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NXP Semiconductors MC34PF8100CCEP
- Part No.:
- MC34PF8100CCEP
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC34PF8100CCEP.pdf
- Description:
- IC POWER MANAGEMENT I.MX8QXP
- Quantity:
- Payment:
- Shipping:
Inventory:2,894
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Product details
Overview
MC34PF8100CCEP from NXP Semiconductors is a 12-channel industrial-grade power management IC (PMIC) designed for i.MX 8QXP processors with LPDDR4 memory. It integrates seven high-efficiency buck converters (0.4–1.8 V, 2.5 A each), four 400 mA LDOs, RTC supply (1.8/3.0/3.3 V), coin cell charger, watchdog timer, and ASIL-B-compliant monitoring circuitry. It operates from 2.7–5.5 V input and supports dynamic voltage scaling for CPU/GPU/memory rails.
For engineers reviewing the MC34PF8100CCEP datasheet, MC34PF8100CCEP pinout, MC34PF8100CCEP application, or MC34PF8100CCEP equivalent, this page delivers verified specifications, validated I²C interface behavior (3.4 MHz), confirmed HVQFN56 package mapping, OTP configuration scope, and real-world use cases in industrial embedded systems requiring robust power sequencing and thermal safety.
Technical Context
The MC34PF8100CCEP implements a deterministic state machine for startup, fault handling, and power-down sequencing-programmable via OTP and runtime-adjustable via I²C. Its 24-channel analog multiplexer enables system-level diagnostics across all regulator outputs and temperature sensors.
It features dual-phase and triple-phase buck configurations (e.g., SW1/SW2 as dual-phase; SW1/SW2/SW3 as triple-phase up to 7.5 A), VTT termination on SW6, spread-spectrum switching, and independent voltage/thermal monitoring with programmable thresholds and fault response timers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7 V to 5.5 V - supports single-rail industrial power supplies without external pre-regulation |
| Buck Regulators | 7 channels: SW1–SW6 (0.4–1.8 V, ±1.5% accuracy), SW7 (1.0–4.1 V, ±2% accuracy) - powers CPU cores, GPU, DDR I/O, and peripherals |
| LDO Regulators | 4 × 400 mA LDOs (1.5–5.0 V, ±3% accuracy) with optional load switch mode - supplies low-noise analog/IO rails and enables power gating |
| I²C Interface | Up to 3.4 MHz - enables fast register access for dynamic voltage scaling and real-time fault reporting |
| OTP Memory | One-time programmable storage for boot configuration - eliminates external resistors for voltage/sequence setup, reducing BOM count |
| Safety Monitoring | ASIL-B-compliant monitoring: independent voltage monitors, thermal shutdown (TJ = 150 °C), ABIST, and watchdog with programmable timeout - meets functional safety requirements for industrial control |
| Package | HVQFN56, 8 mm × 8 mm × 0.85 mm, 0.5 mm pitch - thermally enhanced wettable flank variant optimized for automated optical inspection and thermal dissipation |
Pinout & Package
HVQFN56 package: 8 mm × 8 mm body, 0.5 mm pitch, 0.85 mm height, thermally enhanced with exposed pad (EPAD) connected to ground. Wettable flank design supports solder joint inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck output voltage feedback | Enables precise closed-loop regulation; supports remote sensing for high-current rails |
| SW1IN–SW7IN | Buck input supply | Accepts 2.7–5.5 V input; requires local bulk capacitance per channel for transient response |
| SW1LX–SW7LX | Buck switching node | High dv/dt node; requires tight layout with minimized loop area to reduce EMI and voltage spikes |
| LDO1OUT–LDO4OUT | LDO regulated output | Delivers low-noise, fixed or programmable voltage; supports load switch mode for rail shutdown |
| VSNVS | RTC supply output | Provides 1.8/3.0/3.3 V at 10 mA from VIN or coin cell - maintains real-time clock during main power loss |
| SCL/SDA | I²C interface | 3.4 MHz high-speed bus for runtime configuration, telemetry readback, and fault logging |
| PGOOD/INTB/RESETBMCU | Power-good and interrupt signals | Open-drain outputs synchronized to regulator status - used for processor power sequencing coordination |
| EPAD | Thermal pad | Must be soldered to PCB ground plane; primary thermal path for junction-to-board conduction (RθJB = 11 °C/W) |
