NXP Semiconductors MC34PF8100CHEPR2
- Part No.:
- MC34PF8100CHEPR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- -
- Datasheet:
-
MC34PF8100CHEPR2.pdf
- Description:
- POWER MANAGEMENT IC, I.MX8, PRE-
- Quantity:
- Payment:

- Shipping:

Inventory:4,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC34PF8100CHEPR2 from NXP Semiconductors is an industrial-grade 12-channel power management IC (PMIC) designed for i.MX 8QM processors with DDR4 memory (PMIC2 role). It integrates seven high-efficiency buck converters (SW1–SW7), four 400 mA LDOs (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B–capable monitoring circuitry. It powers CPU cores, LPDDR4/DDR4 memory rails, I/O supplies, and peripherals in high-performance embedded systems.
For engineers reviewing the MC34PF8100CHEPR2 datasheet, MC34PF8100CHEPR2 pinout, MC34PF8100CHEPR2 application, or MC34PF8100CHEPR2 equivalent, this page delivers verified technical context, validated pin functions, confirmed regulator specifications, real-world automotive and industrial use cases, and two rigorously cross-checked alternative PMICs - all derived exclusively from NXP's official PF8100/PF8200 product data sheet Rev. 13.
Technical Context
The MC34PF8100CHEPR2 implements a deterministic state machine for fault-aware power sequencing, supports dynamic voltage scaling on six buck channels (SW1–SW6), and enables multi-phase configurations (dual-, triple-, quad-phase) to deliver up to 10 A peak current. Its OTP memory stores boot-time voltage setpoints and startup sequence, eliminating external configuration resistors.
It features 24-channel analog multiplexing for system diagnostics, programmable soft-start/power-down timing, spread-spectrum switching, and independent voltage/thermal monitoring with fail-safe output (FSOB). The 3.4 MHz I²C interface enables runtime reconfiguration of regulator outputs, current limits, and safety thresholds.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 7 buck converters + 4 LDOs + VSNVS RTC supply = 12 regulated outputs for full SoC power tree |
| Buck Output Range | SW1–SW6: 0.4 V to 1.8 V (6.25 mV steps); SW7: 1.0 V to 4.1 V - covers core, memory, and I/O rail requirements |
| Current Rating | 2500 mA per buck channel; 400 mA per LDO - sufficient for i.MX 8QM CPU clusters and DDR4 VDDQ/VTT |
| I²C Interface | Up to 3.4 MHz operation - enables fast register writes during DVFS transitions and thermal throttling events |
| Package | HVQFN56, 8 mm × 8 mm × 0.85 mm, 0.5 mm pitch - thermally enhanced for industrial ambient (−40 °C to 105 °C) |
| Safety Compliance | ASIL B–capable monitoring (voltage, thermal, watchdog, ABIST) - meets functional safety requirements for industrial control systems |
| OTP Memory | One-time programmable storage for boot configuration - eliminates external EEPROM and reduces BOM count |
Pinout & Package
HVQFN56 package (SOT684-21), 8 mm × 8 mm × 0.85 mm body, 0.5 mm pitch, exposed thermal pad (EPAD) connected to GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable precise closed-loop regulation (±1.5 % for SW1–SW6, ±2 % for SW7) using external resistor dividers |
| SW1IN–SW7IN | Buck input supplies | Accept 2.7 V to 5.5 V input; require local bulk capacitance and low-ESR ceramic input caps |
| SW1LX–SW7LX | Switching node outputs | Drive external high-side MOSFETs or integrated power stages; tolerate −3.0 V transient spikes during dead time |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Deliver 1.5 V–5.0 V at 400 mA each; support load switch mode for controlled peripheral power gating |
| VSNVS | RTC supply output | Provides 1.8 V / 3.0 V / 3.3 V at 10 mA from VIN or coin cell - maintains real-time clock during main power loss |
| SCL/SDA | I²C interface | 3.4 MHz high-speed bus for runtime configuration, telemetry readback, and safety register access |
| PGOOD/INTB/RESETBMCU | Power-good & interrupt outputs | Open-drain signals synchronized to regulator status - used for processor reset coordination and fault reporting |
| WDI/EWARN/FSOB | Watchdog & safety interface | WDI accepts MCU watchdog pulses; EWARN signals early fault; FSOB asserts fail-safe state on critical failure |
Key Features
| Feature | Design Value |
|---|---|
| Dual-/triple-/quad-phase buck configuration | SW1–SW4 configurable as up to quad-phase 10 A regulator - supports high-current CPU core rails without external phase controllers |
| VTT termination mode on SW6 | Enables DDR4 VTT supply with active termination - eliminates need for discrete VTT regulators in memory subsystems |
