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NXP Semiconductors MC34PF4210A4ESR2
- Part No.:
- MC34PF4210A4ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC34PF4210A4ESR2.pdf
- Description:
- PF4210
- Quantity:
- Payment:
- Shipping:
Inventory:4,683
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Product details
Overview
MC34PF4210A4ESR2 from NXP Semiconductors is a 14-channel programmable PMIC optimized for i.MX 8M-based audio/video systems, integrating six buck converters (including SW1A/B/C, SW2, SW3A/B, SW4), six LDOs (VGEN1–VGEN6), a 5.0 V boost regulator (SWBST), coin cell charger, and DDR reference (VREFDDR). It delivers precise power sequencing, dynamic voltage scaling, and OTP-configurable startup for consumer and industrial A/V applications.
For engineers reviewing the MC34PF4210A4ESR2 datasheet, MC34PF4210A4ESR2 pinout, MC34PF4210A4ESR2 application, or MC34PF4210A4ESR2 equivalent, this page provides verified technical context, validated pin functions, confirmed thermal protection thresholds (110–130 °C), I²C-programmable rail voltages (e.g., VGEN2: 0.8–1.55 V/250 mA), and industrial-grade operating range (−40 °C to 105 °C).
Technical Context
The MC34PF4210A4ESR2 implements a fully configurable multi-rail architecture with up to six independent buck outputs-SW1A/B/C supports dual-phase or split 2.5 A + 2.0 A operation; SW3A/B offers 3.0 A single/dual or 1.5 A + 1.5 A independent modes; SW4 enables DDR termination tracking at 50% of SW3A output. All bucks support PWM/PFM/APS modes, programmable soft-start, and OCP with fault interrupt.
Control logic integrates I²C register mapping, OTP-based startup sequence storage, and dedicated processor interface signals including open-drain INTB (fault), SDWNB (imminent shutdown), RESETBMCU (configurable reset/fault indicator), and STANDBY (active-high/low entry into low-power mode). Thermal protection includes four interrupt thresholds (THERM110I–THERM130I) and a 130–150 °C fail-safe shutdown with 8 ms debounce.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | VIN = 2.8 V to 4.5 V - supports Li-ion, USB, or DC-DC pre-regulator inputs without external level-shifting |
| Buck Output Count & Configurability | 4–6 channels - SW1A/B/C, SW2, SW3A/B, SW4; SW1/SW3 support single/dual-phase or independent operation per datasheet Table 6 |
| Boost Regulator Output | SWBST = 5.0 V to 5.15 V / 600 mA - enables USB OTG host functionality with PFM/auto mode selection |
| VGEN LDO Outputs | VGEN1–VGEN6: 0.8–3.3 V / 100–350 mA - six independently programmable rails for audio codec, camera, Wi-Fi, and peripheral biasing |
| VSNVS Output Current | 1.0 mA (industrial) - powers i.MX 8M SNVS domain during main supply loss, backed by coin cell or VIN |
| Thermal Shutdown Threshold | 130–150 °C - hardware-level fail-safe cutoff with 2–4 °C hysteresis prevents thermal runaway under sustained overload |
| Operating Temperature | −40 °C to 105 °C - qualified for industrial A/V receivers, sound bars, and embedded OTT STBs |
Pinout & Package
MC34PF4210A4ESR2 uses a 56-pin QFN package (8 mm × 8 mm, 0.5 mm pitch, wettable flank), with exposed thermal pad (EP) tied to GNDREF for junction-to-board thermal resistance of 10 °C/W.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1ALX / SW1BLX / SW1CLX | Buck switch node outputs | Drive external inductors for SW1A/B/C regulators; require low-ESR ceramic capacitors and Kelvin feedback routing |
| VGEN2 / VGEN4 / VGEN6 | LDO outputs | VGEN2 = 0.8–1.55 V / 250 mA for core logic; VGEN4 = 1.8–3.3 V / 350 mA for audio codec; VGEN6 = 1.8–3.3 V / 200 mA for camera sensor |
| INTB / SDWNB / RESETBMCU | Open-drain digital outputs | INTB signals faults (OCP, thermal, UVLO); SDWNB asserts one 32 kHz cycle before shutdown; RESETBMCU serves as processor reset or fault indicator |
| SCL / SDA / VDDIO | I²C interface | 3.6 V-tolerant bus (VDDIO-supplied) enabling direct connection to i.MX 8M GPIOs without level shifters |
| VIN / VIN1 / VIN2 / VIN3 | Main and auxiliary input supplies | VIN powers core regulators; VIN1/VIN2/VIN3 feed VGEN1/VGEN3/VGEN5 and VGEN2/VGEN4/VGEN6 respectively - decoupling required per pin |
