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NXP Semiconductors MC34PF4210A3ESR2
- Part No.:
- MC34PF4210A3ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC34PF4210A3ESR2.pdf
- Description:
- PF4210
- Quantity:
- Payment:
- Shipping:
Inventory:1,056
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Product details
Overview
MC34PF4210A3ESR2 from NXP Semiconductors is a 14-channel programmable PMIC optimized for i.MX 8M-based audio/video systems, integrating six buck converters (including SW1A/B/C, SW2, SW3A/B, SW4), six LDOs (VGEN1–VGEN6), a 5.0 V boost regulator (SWBST), DDR termination reference (VREFDDR), and coin cell charger with RTC supply. It delivers up to 4.5 A on SW1A/B/C, supports dynamic voltage scaling, and operates across −40 °C to 105 °C.
For engineers reviewing the MC34PF4210A3ESR2 datasheet, MC34PF4210A3ESR2 pinout, MC34PF4210A3ESR2 application, or MC34PF4210A3ESR2 equivalent, key selection criteria include industrial-temperature operation (−40 °C to 105 °C), OTP-configurable power sequencing for i.MX 8M processors, DDR memory reference accuracy (0.6–0.9 V), and I²C-programmable buck/LDO output voltages and timing.
Technical Context
The MC34PF4210A3ESR2 implements a fully configurable multi-rail architecture with independent control logic per regulator group: SW1A/B/C supports single/dual-phase or parallel configurations with DDR termination tracking mode; SW2 and SW3A/B offer 2.5 A and 3.0 A outputs respectively with programmable soft-start, OCP, and PWM/PPM modes; SW4 provides 1.0 A with VTT tracking capability. All buck regulators accept 2.8–4.5 V input and support dynamic voltage scaling.
Its control subsystem includes an I²C interface (SDA/SCL), OTP memory for startup sequence storage, dedicated processor interface signals (PWRON, STANDBY, RESETBMCU, SDWNB, INTB), and thermal monitoring with four interrupt thresholds (110 °C to 130 °C). The device uses a 56-pin QFN 8×8 mm wettable flank package with exposed thermal pad and supports coin-cell backup (LICELL) for SNVS domain retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Operating Temp Range | −40 °C to 105 °C - qualified for industrial-grade embedded audio/video applications requiring extended thermal reliability |
| Buck Regulators | Up to 6 channels: SW1A/B/C (4.5 A total), SW2 (2.5 A), SW3A/B (3.0 A), SW4 (1.0 A) - enables full SoC power delivery including core, memory, and peripherals |
| LDO Outputs | 6 programmable LDOs: VGEN1–VGEN6 (100–350 mA, 0.8–3.3 V range) - powers low-noise analog/audio blocks and I/O rails independently |
| Boost Output | SWBST: 5.0–5.15 V @ 600 mA - supplies USB OTG and 5 V peripherals without external boost IC |
| VREFDDR Accuracy | 0.6–0.9 V ±1.5% - meets LPDDR4/LPDDR4X termination reference tolerance for stable memory interface operation |
| I²C Interface | Standard-mode (100 kHz) and fast-mode (400 kHz) compatible - enables real-time rail reconfiguration and fault reporting in system firmware |
| Quiescent Current | Standby mode: 297–550 µA - minimizes power loss during low-activity states while maintaining full rail readiness |
Pinout & Package
MC34PF4210A3ESR2 uses a 56-pin QFN 8×8 mm package with 0.5 mm pitch and wettable flank (WF-type) for enhanced solder joint inspection and thermal performance. The exposed pad (EP) serves as primary ground return for buck regulators and must be connected to internal/external ground planes via multiple vias.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1AIN / SW1BIN / SW1CIN | Buck input supply pins | Accept 2.8–4.5 V main input; require local 4.7 µF + 0.1 µF ceramic decoupling for stable high-current switching |
| SW1ALX / SW1BLX / SW1CLX / SW2LX / SW3ALX / SW3BLX / SW4LX / SWBSTLX | Switch node outputs | Drive external inductors; routing requires tight loop area and separation from sensitive analog traces |
| SW1FB / SW2FB / SW3AFB / SW3BFB / SW4FB / SWBSTFB | Voltage feedback inputs | Monitor regulated output at capacitor; must be routed separately from high-current paths to avoid noise coupling |
| VGEN1–VGEN6 | LDO outputs | Provide 100–350 mA low-noise supplies; each requires specified output capacitance (2.2–4.7 µF) per datasheet |
| VREFDDR / VINREFDDR / VHALF | DDR reference circuitry | Enable precise 0.6–0.9 V termination voltage generation; VHALF provides half-supply bias for internal reference |
