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NXP Semiconductors MC34PF8100A0EPR2
- Part No.:
- MC34PF8100A0EPR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC34PF8100A0EPR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX8 NON-PR
- Quantity:
- Payment:
- Shipping:
Inventory:3,282
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Product details
Overview
MC34PF8100A0EPR2 from NXP Semiconductors is an industrial-grade 12-channel power management IC (PMIC) designed for i.MX 8QXP and i.MX 8QM application processors. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B-compliant monitoring circuitry. It powers CPU cores, LPDDR4/DDR4 memory, I/O rails, and peripherals in high-performance embedded systems.
For engineers reviewing the MC34PF8100A0EPR2 datasheet, MC34PF8100A0EPR2 pinout, MC34PF8100A0EPR2 application, or MC34PF8100A0EPR2 equivalent, this page delivers verified technical context, exact regulator specifications, validated HVQFN56 pin mapping, real-world use cases in automotive infotainment and industrial HMI, and two confirmed alternative PMICs with documented functional differences.
Technical Context
The MC34PF8100A0EPR2 implements a deterministic state machine for fault-aware power sequencing, supporting programmable startup/shutdown sequences, dynamic voltage scaling on six buck channels, and triple/quad-phase configurations (e.g., SW1–SW3 up to 7.5 A, SW1–SW4 up to 10 A). Its 24-channel analog multiplexer enables system-level diagnostics via external sensor inputs.
It features OTP-based configuration storage for voltage setpoints and sequencing, eliminating external resistors; high-speed I²C (3.4 MHz) for runtime reconfiguration; and safety mechanisms including independent voltage/thermal monitoring, ABIST, and fail-safe output (FSOB) - though full ASIL B compliance applies only to PF8200 variants.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Main input range | VIN = 2.7 V to 5.5 V - supports single-supply operation from common system rails without external pre-regulation |
| Buck output range (SW1–SW6) | 0.4 V to 1.8 V in 6.25 mV steps - enables precise core voltage tuning for i.MX 8 CPU/GPU domains |
| Buck output range (SW7) | 1.0 V to 4.1 V - supplies auxiliary rails like eMMC or Ethernet PHY requiring higher voltage |
| LDO output range (LDO1–LDO4) | 1.5 V to 5.0 V, ±3 % accuracy - powers I/O, sensors, and interface logic with low-noise regulation |
| RTC supply (VSNVS) | 1.8 V / 3.0 V / 3.3 V, 10 mA - maintains real-time clock and backup memory during main power loss |
| I²C interface speed | Up to 3.4 MHz - enables fast register access for dynamic power state transitions in Linux/RTOS environments |
| Package | HVQFN56, 8 mm × 8 mm × 0.85 mm, 0.5 mm pitch - thermally enhanced for industrial ambient (−40 °C to +105 °C) |
Pinout & Package
HVQFN56 package with exposed thermal pad (EPAD), wettable flanks (non-step-cut per EP suffix), and 56 terminals. Pin 1 marked by notch; EPAD must be soldered to PCB ground plane for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable closed-loop regulation of each buck output; require external resistor dividers for voltage setting |
| SW1IN–SW7IN | Buck input supplies | Accept VIN or intermediate rail; SW7IN supports higher-voltage inputs up to 5.5 V |
| SW1LX–SW7LX | Switching node outputs | Connect to external inductors; tolerate −3.0 V transient spikes during dead time (layout-critical) |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Deliver low-noise, load-switch-capable power to peripherals; LDO2EN allows hardware-controlled enable |
| VSNVS, LICELL | RTC supply & coin cell input | VSNVS provides backup rail; LICELL accepts 0–4.2 V coin cell with programmable charge current/voltage |
| SCL/SDA, VDDIO | I²C interface | VDDIO sets logic level (1.6–3.3 V); SCL/SDA support Fast Mode Plus (3.4 MHz) timing |
| PGOOD, INTB, RESETBMCU | Status and control outputs | Open-drain signals for system coordination: PGOOD indicates all rails stable; RESETBMCU asserts on fault |
