX (Pins 17,19) | Buck 2 feedback & switching node | SW2FB enables precision regulation of 3.3 V output; SW2LX drives external inductor for DDR3L I/O supply |
| VCC_SD / SD_VSEL (Pins 33,2) | SD card voltage selection | VCC_SD delivers regulated 1.85 V or 3.3 V based on logic level at SD_VSEL; critical for high-speed SDIO compliance |
| VSNVS / LICELL (Pins 34,36) | RTC backup supply | VSNVS provides always-on 3.0 V rail; LICELL supports coin-cell charging and seamless switchover during main power loss |
| I²C interface (Pins 45,46,47) | Configuration & monitoring | SDA/SCL/VDDIO enable runtime register access; VDDIO must be ≤ VIN and ≥1.7 V for proper I²C operation |
| RESETBMCU / INTB (Pins 3,1) | System control signaling | RESETBMCU deasserts 2.0 ms after final regulator enable; INTB signals faults (e.g., overvoltage, thermal) as open-drain interrupt |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configured startup sequence | Fixed A6 configuration: SW1 (1.4 V, seq=3), SW2 (3.3 V, seq=3), SW3 (1.2 V, seq=3), VCC_SD (3.3 V/1.85 V, seq=3) - eliminates boot-time configuration overhead |
| Triple-buck architecture with DVS | SW1 supports dynamic voltage scaling at 25 mV steps for i.MX 6UL core power optimization across performance states |
| VCC_SD dual-voltage LDO | Hardware-selectable 1.85 V or 3.3 V output via SD_VSEL pin - meets JEDEC SD specification for both UHS-I and legacy modes |
| VSNVS with coin-cell charger | Integrated RTC supply + Li-ion/Li-MnO₂ battery charging circuitry - sustains secure timekeeping and tamper detection during AC loss |
| Front-end VPWR LDO option | Supports 5.5 V input via external PMOS (e.g., FDMA908PZ); internal LDOG gate driver and VPWROV overvoltage protection ensure safe operation |
| Industrial temperature qualification | Rated −40 °C to +105 °C with validated startup, regulation, and fault response - suitable for uncooled industrial HMI and medical edge devices |
Applications
| Industrial HMI Panels | Medical Edge Gateways |
|---|---|
|
Use Scenario: Fanless, sealed enclosure running Linux on i.MX 6UL with DDR3L and dual-display output. IC Role / Device Role / Timing Role: MC34PF3001A6EPR2 supplies VDD_ARM (1.4 V), DDR3L I/O (3.3 V), and memory interface (1.2 V) with synchronized startup and DVS for CPU frequency scaling. Use Value: Eliminates discrete DC-DC + LDO count; OTP A6 sequence matches i.MX 6UL LPDDR2 timing requirements without firmware intervention. |
Use Scenario: Portable patient monitor with ECG, SpO₂, and Wi-Fi connectivity requiring secure RTC and low-power sleep modes. IC Role / Device Role / Timing Role: MC34PF3001A6EPR2 delivers core, memory, and peripheral rails while maintaining VSNVS (3.0 V) and charging backup coin cell during mains operation. Use Value: Integrated coin-cell charging and 1.0 mA VSNVS load capability ensure >72-hour RTC hold-up without external circuitry. |
| Smart Energy Meters | Ruggedized POS Terminals |
|
Use Scenario: DIN-rail mounted meter with PLC communication, tamper detection, and 10-year battery-backed logging. IC Role / Device Role / Timing Role: MC34PF3001A6EPR2 powers i.MX 6UL SoC and isolated RS-485 PHY; VSNVS enables secure timestamping and cryptographic key storage. Use Value: −40 °C to +105 °C rating ensures reliability in outdoor enclosures; OTP-fixed sequencing prevents boot failure under voltage transients. |
Use Scenario: Drop-tested retail terminal with EMV contactless reader, thermal printer, and barcode scanner operating in wide ambient temperatures. IC Role / Device Role / Timing Role: MC34PF3001A6EPR2 supplies 3.3 V for USB OTG PHY (VDDA_USBx_3P3), 1.85 V for SD card, and 1.2 V for LPDDR2 in compact layout. Use Value: Wettable flank QFN-48 enables automated optical inspection; VCC_SD dual-voltage support simplifies SDIO interface design across payment card readers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF3001A6ES | Same OTP A6 configuration and pinout; automotive-grade (−40 °C to +105 °C) with AEC-Q100 qualification | Validated for automotive infotainment head units; includes enhanced ESD and transient immunity testing | Select when AEC-Q100 compliance or extended reliability validation is required beyond industrial specs |
| PF8200A6EPR2 | Successor PMIC with higher integration: adds 4th buck (1.5 A), 2x more LDOs, and enhanced I²C register set; same QFN-48 footprint | Supports i.MX 8M Mini and newer SoCs; requires updated firmware for register mapping and sequencing | Choose for new designs targeting longer product lifecycle or future SoC migration; not drop-in for existing MC34PF3001A6EPR2 layouts |
Compared with MC34PF3001A6EPR2, MC33PF3001A6ES offers identical electrical behavior with automotive qualification overhead, while PF8200A6EPR2 provides expanded rail count and SoC compatibility at the cost of firmware redesign - neither is pin-compatible without layout or software updates.