| PWRON / STANDBY / RESETBMCU / SDWNB / INTB | Processor interface signals | Open-drain digital I/O (3.6 V max); enable coordinated power sequencing, fault signaling, and reset management with i.MX 8M |
| SDA / SCL / VDDIO | I²C communication interface | Support standard/fast-mode I²C; VDDIO sets logic level (1.7–3.6 V) and must be bypassed with 0.1 µF capacitor |
| LICELL / VSNVS | Coin cell interface | Supports 1.8–3.3 V coin cell backup; VSNVS delivers 1.0/1.1/1.2/1.3/1.5/1.8/3.0 V @ 1.0 mA (industrial) to SNVS domain |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable startup sequence | Enables factory-programmed power-up timing and voltage ramping for i.MX 8M without runtime I²C initialization |
| DDR termination tracking (SW4) | Automatically tracks SW3A output to generate precise VTT = 0.5 × VDDQ for LPDDR4 interfaces |
| Dual-mode buck regulation (PWM/PPM) | Switches between fixed-frequency PWM and pulse-skipping PFM to optimize efficiency across light-to-heavy loads |
| Thermal protection with hysteresis | Four interrupt thresholds (110–130 °C) plus 130–150 °C shutdown; 2–4 °C hysteresis prevents oscillation during thermal transients |
| Programmable current limit per buck | Per-regulator OCP setting avoids overcurrent damage during short-circuit or inrush events without affecting other rails |
| VSNVS dual-source capability | Seamlessly switches between VIN and coin cell to maintain always-on SNVS domain during main supply interruption |
Applications
| OTT Streaming Set-Top Box | Wireless Audio System |
|---|---|
Use Scenario: Compact, fanless media player with i.MX 8M Nano, HDMI output, Wi-Fi, and audio DAC. IC Role / Device Role / Timing Role: Primary PMIC delivering all core, memory, I/O, and peripheral rails; sequences power to CPU, GPU, DDR, and audio codec. Use Value: Eliminates need for discrete DC/DC and LDOs; OTP preconfiguration reduces boot time by 120 ms vs. I²C-initiated startup. |
Use Scenario: Battery-powered smart speaker with voice assistant, Bluetooth LE, and Class-D amplifier. IC Role / Device Role / Timing Role: Manages battery-to-rail conversion, low-power standby, and coin-cell-backed RTC for wake-on-voice. Use Value: 297 µA standby current extends battery life to >12 months; VSNVS 1.0 mA output sustains SNVS domain during deep sleep. |
| Voice Recognition Assistant | Sound Bar with HDMI ARC |
Use Scenario: Always-listening edge device using i.MX 8M Mini with far-field mic array and neural inference accelerator. IC Role / Device Role / Timing Role: Supplies variable-core-voltage rails (SW1A/B/C) for DVFS-enabled CPU/GPU; powers mic bias and ADC LDOs (VGEN2/VGEN4). Use Value: Dynamic voltage scaling cuts active power by 35% during low-compute voice detection phases. |
Use Scenario: Multi-channel audio system with HDMI ARC input, DSP, and high-fidelity amplifiers. IC Role / Device Role / Timing Role: Generates clean 1.8 V (VGEN4), 3.3 V (VGEN3/VGEN5), and DDR reference (VREFDDR) for HDMI PHY and memory interface. Use Value: ±1.5% VREFDDR accuracy ensures stable LPDDR4 operation at 3200 MT/s; wettable flank QFN aids automated optical inspection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF4210A4ESR2 | Identical architecture and pinout; rated for same −40 °C to 105 °C range but with A4 OTP configuration | Preprogrammed for MCIMX8M-EVK reference design; differs in default startup sequence and rail enable timing | Select A4 if targeting NXP's i.MX 8M evaluation kit; A3 offers identical thermal rating with custom OTP flexibility |
| MPQ4436-AEC1 | Automotive-qualified 4-channel buck (3.5 A max), no integrated LDOs, no DDR reference, no coin cell charger | Designed for ADAS camera modules; lacks VREFDDR, VSNVS, and OTP sequencing required for i.MX 8M audio/video use | Use only if replacing discrete buck converters in non-i.MX systems; cannot substitute for full PF4210 functionality |
Compared with MC34PF4210A4ESR2, the MC34PF4210A3ESR2 provides identical industrial temperature operation and hardware capability but allows field-programmable OTP configuration instead of fixed EVK alignment; versus MPQ4436-AEC1, it delivers complete i.MX 8M power architecture-including DDR reference, coin-cell backup, and 14-channel integration-unavailable in automotive-only buck controllers.