| WDI, EWARN, FSOB | Watchdog & safety interface | WDI feeds internal watchdog; EWARN signals early fault warning; FSOB asserts fail-safe state (non-ASIL B in PF8100) |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable power tree | Stores startup voltages, sequencing order, and soft-start times - eliminates 12+ external resistors and reduces BOM count |
| Dual/triple/quad-phase buck capability | SW1–SW3 configurable as triple-phase (7.5 A), SW1–SW4 as quad-phase (10 A) - meets high-current CPU core demands without external controllers |
| VTT termination mode on SW6 | Supports DDR memory termination (VTT) with programmable current limit - replaces discrete VTT solutions for LPDDR4/DDR4 |
| 24-channel analog multiplexer | Routes external temperature/voltage/sensor signals to internal ADC - enables system health monitoring without external mux IC |
| Programmable standby/off modes | Reduces quiescent current to <10 µA in deep sleep - extends battery life in always-on industrial gateways |
Applications
| Automotive Infotainment Head Unit | Industrial HMI Controller |
|---|---|
|
Use Scenario: Powering i.MX 8QM processor, LPDDR4 memory, display interface, and audio codec in a vehicle head unit operating at −40 °C to +85 °C. IC Role / Device Role / Timing Role: Primary PMIC managing 7 buck rails (CPU, GPU, DDR, I/O), 4 LDOs (audio, touch, CAN transceiver), VSNVS, and watchdog. Use Value: Single-chip solution replaces 11 discrete regulators; OTP sequencing ensures reliable cold-start; VTT mode supports LPDDR4 termination. |
Use Scenario: Supplying i.MX 8QXP SoC, eMMC, Ethernet PHY, and industrial I/O in a factory-floor HMI panel with extended temperature requirements. IC Role / Device Role / Timing Role: Central power controller delivering 1.0 V (SW7), 1.1 V (SW1), 1.8 V (SW6/VTT), 3.3 V (LDO2), and 5.0 V (LDO4) with coordinated sequencing. Use Value: 3.4 MHz I²C enables rapid DVFS transitions during UI rendering; 24-channel AMUX monitors board temperature and rail margins. |
| Edge AI Gateway | High-End Consumer STB |
|
Use Scenario: Powering i.MX 8QM with NPU acceleration, dual LPDDR4 channels, PCIe SSD, and Wi-Fi/BT module in a network edge appliance. IC Role / Device Role / Timing Role: Dual-role PMIC: SW1–SW4 supply CPU/NPU cores (quad-phase), SW5–SW6 handle memory rails, SW7 powers PCIe switch. Use Value: Quad-phase configuration delivers 10 A at 0.8 V with <1.5 % output error; spread-spectrum reduces EMI in dense RF environments. |
Use Scenario: Supporting i.MX 8QXP-based set-top box with 4K video decode, HDMI, USB 3.0, and DRAM - operating in consumer ambient (0 °C to +70 °C). IC Role / Device Role / Timing Role: Regulator hub providing 1.1 V (CPU), 1.2 V (GPU), 1.8 V (LPDDR4), 3.3 V (HDMI PHY), and 5.0 V (USB). Use Value: Programmable soft-start prevents inrush current on hot-plug USB devices; LDO load-switch mode isolates unused peripherals to reduce leakage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF8200A0EPR2 | ASIL B certified; adds ABIST on-demand, secure I²C write, FSOB fail-safe assertion, and CRC-protected mirror registers | Required for ISO 26262 ASIL B automotive systems; not needed for industrial QM-grade designs | Select MC34PF8200A0EPR2 only when functional safety certification is mandatory; MC34PF8100A0EPR2 suffices for non-safety-critical industrial use |
| MC33PF8100A0ESR2 | Automotive-grade (AEC-Q100 Grade 2); identical regulator topology but rated for −40 °C to +105 °C with tighter OTP validation | Validated for under-hood automotive environments; includes step-cut wettable flanks for automated optical inspection | Choose MC33PF8100A0ESR2 for automotive production; MC34PF8100A0EPR2 is optimized for cost-sensitive industrial designs with same electrical specs |
Compared with MC34PF8200A0EPR2, the MC34PF8100A0EPR2 omits safety-critical firmware and hardware blocks, reducing cost and complexity for industrial applications where ASIL B is unnecessary. Against MC33PF8100A0ESR2, it trades automotive qualification for lower unit price while retaining identical power architecture and pin compatibility.
Availability
MC34PF8100A0EPR2 is available at Aetrix Electronics and suitable for automotive infotainment head units, industrial HMI controllers, and edge AI gateways requiring stable component supply, long-term lifecycle support, and industrial temperature operation.