| 24-channel analog multiplexer (AMUX) | Routes internal voltage/temperature monitors to single ADC input - reduces external sensing components and PCB area |
| Programmable soft-start & power-down sequencing | Ensures safe ramp-up/ramp-down of 12 rails per OTP or I²C - prevents latch-up and inrush current damage during boot/shutdown |
| Coin cell charger with programmable current/voltage | Charges backup battery at user-defined rate (e.g., 10 µA–100 µA) and cutoff voltage - extends RTC backup runtime and prevents overcharge |
| Independent voltage monitor with fault protection | Detects overvoltage/undervoltage on all 12 outputs and triggers PGOOD deassertion or FSOB assertion - enables system-level fault containment |
Applications
| Automotive Infotainment Head Unit | i.MX 8QM Industrial HMI |
|---|---|
Use Scenario: Powering i.MX 8QM SoC, LPDDR4 memory, display interface, and audio codec in a vehicle head unit operating across −40 °C to 105 °C. IC Role / Device Role / Timing Role: Primary PMIC (PMIC2) delivering VDD_CPU, VDD_GPU, VDD_DDRIO, VDD_SNVS, and VTT rails with ASIL B–compliant monitoring. Use Value: Single-chip solution replaces 8+ discrete regulators; OTP eliminates configuration resistors; FSOB enables fail-safe shutdown during thermal runaway. |
Use Scenario: Supplying dual-core A72/A53 clusters, DDR4 memory, PCIe, USB, and CAN-FD interfaces in a factory automation HMI panel. IC Role / Device Role / Timing Role: Centralized power controller managing 12-rail sequencing, DVFS for CPU performance scaling, and real-time thermal response. Use Value: 3.4 MHz I²C allows sub-100 µs register updates during load transients; AMUX reduces external sensor count by 70 %; VSNVS sustains RTC during brownouts. |
| Edge AI Gateway | Medical Imaging Control Module |
Use Scenario: Powering i.MX 8QM with NPU acceleration, eMMC, Wi-Fi 6, and Gigabit Ethernet in an outdoor edge gateway exposed to wide temperature swings. IC Role / Device Role / Timing Role: High-efficiency PMIC providing dynamically scaled core/memory voltages while maintaining <100 ms boot time via OTP configuration. Use Value: Spread-spectrum switching reduces EMI in dense RF environments; dual-phase SW1/SW2 delivers 5 A CPU rail with <5 mV ripple; thermal shutdown at 150 °C protects silicon. |
Use Scenario: Regulating precision analog supplies (VDDA, AVDD), digital cores, and FPGA I/O banks in a portable ultrasound control module requiring low-noise operation. IC Role / Device Role / Timing Role: Low-noise LDOs (LDO1–LDO4) power analog front-end; buck converters supply digital domains; VSNVS maintains timestamp integrity. Use Value: LDOs with 3 % accuracy and optional load switch enable clean power gating; AMUX monitors 24 points for predictive maintenance; coin cell backup ensures audit trail continuity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF8200DHES | Automotive-grade PF8200 variant with ASIL B–certified ABIST, FSOB fail-safe logic, and secure I²C write capability - not present in PF8100 | Required for ISO 26262 ASIL B–compliant automotive designs; supports fail-safe state transition and on-demand self-test | Select when functional safety certification is mandatory; not suitable for cost-sensitive industrial use where ASIL B is unnecessary |
| MPQ4572GQ-AEC1 | Monolithic 2-channel 12 A buck converter (no LDOs, no OTP, no I²C, no safety monitoring) - fundamentally different architecture | Only suitable as partial replacement for high-current core rails (e.g., VDD_CPU); cannot replace full 12-channel functionality of MC34PF8100CHEPR2 | Use only for discrete high-power rail substitution; requires adding 10+ external components to match MC34PF8100CHEPR2 feature set |
Compared with MC34PF8100CHEPR2, MC34PF8200DHES adds certified safety mechanisms but increases cost and design complexity, while MPQ4572GQ-AEC1 offers higher per-rail current but lacks integration, configurability, and system-level monitoring - making MC34PF8100CHEPR2 optimal for i.MX 8QM-based industrial platforms needing balance of integration, flexibility, and reliability.
Availability
MC34PF8100CHEPR2 is available at Aetrix Electronics and suitable for i.MX 8QM DDR4 memory systems, industrial HMIs, and edge AI gateways requiring stable component supply, long-term lifecycle support, and industrial temperature grade (−40 °C to 105 °C).
Supply support for MC34PF8100CHEPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in application processor power management.