Availability
MC34PF4210A3ESR2 is available at Aetrix Electronics and suitable for OTT STB, wireless audio, and voice recognition assistant designs requiring stable component supply across industrial temperature ranges and long-term production continuity.
Supply support for MC34PF4210A3ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and associated power management.
The PF4210 product line was designed specifically to deliver complete, configurable power solutions for NXP's i.MX 8M family of multimedia processors, emphasizing low quiescent current, DDR memory interface support, and robust industrial-temperature operation.
FAQ
What is the operating temperature range for MC34PF4210A3ESR2?
The MC34PF4210A3ESR2 is rated for −40 °C to 105 °C ambient operation, making it suitable for industrial-grade audio/video equipment deployed in uncontrolled environments. This specification matches the MC34PF4210A4ESR2 variant and exceeds the consumer-grade MC32PF4210 series (0 °C to 85 °C). Thermal protection activates at 130 °C with 150 °C shutdown threshold.
Does MC34PF4210A3ESR2 support DDR memory termination?
Yes, MC34PF4210A3ESR2 supports DDR termination through its dedicated VREFDDR output (0.6–0.9 V ±1.5%) and SW4 tracking mode, which generates VTT = 0.5 × VDDQ for LPDDR4 interfaces. The VREFDDR rail is internally referenced to VHALF and VINREFDDR, ensuring stability under load transients critical for high-speed memory operation.
How does the coin cell backup function work on MC34PF4210A3ESR2?
The MC34PF4210A3ESR2 uses the LICELL pin to accept 1.8–3.3 V coin cell input and powers the VSNVS rail (configurable 1.0/1.1/1.2/1.3/1.5/1.8/3.0 V) at 1.0 mA for industrial versions. During main supply loss, it automatically switches to coin cell to sustain the SNVS domain in i.MX 8M processors, enabling RTC operation and wake-on-event functionality without external circuitry.
Can MC34PF4210A3ESR2 be used with processors other than i.MX 8M?
While MC34PF4210A3ESR2 was architected for i.MX 8M compatibility-including specific power sequencing, VREFDDR, and SNVS interface-the underlying 14-channel architecture (6 bucks, 6 LDOs, boost, RTC) can support other ARM-based SoCs. However, OTP configuration, register map, and I²C command set are optimized for NXP's platform; custom firmware adaptation is required for non-i.MX use.
What package type and thermal characteristics does MC34PF4210A3ESR2 have?
MC34PF4210A3ESR2 uses a 56-pin QFN 8×8 mm package with 0.5 mm pitch and wettable flank (WF-type) construction. Its thermal resistance is RΘJA = 15 °C/W on an eight-layer board, RΘJB = 10 °C/W junction-to-board, and RΘJCBOTTOM = 1.2 °C/W junction-to-case bottom, enabling reliable operation at full load in compact industrial enclosures without forced airflow.
MC34PF4210A3ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Audio, Video
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 4.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-QFN-EP (8x8)
MC34PF4210A3ESR2 FAQ
1.How can I place an order for MC34PF4210A3ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC34PF4210A3ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC34PF4210A3ESR2 reliable?
The price and inventory of MC34PF4210A3ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC34PF4210A3ESR2 is usually 5 days.
3.What payment methods are accepted for MC34PF4210A3ESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC34PF4210A3ESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC34PF4210A3ESR2?
MC34PF4210A3ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC34PF4210A3ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC34PF4210A3ESR2?
For technical support, including MC34PF4210A3ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC34PF4210A3ESR2 requirements.
6.How does Aetrix verify that MC34PF4210A3ESR2 is sourced from the original manufacturer or authorized distributors?
All MC34PF4210A3ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC34PF4210A3ESR2 meets industry standards.
7.What is the process for return or replacement of MC34PF4210A3ESR2?
All MC34PF4210A3ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC34PF4210A3ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC34PF4210A3ESR2 part is unused and in its original packaging.
Return procedure for MC34PF4210A3ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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