| VREFDDR / VINREFDDR / VHALF | DDR reference subsystem | VREFDDR = 0.6–0.9 V / 10 mA precision reference; VINREFDDR accepts input; VHALF sets half-supply for tracking accuracy |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable startup sequence | One-time programmable memory stores rail enable order, timing delays, and voltage targets - eliminates external configuration EEPROM |
| Dual-mode buck regulation (PWM/PFM) | Automatic transition between high-efficiency PFM at light load and stable PWM at full load - maintains <10 mV ripple across 0–100% load |
| DDR termination tracking (SW4) | SW4 dynamically tracks 50% of SW3A output to generate precise VTT for LPDDR4 interfaces - no external resistor divider needed |
| Coin cell charger + VSNVS LDO/switch | Charges 1.8–3.3 V coin cells while supplying 1.0 mA SNVS domain; bypass mode enables direct VIN-to-VSNVS path during main power availability |
| Four-tier thermal interrupt system | THERM110I–THERM130I interrupts allow firmware to throttle CPU, reduce display brightness, or initiate graceful shutdown before 130 °C shutdown threshold |
| I²C register-mapped fault monitoring | Real-time readback of OCP, UVLO, thermal, and sequencing faults via INTSENSE0–INTSENSE2 registers - enables predictive maintenance in fielded units |
Applications
| OTT Streaming Set-Top Box | Industrial Sound Bar |
|---|---|
Use Scenario: Powering i.MX 8M Nano-based STB with HDMI, Wi-Fi, and voice assistant integration. IC Role / Device Role / Timing Role: Central PMIC delivering sequenced 1.0 V core, 1.1 V GPU, 1.8 V memory, 3.3 V peripherals, and 5.0 V USB OTG - synchronized to processor boot timeline. Use Value: Eliminates discrete DC-DCs and LDOs; OTP programming ensures repeatable startup across production units; VREFDDR guarantees LPDDR4 signal integrity. |
Use Scenario: High-reliability audio system operating continuously in factory environments with ambient temperatures up to 105 °C. IC Role / Device Role / Timing Role: Supplies DSP, DAC, amplifier bias, and Bluetooth module with thermally robust 105 °C-rated rails and real-time thermal interrupt reporting. Use Value: Industrial temperature grade avoids derating; SWBST 5.0 V output powers USB-C audio accessories; coin cell backup preserves settings during brownouts. |
| Voice Recognition Assistant | A/V Receiver with HDMI Audio Return Channel |
Use Scenario: Always-on smart speaker using i.MX 8M Mini with far-field mic array and wake-word detection. IC Role / Device Role / Timing Role: Manages ultra-low-power sleep mode (122 µA) with VSNVS-powered SNVS domain, fast wake-up via PWRON edge detection, and dynamic core voltage scaling. Use Value: Sub-250 µA standby current extends battery life in portable variants; programmable STANDBY polarity matches SoC control logic; I²C allows runtime rail adjustment. |
Use Scenario: Multi-format AV receiver supporting HDMI 2.0, eARC, and Dolby Atmos decoding on i.MX 8M Plus. IC Role / Device Role / Timing Role: Powers video processing cores (SW1A/B), audio DSP (VGEN4), HDMI PHY (SW2), and eARC transceiver (SWBST) with independent sequencing and fault isolation. Use Value: Six LDOs eliminate need for external regulators; SW4 DDR tracking ensures HDMI sink compatibility; thermal interrupts prevent overheating during sustained 4K60 playback. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF4210A3ES | Same silicon, −40 °C to 105 °C rating, A3 OTP configuration - lacks industrial VSNVS current spec (1.0 mA vs A4's 1.0 mA) | Valid for same industrial A/V applications but requires verification of VSNVS load margin under worst-case temp | Select A4 for guaranteed 1.0 mA VSNVS at 105 °C; A3 may suffice if SNVS load ≤ 0.9 mA |
| MPQ4232-AEC1 | Monolithic 4-channel buck (no LDOs, no OTP, no DDR ref) - 3.3–36 V input, automotive AEC-Q100 Grade 1 | Targets automotive infotainment, not i.MX 8M A/V - lacks I²C, sequencing, VREFDDR, and coin cell support | Use only when replacing discrete bucks in non-i.MX designs; not a functional substitute for MC34PF4210A4ESR2 |
Compared with MC34PF4210A3ES, the MC34PF4210A4ESR2 guarantees 1.0 mA VSNVS output across full −40 °C to 105 °C range and ships with verified industrial OTP configuration; versus MPQ4232-AEC1, it provides full i.MX 8M power architecture - including six LDOs, DDR reference, coin cell charging, and OTP sequencing - in a single IC.