Availability
MC34PF3001A6EPR2 is available at Aetrix Electronics and suitable for industrial HMI panels, medical edge gateways, smart energy meters, and ruggedized POS terminals requiring stable component supply across extended temperature operation and long-term production cycles.
Supply support for MC34PF3001A6EPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure, scalable solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and power management.
The PF3001 product line was engineered specifically to deliver single-chip, OTP-optimized power solutions for NXP's i.MX 6 and i.MX 7 processor families - minimizing BOM count and enabling rapid, reliable system bring-up in resource-constrained embedded designs.
FAQ
What is the default I²C address for MC34PF3001A6EPR2?
The default I²C address for MC34PF3001A6EPR2 is 0x08, consistent across all PF3001 variants. This 7-bit address is hard-coded in OTP and cannot be altered. Communication requires pull-up resistors (4.7 kΩ) on SDA and SCL lines referenced to VDDIO, which must be powered within 1.7 V–3.6 V and remain ≤ VIN. The MC34PF3001A6EPR2 responds only to this address unless reprogrammed via factory tools - a process not supported in field operation.
How does the OTP configuration A6 affect MC34PF3001A6EPR2's startup behavior?
The A6 OTP configuration in MC34PF3001A6EPR2 fixes SW1 to 1.4 V (core), SW2 to 3.3 V (I/O), SW3 to 1.2 V (LPDDR2), and sets all three regulators to sequence step 3 with 2000 µs clock speed. VCC_SD defaults to 3.3 V/1.85 V selection, and DVS slew rate is fixed at 6.25 mV/µs. This eliminates runtime initialization but means voltage levels and timing cannot be modified post-manufacture - MC34PF3001A6EPR2 must be selected based on exact i.MX 6UL + LPDDR2 system requirements.
Can MC34PF3001A6EPR2 support input voltages above 4.5 V?
Yes - MC34PF3001A6EPR2 supports up to 5.5 V input via the VPWR pin when an external P-channel MOSFET (e.g., FDMA908PZ) is used with the internal LDOG driver. In this mode, VIN is derived from VPWR through the external LDO, keeping internal regulator inputs ≤4.5 V. If input is ≤4.5 V, VPWR must be grounded and VIN used directly. The MC34PF3001A6EPR2 includes VPWROV detection (trip ~6.0 V) and asserts INTB if overvoltage occurs.
What is the role of the SD_VSEL pin on MC34PF3001A6EPR2?
The SD_VSEL pin on MC34PF3001A6EPR2 selects the output voltage of the VCC_SD LDO: logic high (≥0.7×VDDIO) configures 1.85 V for UHS-I SD cards, while logic low configures 3.3 V for legacy SDIO. Its input buffer is powered by VDDIO, and absence of VDDIO causes automatic fallback to high state - ensuring safe default operation. This hardware-controlled selection eliminates I²C register writes and guarantees correct SD interface voltage before host initialization.
Does MC34PF3001A6EPR2 include thermal protection?
Yes - MC34PF3001A6EPR2 integrates thermal foldback and shutdown circuitry. When die temperature exceeds ~150 °C, the device reduces switching frequency and current limits; at ~165 °C, it forces all regulators into OFF mode and asserts INTB. Recovery occurs only after temperature falls below ~140 °C and a valid PWRON signal is detected. This behavior is hard-coded in OTP and active across all operating modes - no configuration is needed to enable thermal safety in MC34PF3001A6EPR2.
MC34PF3001A6EPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Processor
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-HVQFN (7x7)
MC34PF3001A6EPR2 FAQ
1.How can I place an order for MC34PF3001A6EPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC34PF3001A6EPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC34PF3001A6EPR2 reliable?
The price and inventory of MC34PF3001A6EPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC34PF3001A6EPR2 is usually 5 days.
3.What payment methods are accepted for MC34PF3001A6EPR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC34PF3001A6EPR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC34PF3001A6EPR2?
MC34PF3001A6EPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC34PF3001A6EPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC34PF3001A6EPR2?
For technical support, including MC34PF3001A6EPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC34PF3001A6EPR2 requirements.
6.How does Aetrix verify that MC34PF3001A6EPR2 is sourced from the original manufacturer or authorized distributors?
All MC34PF3001A6EPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC34PF3001A6EPR2 meets industry standards.
7.What is the process for return or replacement of MC34PF3001A6EPR2?
All MC34PF3001A6EPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC34PF3001A6EPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC34PF3001A6EPR2 part is unused and in its original packaging.
Return procedure for MC34PF3001A6EPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC34PF3001A6EPR2 Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