Key Features
| Feature | Design Value |
|---|---|
| Dual/triple/quad-phase buck configuration | SW1–SW4 configurable as up to quad-phase (10 A total) - enables high-current CPU core rails with reduced ripple and improved thermal distribution |
| VTT termination on SW6 | Supports DDR memory termination (VTT) with adjustable current sink/source - eliminates need for external termination ICs in LPDDR4 designs |
| 24-channel analog multiplexer | Monitors all regulator outputs, die temperature, and external nodes - enables system-level health diagnostics without additional ADC hardware |
| Programmable soft-start and power-down sequence | OTP-configurable timing and order - ensures safe ramp-up/ramp-down of multi-rail processors like i.MX 8QXP to prevent latch-up or data corruption |
| Coin cell charger with programmable parameters | Charges backup battery at user-defined voltage (up to 4.2 V) and current - extends RTC uptime during extended main power outages |
| Fail-safe output (FSOB) | Asserts low on critical faults (e.g., overtemperature, UVLO, watchdog timeout) - triggers system-level fail-safe action such as controlled shutdown or safe state entry |
Applications
| Industrial HMI Panel | i.MX 8QXP-Based Edge Gateway |
|---|---|
Use Scenario: Rugged touchscreen display with real-time OS, multiple Ethernet ports, and secure firmware updates. IC Role / Device Role / Timing Role: Primary PMIC managing CPU core (SW1–SW3), GPU (SW4), DDR4 I/O (SW6), LPDDR4 (SW5), RTC (VSNVS), and peripheral LDOs. Use Value: OTP-programmed boot sequence eliminates external configuration components; ASIL-B monitoring ensures reliable operation in factory-floor environments with wide temperature swings. |
Use Scenario: Secure edge computing node aggregating sensor data, running AI inference, and communicating via cellular and Wi-Fi. IC Role / Device Role / Timing Role: Central power controller coordinating i.MX 8QXP core, LPDDR4 memory, eMMC, SIM card, and RF module supplies. Use Value: 3.4 MHz I²C enables rapid DVS during workload transitions; VTT termination on SW6 simplifies DDR interface; coin cell charging preserves time-stamped logs during brownouts. |
| Medical Imaging Control Unit | Automated Test Equipment (ATE) |
Use Scenario: High-reliability control board for ultrasound or MRI subsystems requiring deterministic power-up and fault containment. IC Role / Device Role / Timing Role: Safety-critical PMIC delivering isolated, monitored rails to FPGA, ADC/DAC, and timing modules. Use Value: Independent voltage monitors and ABIST validate regulator integrity before enabling downstream logic; FSOB output interfaces directly with system safety controller. |
Use Scenario: Precision test platform with multi-voltage DUT support, thermal profiling, and long-duration burn-in cycles. IC Role / Device Role / Timing Role: Programmable power source for DUT biasing, with real-time telemetry via AMUX for correlation with test results. Use Value: 24-channel AMUX reads internal/external voltages and temperatures simultaneously; OTP stores calibration offsets for production-line efficiency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF8100FJTS | Same architecture and pinout; dimple wettable flank HVQFN56 (SOT684-29(D)); recommended for new designs per NXP documentation | Identical target: i.MX 8QXP + LPDDR4; same OTP content and feature set | Select MC34PF8100FJTS for new designs requiring enhanced manufacturability and long-term availability |
| MC33PF8100CCTS | Automotive-grade variant (AEC-Q100 qualified); identical electrical specs but ASIL-B monitoring disabled; OTP report matches MC34PF8100CCEP | Targeted at automotive infotainment; not rated for industrial temperature range (−40°C to 105°C) | Choose MC33PF8100CCTS only if automotive qualification is required and industrial temp range is unnecessary |
Compared with MC34PF8100CCEP, MC34PF8100FJTS offers superior solder joint inspection capability and longer product lifecycle assurance, while MC33PF8100CCTS trades industrial temperature support for automotive qualification-neither is pin-compatible without board revision due to differing wettable flank geometry and qualification scope.