Supply support for MC34PF8100A0EPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with over 40 years of microcontroller and power management expertise.
The PF8100 product line targets high-performance application processors (i.MX 8/S32x), delivering integrated, OTP-configurable power trees that reduce design cycle time and eliminate external sequencing components for complex SoC platforms.
FAQ
What is the primary function of the MC34PF8100A0EPR2 in an i.MX 8-based system?
The MC34PF8100A0EPR2 serves as the central power management IC for i.MX 8QXP and i.MX 8QM processors, delivering 12 regulated rails - seven buck converters (SW1–SW7), four LDOs (LDO1–LDO4), and RTC supply (VSNVS). It executes OTP-programmed power-up/down sequences, supports dynamic voltage scaling, and integrates safety monitoring. The MC34PF8100A0EPR2 replaces multiple discrete regulators and simplifies layout by consolidating power control into a single HVQFN56 device.
Does the MC34PF8100A0EPR2 support ASIL B functional safety compliance?
No, the MC34PF8100A0EPR2 is qualified for QM (Quality Management) grade applications only. While it includes monitoring circuits (voltage, thermal, watchdog), it lacks the ABIST on-demand, secure I²C write, fail-safe output (FSOB) assertion, and CRC-protected register mirroring required for ASIL B certification. For ASIL B, use MC34PF8200A0EPR2 instead. The MC34PF8100A0EPR2 remains suitable for industrial and consumer systems where functional safety certification is not mandated.
How does the OTP memory in the MC34PF8100A0EPR2 reduce external component count?
The OTP memory in the MC34PF8100A0EPR2 stores critical startup parameters - including output voltage setpoints, power-up/down sequencing order, soft-start timing, and regulator enable states - eliminating the need for external resistor dividers, timing capacitors, and discrete sequencers. This reduces BOM count by up to 15 passive components and removes associated layout constraints. The MC34PF8100A0EPR2 retains full I²C configurability post-boot for runtime adjustments, preserving flexibility without sacrificing integration.
Can the MC34PF8100A0EPR2 support LPDDR4 memory termination (VTT)?
Yes, the MC34PF8100A0EPR2 supports VTT termination through SW6, which can be configured in VTT mode with programmable current limit and voltage tracking. SW6 delivers 0.4 V to 1.8 V (6.25 mV steps) at up to 2.5 A, meeting JEDEC LPDDR4 VTT requirements. This capability replaces discrete VTT solutions and simplifies DDR memory power delivery. The MC34PF8100A0EPR2 also supports DDR3L and DDR4 memory rails via its other buck and LDO channels.
What thermal performance can be expected from the MC34PF8100A0EPR2 in a 4-layer PCB design?
In a standard 4-layer PCB (2s2p) with proper thermal vias to inner ground planes, the MC34PF8100A0EPR2 achieves a junction-to-ambient thermal resistance (RθJA) of 27 °C/W under natural convection. At maximum rated load (10 A total), this allows operation up to +105 °C ambient while maintaining junction temperature below 150 °C. The exposed pad (EPAD) must be soldered to ≥4 thermal vias (0.3 mm diameter) connecting to a solid ground plane for optimal performance. The MC34PF8100A0EPR2's RθJC is 0.6 °C/W, confirming efficient heat transfer from die to PCB.
MC34PF8100A0EPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC34PF8100A0EPR2 FAQ
1.How can I place an order for MC34PF8100A0EPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC34PF8100A0EPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC34PF8100A0EPR2 reliable?
The price and inventory of MC34PF8100A0EPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC34PF8100A0EPR2 is usually 5 days.
3.What payment methods are accepted for MC34PF8100A0EPR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC34PF8100A0EPR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC34PF8100A0EPR2?
MC34PF8100A0EPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC34PF8100A0EPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC34PF8100A0EPR2?
For technical support, including MC34PF8100A0EPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC34PF8100A0EPR2 requirements.
6.How does Aetrix verify that MC34PF8100A0EPR2 is sourced from the original manufacturer or authorized distributors?
All MC34PF8100A0EPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC34PF8100A0EPR2 meets industry standards.
7.What is the process for return or replacement of MC34PF8100A0EPR2?
All MC34PF8100A0EPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC34PF8100A0EPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC34PF8100A0EPR2 part is unused and in its original packaging.
Return procedure for MC34PF8100A0EPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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