Availability
MC34PF4210A4ESR2 is available at Aetrix Electronics and suitable for OTT STB, industrial sound bars, and voice recognition assistants requiring stable component supply, long-term lifecycle support, and industrial temperature qualification.
Supply support for MC34PF4210A4ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 50 years of analog and mixed-signal design heritage.
The PF4210 product line was engineered specifically to deliver integrated, OTP-configurable power management for NXP's i.MX 8M family of applications processors in cost-sensitive audio/video applications - balancing high channel count, thermal robustness, and minimal external components.
FAQ
What is the maximum junction temperature and thermal protection behavior of the MC34PF4210A4ESR2?
The MC34PF4210A4ESR2 has an operating junction temperature range of −40 °C to 125 °C, with thermal protection activating at 130–150 °C. Four interrupt thresholds (THERM110I–THERM130I) provide early warning; above 130 °C, a debounced 8 ms hardware shutdown occurs. This protects the IC during sustained overload or poor PCB thermal design. The MC34PF4210A4ESR2's RΘJB of 10 °C/W and exposed pad require proper vias to inner/outer ground planes for reliable operation at 105 °C ambient.
How does the MC34PF4210A4ESR2 support DDR memory termination, and which buck channel enables it?
The MC34PF4210A4ESR2 supports DDR termination via SW4 configured in tracking mode, where its output equals exactly 50% of SW3A's voltage - generating precise VTT for LPDDR4 interfaces. This eliminates external resistor dividers and ensures tracking accuracy across temperature and load. SW4 delivers up to 1.0 A at 0.4–3.3 V and is enabled only when SW3A is active. The MC34PF4210A4ESR2's VREFDDR rail (0.6–0.9 V / 10 mA) provides the complementary reference for DDR I/O buffers.
What are the key differences between the MC34PF4210A4ESR2 and the consumer-grade MC32PF4210A4ES?
The MC34PF4210A4ESR2 is rated for −40 °C to 105 °C industrial operation and delivers 1.0 mA from VSNVS, whereas the MC32PF4210A4ES is consumer-grade (0 °C to 85 °C) with 1.5 mA VSNVS. Both share identical pinout, OTP structure, and functional blocks. The MC34PF4210A4ESR2's higher thermal rating and guaranteed lower VSNVS current make it suitable for enclosed, fanless A/V receivers and industrial sound bars where ambient heat buildup occurs.
Can the MC34PF4210A4ESR2 be used without OTP programming, and what is the default behavior?
Yes - the MC34PF4210A4ESR2 can operate in nonprogrammed mode (A0 variant), but the A4 version is preprogrammed with industrial-qualified voltage levels, sequencing, and timing for i.MX 8M. In nonprogrammed mode, all rails default to 0 V until configured via I²C. The MC34PF4210A4ESR2's OTP memory stores startup parameters permanently; reprogramming is not possible after fuse blow. For production, A4 eliminates I²C initialization overhead and ensures deterministic boot.
What is the purpose of the LICELL pin on the MC34PF4210A4ESR2, and how is it used in system design?
The LICELL pin on the MC34PF4210A4ESR2 serves as bidirectional coin cell interface: it charges 1.8–3.3 V lithium batteries and supplies VSNVS during main power loss. When VIN is present, the internal charger regulates charge current; when VIN drops, LICELL backs up VSNVS to maintain i.MX 8M's SNVS domain (real-time clock, secure keys). System design requires a 10 kΩ series resistor and 1 µF ceramic capacitor on LICELL, per NXP layout guidelines. The MC34PF4210A4ESR2 monitors LICELL voltage and reports faults via INTB.
MC34PF4210A4ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Audio, Video
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 4.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-QFN-EP (8x8)
MC34PF4210A4ESR2 FAQ
1.How can I place an order for MC34PF4210A4ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC34PF4210A4ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC34PF4210A4ESR2 reliable?
The price and inventory of MC34PF4210A4ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC34PF4210A4ESR2 is usually 5 days.
3.What payment methods are accepted for MC34PF4210A4ESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC34PF4210A4ESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC34PF4210A4ESR2?
MC34PF4210A4ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC34PF4210A4ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC34PF4210A4ESR2?
For technical support, including MC34PF4210A4ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC34PF4210A4ESR2 requirements.
6.How does Aetrix verify that MC34PF4210A4ESR2 is sourced from the original manufacturer or authorized distributors?
All MC34PF4210A4ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC34PF4210A4ESR2 meets industry standards.
7.What is the process for return or replacement of MC34PF4210A4ESR2?
All MC34PF4210A4ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC34PF4210A4ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC34PF4210A4ESR2 part is unused and in its original packaging.
Return procedure for MC34PF4210A4ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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