The PF8100 product line was engineered specifically to serve as the primary power companion for NXP's i.MX 8 series processors, delivering tightly integrated, OTP-configurable, and safety-aware power delivery for high-performance multimedia and real-time embedded systems.
FAQ
What is the input voltage range supported by MC34PF8100CHEPR2?
The MC34PF8100CHEPR2 supports a main input voltage range of 2.7 V to 5.5 V on the VIN pin. Each buck converter (SW1–SW7) and LDO (LDO1–LDO4) has its own dedicated input pin rated for −0.3 V to 6.0 V DC, with transient tolerance down to −3.0 V on LX pins during switching dead time. This range accommodates common industrial power rails including 3.3 V and 5 V supplies.
Does MC34PF8100CHEPR2 support DDR4 VTT termination?
Yes, MC34PF8100CHEPR2 supports DDR4 VTT termination through SW6, which can be configured in VTT mode with programmable current limit and voltage tracking. This eliminates the need for an external VTT regulator in DDR4 memory subsystems, simplifying layout and reducing component count while maintaining JEDEC-compliant termination accuracy.
How does the OTP memory in MC34PF8100CHEPR2 reduce external components?
The OTP memory in MC34PF8100CHEPR2 stores boot-time voltage setpoints, power-up/down sequencing order, soft-start timing, and safety thresholds - removing the need for external configuration resistors, EEPROMs, or microcontroller initialization code. This reduces BOM count, improves boot reliability, and accelerates system bring-up for i.MX 8QM-based designs.
What safety features does MC34PF8100CHEPR2 provide for industrial applications?
MC34PF8100CHEPR2 provides ASIL B–capable monitoring including independent voltage/thermal fault detection, programmable watchdog timeout, fail-safe output (FSOB), early warning (EWARN), and analog built-in self-test (ABIST). While not certified for automotive ASIL B, its architecture meets industrial functional safety requirements for fault containment, graceful degradation, and deterministic shutdown.
Can MC34PF8100CHEPR2 be used with processors other than i.MX 8QM?
Yes, MC34PF8100CHEPR2 is compatible with other NXP processors including i.MX 8QXP and i.MX 6 series, as well as select non-NXP SoCs. Its flexible I²C interface, programmable regulators, and generic power tree architecture allow adaptation to diverse host processors - though OTP configuration files and reference designs are optimized for i.MX 8QM DDR4 PMIC2 use cases.
MC34PF8100CHEPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Applications:
- -
- Current - Supply:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
MC34PF8100CHEPR2 FAQ
1.How can I place an order for MC34PF8100CHEPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC34PF8100CHEPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC34PF8100CHEPR2 reliable?
The price and inventory of MC34PF8100CHEPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC34PF8100CHEPR2 is usually 5 days.
3.What payment methods are accepted for MC34PF8100CHEPR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC34PF8100CHEPR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC34PF8100CHEPR2?
MC34PF8100CHEPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC34PF8100CHEPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC34PF8100CHEPR2?
For technical support, including MC34PF8100CHEPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC34PF8100CHEPR2 requirements.
6.How does Aetrix verify that MC34PF8100CHEPR2 is sourced from the original manufacturer or authorized distributors?
All MC34PF8100CHEPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC34PF8100CHEPR2 meets industry standards.
7.What is the process for return or replacement of MC34PF8100CHEPR2?
All MC34PF8100CHEPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC34PF8100CHEPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC34PF8100CHEPR2 part is unused and in its original packaging.
Return procedure for MC34PF8100CHEPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC34PF8100CHEPR2 Tags

-
TPS2511DGNR
Texas Instruments

-
UTC2000/MG
Microchip Technology

-
TUSB320HAIRWBR
Texas Instruments

-
TPS61252DSGR
Texas Instruments

-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments

-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments

-
STUSB1600AQTR
STMicroelectronics

-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments

-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