Availability
MC34PF8100CCEP is available at Aetrix Electronics and suitable for industrial HMI panels, edge gateways, medical imaging controllers, and automated test equipment requiring stable component supply, long-term traceability, and guaranteed OTP configuration consistency.
Supply support for MC34PF8100CCEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based application processors and integrated power management.
The PF8100 product line was engineered specifically to deliver scalable, safety-aware power architectures for NXP's i.MX 8 series processors-enabling high-performance multimedia, AI acceleration, and real-time control in resource-constrained embedded systems.
FAQ
What is the operating temperature range for MC34PF8100CCEP?
The MC34PF8100CCEP is rated for industrial operation from −40 °C to +105 °C ambient temperature. Its junction temperature limit is 150 °C, and thermal design must ensure TJ remains within spec under full load-achievable using the EPAD ground connection and appropriate PCB copper area per JEDEC JESD51-2/9 guidelines. This range supports deployment in uncontrolled industrial enclosures and outdoor edge devices.
Does MC34PF8100CCEP support dynamic voltage scaling (DVS)?
Yes, MC34PF8100CCEP supports DVS on SW1 through SW6 via I²C commands. Each buck can be adjusted in 6.25 mV steps across its full output range (e.g., 0.4–1.8 V), enabling real-time adaptation to processor workload states. DVS is implemented in hardware with minimal latency and does not require OTP reprogramming-making it ideal for adaptive power management in Linux-based i.MX 8QXP systems.
How is the RTC supply (VSNVS) powered and configured on MC34PF8100CCEP?
The VSNVS rail on MC34PF8100CCEP is supplied either from VIN or a coin cell connected to LICELL, delivering 1.8 V, 3.0 V, or 3.3 V at up to 10 mA. Output voltage is selected via OTP configuration; the coin cell charger supports programmable charge voltage (up to 4.2 V) and current. This dual-source architecture ensures continuous RTC operation during main power loss, critical for timestamping and wake-on-event functionality.
Is MC34PF8100CCEP pin-compatible with MC34PF8100FJTS?
No, MC34PF8100CCEP is not pin-compatible with MC34PF8100FJTS. While both use HVQFN56 packages with identical pin count and function mapping, MC34PF8100CCEP uses step-cut wettable flanks (SOT684-21), whereas MC34PF8100FJTS uses dimple wettable flanks (SOT684-29(D)). The mechanical footprint differs, requiring PCB redesign for replacement-NXP explicitly recommends MC34PF8100FJTS for new designs due to improved manufacturability.
What safety features does MC34PF8100CCEP provide for industrial applications?
MC34PF8100CCEP includes ASIL-B-compliant monitoring: independent voltage monitors per regulator with programmable fault thresholds, thermal shutdown at 150 °C, watchdog timer with configurable timeout and failure counter, PGOOD assertion validation, and built-in self-test (ABIST) for analog monitors. These features enable functional safety compliance in industrial control systems without requiring external safety monitors-reducing system complexity and bill-of-materials cost.
MC34PF8100CCEP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-HVQFN (8x8)
MC34PF8100CCEP FAQ
1.How can I place an order for MC34PF8100CCEP through Aetrix?
Please submit a Request for Quotation (RFQ) for MC34PF8100CCEP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC34PF8100CCEP reliable?
The price and inventory of MC34PF8100CCEP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC34PF8100CCEP is usually 5 days.
3.What payment methods are accepted for MC34PF8100CCEP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC34PF8100CCEP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC34PF8100CCEP?
MC34PF8100CCEP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC34PF8100CCEP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC34PF8100CCEP?
For technical support, including MC34PF8100CCEP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC34PF8100CCEP requirements.
6.How does Aetrix verify that MC34PF8100CCEP is sourced from the original manufacturer or authorized distributors?
All MC34PF8100CCEP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC34PF8100CCEP meets industry standards.
7.What is the process for return or replacement of MC34PF8100CCEP?
All MC34PF8100CCEP units undergo pre-shipment inspection (PSI). If there is an issue with MC34PF8100CCEP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC34PF8100CCEP part is unused and in its original packaging.
Return procedure for MC34PF8100CCEP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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